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    • 6. 发明申请
    • Ultrasonic treatment equipment
    • 超声波处理设备
    • US20070161897A1
    • 2007-07-12
    • US10557237
    • 2004-05-18
    • Kazuaki SasakiTakashi AzumaKen-ichi KawabataShin-ichiro UmemuraTakashi OkaiTetsuya Ishikawa
    • Kazuaki SasakiTakashi AzumaKen-ichi KawabataShin-ichiro UmemuraTakashi OkaiTetsuya Ishikawa
    • A61B8/00
    • A61N7/02A61B8/06A61B8/13A61B2090/378
    • Ultrasonic treatment equipment is provided which repeats therapeutic ultrasound exposure while measuring a degree of vessel constriction on a therapeutic ultrasound exposure basis. This equipment includes: a therapeutic ultrasonic transducer 2 which exposes a blood vessel of an affected part to a focused therapeutic ultrasonic wave for a specified period of exposure time; an imaging ultrasonic probe 3 which images an ultrasound tomographic image of the affected part; a display unit 24 which displays the ultrasound tomographic image; means 21 for detecting a blood flow signal from a signal received by the imaging ultrasonic probe and determining the blood flow velocity of the blood vessels of the affected part; means 21 for calculating a rate of change in blood flow velocity during the exposure to the therapeutic ultrasonic wave or before and after the exposure to the therapeutic ultrasonic wave; and means 23 for controlling exposure conditions of the therapeutic ultrasonic wave on the basis of the rate of change in blood flow velocity, and thereby controlling the therapeutic ultrasonic transducer.
    • 提供超声波处理设备,其在治疗超声暴露基础上测量血管收缩程度时重复治疗性超声波暴露。 该设备包括:治疗超声波换能器2,其将受影响部分的血管暴露于聚焦的治疗超声波达指定的曝光时间; 成像超声波探头3,其对受影响部分的超声断层图像进行成像; 显示单元24,其显示超声断层图像; 用于从由成像超声波探头接收的信号中检测血流信号并确定受影响部分的血管的血流速度的装置21; 用于计算暴露于治疗超声波期间或暴露于治疗超声波之前和之后的血流速度变化率的装置21; 以及基于血流速度变化率来控制治疗超声波的暴露条件的装置23,由此控制治疗用超声波换能器。
    • 8. 发明授权
    • Semiconductor light-emitting device and method for manufacturing thereof
    • 半导体发光装置及其制造方法
    • US06849473B2
    • 2005-02-01
    • US10253609
    • 2002-09-25
    • Kazuaki SasakiJunichi NakamuraShouichi Ohyama
    • Kazuaki SasakiJunichi NakamuraShouichi Ohyama
    • H01L33/14H01L33/30H01L33/38H01L21/00
    • H01L33/145H01L33/14H01L33/30
    • In a semiconductor light-emitting device, on an n-GaAs substrate are stacked an n-GaAs buffer layer, an n-cladding layer, an undoped active layer, a p-cladding layer, a p-intermediate band gap layer and a p-current diffusion layer. Further, a first electrode is formed under the n-GaAs substrate, and a second electrode is formed on the grown-layer side. In this process, a region of the p-intermediate band gap layer just under the second electrode is removed, the p-current diffusion layer is stacked in the removal region on the p-cladding layer, and a junction plane of the p-current diffusion layer and the p-cladding layer becomes high in resistance due to an energy band structure of type II. This semiconductor light-emitting device is capable of reducing ineffective currents with a simple construction and taking out light effectively to outside, thus enhancing the emission intensity.
    • 在半导体发光器件中,在n-GaAs衬底上堆叠n-GaAs缓冲层,n包层,未掺杂有源层,p包层,p中间带隙层和p 电流扩散层。 此外,在n-GaAs衬底下形成第一电极,在生长层侧形成第二电极。 在该工序中,除去刚好在第二电极正下方的p中间带隙层的区域,p电流扩散层层叠在p包覆层的去除区域中,p电流的结面 由于II型能带结构,扩散层和p型包层的电阻变高。 该半导体发光装置能够以简单的结构减少无效电流,并且有效地将光量外部引出,从而提高发光强度。
    • 9. 发明授权
    • Semiconductor light emitting device with high yield and low power consumption
    • 半导体发光器件,产量高,功耗低
    • US06399965B2
    • 2002-06-04
    • US09757689
    • 2001-01-11
    • Junichi NakamuraKazuaki SasakiShouichi Ohyama
    • Junichi NakamuraKazuaki SasakiShouichi Ohyama
    • H01L3300
    • H01L33/12H01L33/02
    • There is provided a semiconductor light emitting device having improved adhesion of an electrode by reducing defects in a crystal surface. An n-type AlGaInP lower clad layer 12, an AlGaInP active layer 13, a p-type AlGaInP upper clad layer 14, a p-type AlGaInP intermediate layer 15 whose lattice matching rate &Dgr;a/a with GaAs is −3.3%, a p-type AlGaInP current diffusion layer 16 and a p-type electrode 17 are laminated on an n-type GaAs substrate 11 and an n-type electrode 18 is provided on the n-type GaAs substrate 11. Thus, the number of crystal defects in the crystal surface can be reduced to 20 or less per one LED by setting the value of the lattice matching rate &Dgr;a/a of the intermediate layer 15 to be −3.3%, which is lower than −2.5%. As a result, adhesion of the p-type electrode 17 formed on the current diffusion layer 16 is improved and thereby the yield of LED can be enhanced.
    • 通过减少晶体表面的缺陷,提供了具有改善的电极附着力的半导体发光器件。 n型AlGaInP下包层12,AlGaInP有源层13,p型AlGaInP上覆层14,与GaAs的晶格匹配率DELTAa / a为-3.3%的p型AlGaInP中间层15,p 型AlGaInP电流扩散层16和p型电极17层叠在n型GaAs衬底11上,并且n型电极18设置在n型GaAs衬底11上。因此,晶体缺陷的数量 通过将中间层15的晶格匹配率DELTAa / a的值设定为-3.3%,低于-2.5%,每个LED的晶体面可以减少到20以下。 结果,形成在电流扩散层16上的p型电极17的粘附性提高,从而可以提高LED的产量。