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1. 发明申请

US20130271754A1 INSPECTION APPARATUS 有权
标题翻译：检查装置
公开(公告)号：US20130271754A1
公开(公告)日：2013-10-17
申请号：US13993814
申请日：2011-11-09
申请人： Nobuaki Hirose , Takahiro Jingu , Hidetoshi Nishiyama , Kazuo Takahashi , Hisashi Hatano
发明人： Nobuaki Hirose , Takahiro Jingu , Hidetoshi Nishiyama , Kazuo Takahashi , Hisashi Hatano
IPC分类号： G01N21/95
CPC分类号： G01N21/9501 , G01N21/95623
摘要： This invention implements reduction in the amount of background-scattered light from a semiconductor wafer surface and highly sensitive inspection, without increasing the number of detectors. A surface inspection apparatus that detects defects on the surface of an object (semiconductor wafer surface) to be inspected, by irradiating the surface of the object with a beam of light such as laser light and detecting the light reflected or scattered from the surface; wherein a widely apertured lens with an optical Fourier transform function is disposed between the object to be inspected and a detector, a filter variable in position as well in aperture diameter is provided on a Fourier transform plane, and background-scattered light from the semiconductor wafer surface is effectively blocked, whereby only a signal from a defect such as a foreign substance is detected.
摘要翻译：本发明实现了半导体晶片表面的背景散射光的量的减少和高灵敏度的检查，而不增加检测器的数量。一种表面检查装置，其通过用诸如激光的光束照射物体的表面来检测从表面反射或散射的光来检测待检查的物体（半导体晶片表面）的表面上的缺陷; 其中具有光学傅里叶变换功能的广泛有孔的透镜设置在待检查对象与检测器之间，在傅里叶变换平面上设置了孔径直径可变的滤光器以及来自半导体晶片的背景散射光表面被有效地阻挡，从而仅检测到诸如异物的缺陷的信号。

2. 发明授权

US08902417B2 Inspection apparatus 有权
标题翻译：检验仪器
公开(公告)号：US08902417B2
公开(公告)日：2014-12-02
申请号：US13993814
申请日：2011-11-09
申请人： Nobuaki Hirose , Takahiro Jingu , Hidetoshi Nishiyama , Kazuo Takahashi , Hisashi Hatano
发明人： Nobuaki Hirose , Takahiro Jingu , Hidetoshi Nishiyama , Kazuo Takahashi , Hisashi Hatano
IPC分类号： G01N21/00 , G01N21/956 , G01N21/95
CPC分类号： G01N21/9501 , G01N21/95623
摘要： This invention implements reduction in the amount of background-scattered light from a semiconductor wafer surface and highly sensitive inspection, without increasing the number of detectors. A surface inspection apparatus that detects defects on the surface of an object (semiconductor wafer surface) to be inspected, by irradiating the surface of the object with a beam of light such as laser light and detecting the light reflected or scattered from the surface; wherein a widely apertured lens with an optical Fourier transform function is disposed between the object to be inspected and a detector, a filter variable in position as well in aperture diameter is provided on a Fourier transform plane, and background-scattered light from the semiconductor wafer surface is effectively blocked, whereby only a signal from a defect such as a foreign substance is detected.
摘要翻译：本发明实现了半导体晶片表面的背景散射光的量的减少和高灵敏度的检查，而不增加检测器的数量。一种表面检查装置，其通过用诸如激光的光束照射物体的表面来检测从表面反射或散射的光来检测待检查的物体（半导体晶片表面）的表面上的缺陷; 其中具有光学傅里叶变换功能的广泛有孔的透镜设置在待检查对象与检测器之间，在傅里叶变换平面上设置了孔径直径可变的滤光器以及来自半导体晶片的背景散射光表面被有效地阻挡，从而仅检测到诸如异物的缺陷的信号。

3. 发明授权

US08563958B2 Inspection apparatus and inspection method 有权
标题翻译：检验仪器和检验方法
公开(公告)号：US08563958B2
公开(公告)日：2013-10-22
申请号：US13328768
申请日：2011-12-16
申请人： Kazuo Takahashi , Takahiro Jingu
发明人： Kazuo Takahashi , Takahiro Jingu
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N2021/8896 , G01N2021/8928
摘要： Reflected light caused by the state of the surface of a wafer, a foreign material, or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.
摘要翻译：由晶片的表面状态，异物或缺陷引起的反射光叠加在由膜的类型和厚度或表面不规则性引起的雾度频率分量上。为了检测由待检查物体的表面上存在的雾度引起的雾度频率分量，检测从被检查物体传播的光，并将其转换为电信号。以预定的采样时间间隔采样电信号并将其转换为数字数据。由异物引起的频率分量，缺陷等与数字数据分离，以确保选择雾度频率分量。雾度频率分量由附着在晶片表面的污迹，模糊晦暗，表面不规则等引起。

4. 发明授权

US08101935B2 Inspection apparatus and inspection method 有权
标题翻译：检验仪器和检验方法
公开(公告)号：US08101935B2
公开(公告)日：2012-01-24
申请号：US12272211
申请日：2008-11-17
申请人： Kazuo Takahashi , Takahiro Jingu
发明人： Kazuo Takahashi , Takahiro Jingu
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N2021/8896 , G01N2021/8928
摘要： Reflected light caused by the state of the surface of a wafer, a foreign material or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. It has therefore been difficult to accurately measure the haze frequency component by use of a fixed threshold value. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.
摘要翻译：由晶片表面的状态，异物或缺陷引起的反射光叠加在由膜的类型和厚度或表面不规则性引起的雾度频率分量上。因此，难以通过使用固定的阈值来精确地测量雾度频率分量。为了检测由待检查物体的表面上存在的雾度引起的雾度频率分量，检测从被检查物体传播的光，并将其转换为电信号。以预定的采样时间间隔采样电信号并将其转换为数字数据。由异物引起的频率分量，缺陷等与数字数据分离，以确保选择雾度频率分量。雾度频率分量由附着在晶片表面的污迹，模糊晦暗，表面不规则等引起。

5. 发明申请

US20090140180A1 INSPECTION APPARATUS AND INSPECTION METHOD 有权
标题翻译：检查装置和检查方法
公开(公告)号：US20090140180A1
公开(公告)日：2009-06-04
申请号：US12272211
申请日：2008-11-17
申请人： Kazuo Takahashi , Takahiro Jingu
发明人： Kazuo Takahashi , Takahiro Jingu
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N2021/8896 , G01N2021/8928
摘要： Reflected light caused by the state of the surface of a wafer, a foreign material or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. It has therefore been difficult to accurately measure the haze frequency component by use of a fixed threshold value. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.
摘要翻译：由晶片表面的状态，异物或缺陷引起的反射光叠加在由膜的类型和厚度或表面不规则性引起的雾度频率分量上。因此，难以通过使用固定的阈值来精确地测量雾度频率分量。为了检测由待检查物体的表面上存在的雾度引起的雾度频率分量，检测从被检查物体传播的光，并将其转换为电信号。以预定的采样时间间隔采样电信号并将其转换为数字数据。由异物引起的频率分量，缺陷等与数字数据分离，以确保选择雾度频率分量。雾度频率分量由附着在晶片表面的污迹，模糊晦暗，表面不规则等引起。

6. 发明授权

US07791721B2 Surface inspection with variable digital filtering 有权
标题翻译：可变数字滤波表面检测
公开(公告)号：US07791721B2
公开(公告)日：2010-09-07
申请号：US11878197
申请日：2007-07-23
申请人： Kazuo Takahashi , Takahiro Jingu
发明人： Kazuo Takahashi , Takahiro Jingu
IPC分类号： G01N21/88
CPC分类号： G01N21/956 , G01N21/8851
摘要： A semiconductor wafer, which is an inspection object, is stuck by vacuum on a chuck and this chuck is mounted on an inspection object movement stage consisting of a rotational stage and a translational stage, located on a Z-stage. The rotational stage provides a rotational movement and the translational stage provides a translational movement. And when a foreign particle or a defect on an inspection object surface is detected, the parameter of digital filtering is dynamically changed during inspection, and the foreign particle or the defect is differentiated using the result after removing a low frequency fluctuation component to be a noise component.
摘要翻译：作为检查对象的半导体晶片通过真空卡在卡盘上，该卡盘安装在由位于Z平台上的旋转台和平移台构成的检查对象移动台上。旋转台提供旋转运动，平移台提供平移运动。并且当检测到异物或检查物体表面的缺陷时，在检查期间动态地改变数字滤波的参数，并且在将低频波动分量除去为噪声之后，使用结果将异物或缺陷区分开来零件。

7. 发明授权

US08587777B2 Examination method and examination device 有权
标题翻译：检查方法和检查装置
公开(公告)号：US08587777B2
公开(公告)日：2013-11-19
申请号：US13202708
申请日：2009-11-19
申请人： Takahiro Jingu , Kazuo Takahashi
发明人： Takahiro Jingu , Kazuo Takahashi
IPC分类号： G01N21/00 , G06F19/00
CPC分类号： G01N21/94 , G01N21/47 , G01N21/9501 , G01N21/956 , G01N2021/4711
摘要： A change in surface state can be dealt with by setting threshold values different for respective regions of an object to be examined in accordance with a magnitude of noises, thereby improving a detection sensitivity. A function for setting an examination threshold value every region is installed. A function for setting examination threshold values every plurality of detectors spatially independent of each other is installed. The magnitude of noises from the object to be examined differs depending on a spatial direction even in the same region. Therefore, the detection sensitivity is maximized by maximizing an S/N ratio of a detection signal by an optimum signal arithmetic operating process according to the magnitude of noises from the object to be examined every detector and every region of the object to be examined and by setting the optimum threshold values.
摘要翻译：表面状态的变化可以通过根据噪声的大小设定对待检测对象的各个区域不同的阈值来处理，从而提高检测灵敏度。安装每个区域设定检查阈值的功能。设置在空间上彼此独立的每个多个检测器设置检查阈值的功能。来自被检查物体的噪声的大小根据空间方向即使在相同的区域也不同。因此，通过根据每个检测器和待检查对象的每个区域将要检查的对象的噪声的大小，通过最佳信号运算处理使检测信号的S / N比最大化，使检测灵敏度最大化，设置最佳阈值。

8. 发明申请

US20130010290A1 SURFACE INSPECTION DEVICE AND SURFACE INSPECTION METHOD 审中-公开
标题翻译：表面检查装置和表面检查方法
公开(公告)号：US20130010290A1
公开(公告)日：2013-01-10
申请号：US13577348
申请日：2011-03-30
申请人： Kazuo Takahashi , Takahiro Jingu
发明人： Kazuo Takahashi , Takahiro Jingu
IPC分类号： G01N21/956
CPC分类号： G01N21/9501 , G01N21/47 , G01N21/94
摘要： There are provided a surface inspection device and a surface inspection method which can inspect a surface of a test object with uniform detection sensitivity. A surface inspection device includes a test object moving stage, a lighting device, an inspection coordinate detection device, a light detector, an A/D converter, and a foreign object/defect determination unit. The lighting device is configured to change a dimension of a light spot in a circumferential direction based on a position of the light spot in a radial direction obtained by the inspection coordinate detection device. The density of irradiation light intensity of the light spot is made constant while the light spot is being moved for scanning between an outer peripheral portion and a central portion on the test object.
摘要翻译：提供了能够以均匀的检测灵敏度检查被检查体的表面的表面检查装置和表面检查方法。表面检查装置包括测试对象移动台，照明装置，检查坐标检测装置，光检测器，A / D转换器和异物/缺陷确定单元。照明装置被配置为基于由检查坐标检测装置获得的沿径向的光点的位置来改变圆周方向上的光斑的尺寸。使光点在被检体的外周部和中央部之间移动扫描的同时使光斑的照射光强度密集。

9. 发明申请

US20120154797A1 INSPECTION APPARATUS AND INSPECTION METHOD 有权
标题翻译：检查装置和检查方法
公开(公告)号：US20120154797A1
公开(公告)日：2012-06-21
申请号：US13328768
申请日：2011-12-16
申请人： Kazuo Takahashi , Takahiro Jingu
发明人： Kazuo Takahashi , Takahiro Jingu
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N2021/8896 , G01N2021/8928
摘要： Reflected light caused by the state of the surface of a wafer, a foreign material, or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.
摘要翻译：由晶片的表面状态，异物或缺陷引起的反射光叠加在由膜的类型和厚度或表面不规则性引起的雾度频率分量上。为了检测由待检查物体的表面上存在的雾度引起的雾度频率分量，检测从被检查物体传播的光，并将其转换为电信号。以预定的采样时间间隔采样电信号并将其转换为数字数据。由异物引起的频率分量，缺陷等与数字数据分离，以确保选择雾度频率分量。雾度频率分量由附着在晶片表面的污迹，模糊晦暗，表面不规则等引起。

10. 发明授权

US08958076B2 Surface shape measuring apparatus 有权
标题翻译：表面形状测量装置
公开(公告)号：US08958076B2
公开(公告)日：2015-02-17
申请号：US13993630
申请日：2011-11-30
申请人： Kazuo Takahashi , Takahiro Jingu
发明人： Kazuo Takahashi , Takahiro Jingu
IPC分类号： G01B11/30 , G01N21/95 , G01N21/94 , H01L21/66
CPC分类号： G01N21/9501 , G01B11/303 , G01N21/94 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Surface states have traditionally been measured with apparatuses such as an atomic force microscope (AFM), and these measurements have been high in resolution but low in speed. In conventional apparatuses for inspecting the foreign matter sticking to a wafer surface, and for inspecting defects present on the wafer surface, the inspection has had a tendency to be restricted in a region of the highest noise level arising from the roughness of the surface, the surface state, and/or crystal orientations, and thereby to reduce detection sensitivity in a region of lower noise levels. In these conventional techniques, signal processing of the light scattered from the object to be inspected has been based only upon the intensity of the light.This invention acquires three-dimensional data by, during such signal processing, adding detection intervals and the frequency of detection, as well as the intensity of light. The invention measures surface roughness of a target object (wafer) by creating region-specific three-dimensional maps from the three-dimensional data, then estimating the surface state of the wafer from analytical results, processing this estimated surface state as physical quantities, and analyzing the data.
摘要翻译：传统上用诸如原子力显微镜（AFM）的装置测量表面状态，并且这些测量结果分辨率高，而且速度低。在用于检查粘附于晶片表面的异物和用于检查存在于晶片表面上的缺陷的常规设备中，检查具有在表面粗糙度产生的最高噪声水平的区域中被限制的倾向，表面状态和/或晶体取向，从而降低噪声水平较低的区域的检测灵敏度。在这些常规技术中，从被检查物体散射的光的信号处理仅基于光的强度。本发明在这种信号处理期间通过增加检测间隔和检测频率以及光的强度来获取三维数据。本发明通过从三维数据中创建区域特定的三维图来测量目标物体（晶片）的表面粗糙度，然后从分析结果估计晶片的表面状态，将该估计的表面状态处理为物理量，以及分析数据。

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