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    • 5. 发明专利
    • II-III-N and II-N semiconductor nanoparticles, comprising the Group II elements Zinc (Zn) or Magensium (Mg)
    • GB2482311A
    • 2012-02-01
    • GB201012644
    • 2010-07-28
    • SHARP KK
    • TAYLOR PETER NEILHEFFERNAN JONATHANHOOPER STEWART EDWARDSMEETON TIM MICHAEL
    • H01L33/32H01L31/18H01L33/26
    • The present application provides nitride semiconductor nanoparticles, for example nanocrystals, made from a compound semiconductor family of the type group II-Ill-N or II-N, for example ZnGaN, ZnInN, ZnInGaN, ZnAIN, ZnAIGaN, ZnAIInN,, ZnAIGaInN or MgInN. The invention also discloses II-N semiconductor nanocrystals, for example ZnN nanocrystals, which are a subgroup of the group II-III-N semiconductor nanocrystals. The composition and size of the II-III-N compound semiconductor nanocrystals can be controlled in order to tailor their band-gap and light emission properties. For example figure 4 (shown) gives the measured photoluminescence emission spectroscopic output for ZnInN semiconductor nanocrystals, in which the reacton time is controlled. The effect of the reaction time is to lower the peak wavelength of photoluminescence intensity. Efficient light emission in the ultraviolet-visible-infrared wavelength range is demonstrated, with reported photoluminescence quantum yields in the range 10% to greater than 50%. A method is also included whereby the semiconductor nanoparticles are produced by reacting at least a source of a group II element, at least a source of a source of a group III element and at least a source of nitrogen. For example ZnInN is formed by heating at 250deg C Indium iodide, sodium amide, hexadecane thiol, zinc stearate and diphenyl ether for up to an hour. The products of this invention are useful as constituents of optoelectronic devices such as solar cells, light emitting diodes, laser diodes and as a light emitting phosphor material for LEDs and emissive EL displays.
    • 6. 发明专利
    • A Semiconductor Device and a Method of Manufacture Thereof
    • GB2451884A
    • 2009-02-18
    • GB0715993
    • 2007-08-16
    • SHARP KK
    • SMEETON TIM MICHAELSMITH KATHERINE LOUISE
    • H01L21/20H01L29/12H01L31/0352H01L33/06H01S5/34
    • A method of manufacturing a semiconductor device comprises depositing a semiconductor layer over a semiconductor surface (1). The semiconductor surface has at least one first region (2) having a first value of average surface lattice parameter and at least one second region (3) having a second value of average surface lattice parameter different from the first value. The semiconductor layer is deposited to a thickness such that self-organised islands (6,7) form over both the at least one first region (2) and the at least one second region (3). The difference in the average surface lattice parameter between the two regions means that the self-organised islands over the first region have a first average value of a parameter (such as height, width, shape, etc.) and the self-organised islands over the second region have a second average value of the parameter different from the first value. A capping layer (8) is then deposited over the self-organised islands (6,7). The capping layer (8) has a greater forbidden bandgap than the self-organised islands whereby the self-organised islands form quantum dots. The quantum dots over the first region have different properties, for example different optical properties, from the quantum dots over the second region as a consequence of the difference(s) between the self-organised islands over the first region and the self-organised islands over the second region. The device can be a light-emitting, a light-sensitive or a memory device.
    • 7. 发明专利
    • A method of reducing the density of threading dislocations in light emitting devices, by the selective creation of cavities
    • GB2483689A
    • 2012-03-21
    • GB201015518
    • 2010-09-16
    • SHARP KK
    • SMEETON TIM MICHAELSENES MATHIEU XAVIERTAN WEI-SINBERRYMAN-BOUSQUET VALERIE
    • H01L33/02H01L33/00
    • A semiconductor light-emitting device comprises a substrate 101 and a semiconductor layer structure disposed over the substrate. The device particularly relates to Nitride based LEDâ s or lasers, in particular (Al,In,Ga)N deposited on sapphire, silicon, silicon carbide or GaN substrates. The layer structure includes a first layer 102 disposed over the substrate, a second layer 105, and an active region 104 for light emission disposed between the first layer 102 and the second layer 105. One or more cavities 108 are present in the layer structure, each cavity coincident with a respective threading dislocation 103 of at least a first type that extends generally through the layer structure, and a cavity extending from an upper surface of the layer structure through at least the second layer 105 and the active region 104. By removing material at the location of a dislocation, the invention provides effective suppression of the tendency of the threading dislocations to act as non-radiative centers, which improves the light output efficiency. The device may be manufactured by a two-stage method that has a first etching step of selectively etching the layer structure at one or more locations at which a respective threading dislocation is present thereby to form a pilot cavity at the or each location. A second etching step is applied to increase the depth of the or each pilot cavity to produce a respective cavity 108 that extends at least through the second layer 105 and the active region 104.