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1. 发明授权

US5931725A Wafer polishing machine 失效
标题翻译：晶圆抛光机
公开(公告)号：US5931725A
公开(公告)日：1999-08-03
申请号：US899759
申请日：1997-07-24
申请人： Takao Inaba , Masaaki Oguri , Kenji Sakai , Minoru Numoto , Hisashi Terashita
发明人： Takao Inaba , Masaaki Oguri , Kenji Sakai , Minoru Numoto , Hisashi Terashita
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , B24B53/00 , B24B53/017 , B24B57/02 , H01L21/304 , H01L21/306 , B24B7/22
CPC分类号： B24B53/017 , B24B37/04 , B24B57/02 , H01L21/30625
摘要： A semiconductor wafer is held by a wafer mount plate, which is loosely inserted into a housing. An air chamber is formed between the wafer mount plate and the housing. A retainer ring encloses the semiconductor wafer, and the semiconductor wafer as well as the retainer ring contacts with a polishing pad. An roughness is formed at the bottom of the retainer ring so as to dress the polishing pad. Polishing liquid is supplied to the inside of the retainer ring. Thus, the polishing pressure can be uniformly applied and the polishing liquid can be uniformly supplied on the whole surface of the semiconductor wafer, and the polishing for the semiconductor wafer and the dressing for the polishing pad can be performed at the same time.
摘要翻译：半导体晶片由松散地插入壳体中的晶片安装板保持。在晶片安装板和壳体之间形成空气室。保持环围绕半导体晶片，并且半导体晶片以及保持环与抛光垫接触。在保持环的底部形成粗糙度，以便打磨抛光垫。抛光液被供应到保持环的内部。因此，可以均匀地施加抛光压力，并且可以在半导体晶片的整个表面上均匀地供应抛光液，并且可以同时执行用于半导体晶片的抛光和抛光垫的修整。

2. 发明授权

US5876272A Semiconductor wafer polishing machine 失效
标题翻译：半导体晶圆抛光机
公开(公告)号：US5876272A
公开(公告)日：1999-03-02
申请号：US885870
申请日：1997-06-30
申请人： Takao Inaba , Masaaki Oguri , Kenji Sakai
发明人： Takao Inaba , Masaaki Oguri , Kenji Sakai
IPC分类号： B24B1/00 , B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304 , B24B5/00 , B24B29/00
CPC分类号： H01L21/02024 , B24B37/30
摘要： A wafer mount plate is inserted loosely into a housing, and the wafer mount plate is supported in such a manner as to be swingable and movable vertically and horizontally with respect to a polishing pad. An air chamber is formed between the wafer mount plate and the housing. By controlling the internal pressure of the air chamber, it is possible to control polishing pressure applied on the wafer mount plate. Since the entire top side of the wafer mount plate can be uniformly pressured, the uniform polishing pressure can be applied on the entire surface of the semiconductor wafer. Further, the wafer mount plate inclines in accordance with variations in the inclination of the polishing pad so that the semiconductor wafer and the polishing pad can be maintained in a parallel position.
摘要翻译：晶片安装板松散地插入壳体中，并且晶片安装板以相对于抛光垫可摆动和垂直和水平移动的方式被支撑。在晶片安装板和壳体之间形成空气室。通过控制空气室的内部压力，可以控制施加在晶片安装板上的抛光压力。由于晶片安装板的整个顶侧能够被均匀地加压，所以可以在半导体晶片的整个表面上施加均匀的抛光压力。此外，晶片安装板根据抛光垫的倾斜度的变化而倾斜，使得半导体晶片和抛光垫可以保持在平行位置。

3. 发明申请

US20050253592A1 Digital measuring head 有权
标题翻译：数字测头
公开(公告)号：US20050253592A1
公开(公告)日：2005-11-17
申请号：US11187925
申请日：2005-07-25
申请人： Masaaki Oguri
发明人： Masaaki Oguri
IPC分类号： G01B5/00 , G01B5/28 , G01B7/28 , G01B21/00 , G01D5/38 , G01R31/11
CPC分类号： G01D5/38 , G01B5/28
摘要： A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a tip end portion of the arm; and a scale and a read head, one of which is provided at a rear end portion of the arm and the other of which is arranged on the base. Displacement of the contact element which contacts with the work is measured with the scale and the read head. Thereby, the measuring head can perform measurement in a wide range and becomes excellent in the actuation property and the temperature property, and masters for calibration of an indicated dimension are only used at an initial adjustment time.
摘要翻译：测量装置中的数字测量头通过使接触元件靠近工件来测量作业。该数字测量头包括一个臂，可旋转地围绕布置在基座上的支撑点支撑; 手指，其具有在顶端处的接触元件并且安装到臂的尖端部分; 以及刻度盘和读头，其中一个设置在臂的后端部分，另一个设置在基座上。用刻度和读取头测量与工件接触的接触元件的位移。因此，测量头可以在宽范围内进行测量，并且在致动特性和温度特性方面优异，并且仅在初始调节时间使用指示尺寸的校准。

4. 发明授权

US07117110B2 Measuring method and measuring apparatus 失效
标题翻译：测量方法和测量仪器
公开(公告)号：US07117110B2
公开(公告)日：2006-10-03
申请号：US10902838
申请日：2004-08-02
申请人： Nozomi Takai , Masaaki Oguri
发明人： Nozomi Takai , Masaaki Oguri
IPC分类号： G01D18/00
CPC分类号： G01B21/045 , G01B21/10
摘要： In a measuring apparatus, a plurality of design values in design values substituted in the correction computation equations for correcting a geometrical measurement error inherent in the measuring apparatus are set as variables, the variables are optimized by a numerical solution to obtain optimized correction computation equations. A measured value is computed by using the optimized correction computation equations obtained. For optimization of the variables, a master work is measured and the variables are adjusted so that a measurement error is minimized.
摘要翻译：在测量装置中，将用于校正测量装置中固有的几何测量误差的校正计算方程式中的设计值中的多个设计值设置为变量，通过数值解来优化变量以获得优化的校正计算方程。通过使用获得的优化校正计算公式计算测量值。为了优化变量，测量主工作，调整变量，使测量误差最小化。

5. 发明申请

US20050033551A1 Measuring method and measuring apparatus 失效
标题翻译：测量方法和测量仪器
公开(公告)号：US20050033551A1
公开(公告)日：2005-02-10
申请号：US10902838
申请日：2004-08-02
申请人： Nozomi Takai , Masaaki Oguri
发明人： Nozomi Takai , Masaaki Oguri
IPC分类号： G01B5/02 , G01B21/02 , G01B21/04 , G01B21/10 , G06F19/00
CPC分类号： G01B21/045 , G01B21/10
摘要： In a measuring apparatus, a plurality of design values in design values substituted in the correction computation equations for correcting a geometrical measurement error inherent in the measuring apparatus are set as variables, the variables are optimized by a numerical solution to obtain optimized correction computation equations. A measured value is computed by using the optimized correction computation equations obtained. For optimization of the variables, a master work is measured and the variables are adjusted so that a measurement error is minimized.
摘要翻译：在测量装置中，将用于校正测量装置中固有的几何测量误差的校正计算方程式中的设计值中的多个设计值设置为变量，通过数值解来优化变量以获得优化的校正计算方程。通过使用获得的优化校正计算公式计算测量值。为了优化变量，测量主工作，调整变量，使测量误差最小化。

6. 发明授权

US06987388B2 Digital measuring head 有权
标题翻译：数字测头
公开(公告)号：US06987388B2
公开(公告)日：2006-01-17
申请号：US10635681
申请日：2003-08-07
申请人： Masaaki Oguri
发明人： Masaaki Oguri
IPC分类号： G01R31/11
CPC分类号： G01D5/38 , G01B5/28
摘要： A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a tip end portion of the arm; and a scale and a read head, one of which is provided at a rear end portion of the arm and the other of which is arranged on the base. Displacement of the contact element which contacts with the work is measured with the scale and the read head. Thereby, the measuring head can perform measurement in a wide range and becomes excellent in the actuation property and the temperature property, and masters for calibration of an indicated dimension are only used at an initial adjustment time.
摘要翻译：测量装置中的数字测量头通过使接触元件靠近工件来测量作业。该数字测量头包括一个臂，可旋转地围绕布置在基座上的支撑点支撑; 手指，其具有在顶端处的接触元件并且安装到臂的尖端部分; 以及刻度盘和读头，其中一个设置在臂的后端部分，另一个设置在基座上。用刻度和读取头测量与工件接触的接触元件的位移。因此，测量头可以在宽范围内进行测量，并且在致动特性和温度特性方面优异，并且仅在初始调节时间使用指示尺寸的校准。

7. 发明授权

US07098668B2 Digital measuring head 有权
公开(公告)号：US07098668B2
公开(公告)日：2006-08-29
申请号：US11187925
申请日：2005-07-25
申请人： Masaaki Oguri
发明人： Masaaki Oguri
IPC分类号： G01R31/11
CPC分类号： G01D5/38 , G01B5/28
摘要： A digital measuring head in a measuring apparatus measures a work by making a contact element abut to the work. The digital measuring head includes an arm supported rotatably around a support point arranged on a base; a finger having the contact element at a tip end and mounted to a tip end portion of the arm; and a scale and a read head, one of which is provided at a rear end portion of the arm and the other of which is arranged on the base. Displacement of the contact element which contacts with the work is measured with the scale and the read head. Thereby, the measuring head can perform measurement in a wide range and becomes excellent in the actuation property and the temperature property, and masters for calibration of an indicated dimension are only used at an initial adjustment time.

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