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1. 发明专利

JP2010267792A Semiconductor device and manufacturing method therefor 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010267792A
公开(公告)日：2010-11-25
申请号：JP2009117728
申请日：2009-05-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KONDO YOSUKE , YAMAGUCHI KAZUHIRO , TAKANO JIHEI , MITANI JUN , NAKANO SEISHI , ISHIDA KAZUNORI
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/15184 , H01L2924/15311 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing crack formation caused by heat stress, and a manufacturing method for the semiconductor device. SOLUTION: According to the semiconductor device 1, a subject to be mounted 2 is mounted on a mounted subject 3 via a plurality of arrayed or randomly arranged connection terminals 41. The semiconductor device 1 includes a means that forms a plurality of electrode pads 43a and 43b on the mounted subject 3, and a means that melts and solidifies the connection terminals 41 on the electrode pads 43a and 43b to join the connection terminals 41 to the mounted subject 3. Some electrode pads 43a each have a body 431 that regulates the solidified shape of the connection terminal 41, and a guide portion 432 that guides part of the connection terminal 41 to the outer periphery of the body 431 when the connection terminal 41 melts. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供能够抑制由热应力引起的裂纹形成的半导体器件及其制造方法。解决方案：根据半导体器件1，通过多个排列或随机排列的连接端子41将待安装对象2安装在被安装对象3上。半导体器件1包括形成多个电极的装置安装对象3上的焊盘43a和43b，以及熔接和固化电极焊盘43a和43b上的连接端子41以将连接端子41连接到安装的对象3的装置。一些电极焊盘43a各自具有主体431，主体431 调节连接端子41的固化形状，以及当连接端子41熔化时将连接端子41的一部分引导到主体431的外周的引导部432。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010118534A Semiconductor device and method of manufacturing same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010118534A
公开(公告)日：2010-05-27
申请号：JP2008291197
申请日：2008-11-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAMURA YOICHI , NAKANO SEISHI , ISHIDA KAZUNORI
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L2224/16 , H01L2224/171 , H01L2224/45124 , H01L2224/45144 , H01L2224/81191 , H01L2224/81193 , H01L2224/81385 , H01L2924/00014 , H01L2924/07802 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2224/48 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which has high reliability and good productivity by enhancing bonding strength between a carrier substrate and a semiconductor element, and a method of manufacturing the same. SOLUTION: The semiconductor device 13 includes the carrier substrate 1, a flip-chip pad electrode 4 formed on the carrier substrate 1, a gold bump 15 bonded on an upper surface and a side surface of the flip-chip pad electrode 4, and the semiconductor element 5 electrically connected to the flip-chip pad electrode 4 through the gold bump 15. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供通过提高载体基板和半导体元件之间的接合强度而具有高可靠性和高生产率的半导体器件及其制造方法。解决方案：半导体器件13包括载体基板1，形成在载体基板1上的倒装焊盘电极4，接合在倒装芯片焊盘电极4的上表面上的金凸起15和侧面，并且半导体元件5通过金凸块15电连接到倒装芯片焊盘电极4.版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2010093206A High-frequency circuit package 审中-公开
标题翻译：高频电路包
公开(公告)号：JP2010093206A
公开(公告)日：2010-04-22
申请号：JP2008264422
申请日：2008-10-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKANO SEISHI , MITANI JUN
IPC分类号： H01L23/02 , H01L23/08
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/15192 , H01L2924/16195 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a sealing structure for a high-frequency circuit package which is made low-cost and compact and has high reliability. SOLUTION: In the high-frequency circuit package, a high-frequency electronic component mounted on a multilayer ceramic substrate 10 is airtightly sealed with a cover body 30. The airtight sealing structure for the high-frequency electronic component is achieved without using a metal frame (seal ring) by bonding a thick plating portion 35 formed at an outer periphery of a sealing surface of the cover body 30 and a metal pattern portion 15 formed on the multilayer ceramic substrate 10 together by ultrasonic thermocompression. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供低成本且紧凑且高可靠性的高频电路封装的密封结构。解决方案：在高频电路封装中，安装在多层陶瓷基板10上的高频电子部件用盖主体30气密密封。用于高频电子部件的气密密封结构不使用通过超声波热压将通过在盖体30的密封面的外周形成的厚镀层部35和形成在多层陶瓷基板10上的金属图案部15接合而形成金属框架（密封环）。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010267743A Connection structure for semiconductor device and wiring board 审中-公开
标题翻译：半导体器件和接线板的连接结构
公开(公告)号：JP2010267743A
公开(公告)日：2010-11-25
申请号：JP2009116921
申请日：2009-05-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKANO SEISHI , ISHIDA KAZUNORI , YAMAGUCHI KAZUHIRO , TAKANO JIHEI , MITANI JUN
IPC分类号： H01L21/60 , H05K1/18
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/15184 , H01L2924/15311 , H01L2924/16152 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a BGA (Ball Grid Array) connection structure of high connection reliability.
SOLUTION: The connection structure for a semiconductor device and wiring board is characterized in that a semiconductor device 1 is BGA connected to a wiring board (mounting substrate 10) with solder. The connection structure includes a stud pin 8, board pads (a first metal pad 7 and a second metal pad 11), and a fillet shape junction. The stud pin 8 is formed longer than a solder bump in the axial direction, and formed in a shape where the cross section at one end joined to the semiconductor device side and the cross section at the other end joined to the wiring board side become larger than the cross section at the central part. Each of the board pads is arranged at the semiconductor device side and the mounting substrate side respectively to join both ends of the stud pin 8, and has a size larger than both ends of the stud pin 8. The fillet shape junction is prepared between the stud pin 8, the semiconductor device 1, and the mounting substrate 10 by solder.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供高连接可靠性的BGA（球栅阵列）连接结构。解决方案：半导体器件和布线板的连接结构的特征在于，半导体器件1是通过焊料与布线板（安装基板10）连接的BGA。连接结构包括螺柱销8，板焊盘（第一金属焊盘7和第二金属焊盘11）以及圆角形结。螺柱销8在轴向上比焊料凸块形成得更长，并且形成为与半导体器件侧连接的一端的截面和另一端的与布线板侧接合的截面变大的形状比中部的横断面。每个板焊盘分别设置在半导体器件侧和安装基板侧，以连接螺柱销8的两端，并且具有大于螺柱销8的两端的尺寸。圆角形状接合部在螺柱销8，半导体装置1和安装基板10。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2005268334A Electronic component containing package, and manufacturing method of electronic component containing package 有权
标题翻译：包含包装的电子元件和包含包装的电子元件的制造方法
公开(公告)号：JP2005268334A
公开(公告)日：2005-09-29
申请号：JP2004075160
申请日：2004-03-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKANO SEISHI
IPC分类号： H01L23/10 , H01L23/02
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a technology for interrupting creep-up of a solder material at a seal ring lower face joined with a package in the case of fixing a metal lid to a seal ring upper face by seam welding. SOLUTION: The ceramic package is provided with an electronic component, the metallic lid, a package formed with a cavity, and a seal ring to an upper end face of which the metallic lid is welded and a lower end face is soldered to an upper face of a package wall. A gold plating layer is formed to a front layer of an upper side face and a front layer of a lower side face, and a nickel plating layer is formed to a front layer between upper and lower gold plating layers. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种技术，用于在通过缝焊将金属盖固定到密封环上表面的情况下，中断在与封装相连接的密封环下表面处的焊料材料的蠕变。解决方案：陶瓷封装设置有电子部件，金属盖，形成有空腔的封装，以及密封环，其上端面焊接有金属盖，下端面焊接到包装壁的上表面。对上侧面和下侧面的前层的前层形成镀金层，在上镀层和下镀金层之间的前层形成镀镍层。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2003198033A OPTICAL ELEMENT MODULE 审中-公开
公开(公告)号：JP2003198033A
公开(公告)日：2003-07-11
申请号：JP2001396515
申请日：2001-12-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKANO SEISHI , TAKAGI SHINICHI , FUKUDA KEIICHI , NISHIMURA HASHINORI
IPC分类号： G02B6/42 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To solve the problem that an electronic component or the like cannot be easily packaged relatively near a light-emitting device in the conventional light element module although it is required that the electronic component be packaged near the light-emitting device to increase the speed of signals. SOLUTION: The light element module is composed of a carrier having upper and side surfaces, a light-emitting device that is packaged onto the upper surface of the carrier, a post projecting from the upper surface of the carrier, and a lens unit that is connected to the post and the side of the carrier. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2000056184A OPTICAL ELEMENT MODULE 失效
公开(公告)号：JP2000056184A
公开(公告)日：2000-02-25
申请号：JP22398398
申请日：1998-08-07
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKANO SEISHI
IPC分类号： G02B6/42 , H01S5/00 , H01S5/30
摘要： PROBLEM TO BE SOLVED: To suppress degradation characteristics due to optical axis deviation at the time of YAG laser welding and caused by a temperature cycle test by joining a ferrule and a ferrule holder near both ends of the ferrule by the YAG laser welding. SOLUTION: This optical element module is composed of a light emitting element 1, a lens 2 for converging the light of the light emitting element 1, a holder 3 for holding the light emitting element 1 and the lens 2, an optical fiber 4 for transmitting the optical signals of the light emitting element 1 to the outside, a ferrule 5 for holding the optical fiber 4, the ferrule holder B6 for holding the ferrule 5 through YAG laser welding C10a and the through YAG laser welding D10b. That is, the vicinities of both ends of the ferrule are joined by the through YAG laser welding. Thus, the inclination of the ferrule 5 in the hole of the ferrule holder B6 is suppressed and they are joined without causing the optical axis deviation by the inclination of the ferrule 5. Thus, the optical element module for hardly causing characteristic degradation is easily formed.

8. 发明专利

JPH09230175A OPTICAL ELEMENT MODULE 失效
公开(公告)号：JPH09230175A
公开(公告)日：1997-09-05
申请号：JP3668796
申请日：1996-02-23
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKANO SEISHI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To make it possible to easily electrically insulate a photodetector and a holder by adhering and fixing this photodetector and this holder by means of an adhesive compounded with insulators, such as silica or plastic, in the form of beads. SOLUTION: A ring 3 which electrically insulates the photodetector 1 and the metallic holder 2 for holding the photodetector 1 is inserted between the photodetector 1 and the holder 2. The insulators 8, such as silica or plastic, in the form of beads are compounded with the adhesives 6 to adhere and fix both. Namely, the insulators 8, such as silica or plastic, in the form of beads which are compounded with the adhesive 6 at a compounding ratio of 1:1 at which the strength of adhesion is the same as that of only the adhesive and the insulation characteristic is good are held between the photodetector 1 and the holder 2 at the time of adhering the photodetector and the holder. As a result, there is no metallic contact of the photodetector 1 and the inside wall of the holder 2 and the easy electrical insulation and adhesion are attained even if the photodetector 1 is adhered deviatively to the holder 2.

9. 发明专利

JP2001208940A OPTICAL SEMICONDUCTOR MODULE 失效
公开(公告)号：JP2001208940A
公开(公告)日：2001-08-03
申请号：JP2000018742
申请日：2000-01-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKANO SEISHI
IPC分类号： G02B6/24 , G02B6/42 , H01L31/0232 , H01L33/48 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To solve such a conventional problem that the loss of optical connection through deviation in optical coupling is caused by an external force and by eccentricity of an optical fiber inside a rotating ferrule in a sleeve, in a semiconductor module in which short optical fibers and optical fibers for transmitting optical signals outside are each stuck to the ferrule and in which these fibers are made to butt to each other inside the sleeve to enable optical coupling. SOLUTION: The short optical fibers and the optical fibers for transmitting optical signals outside are made to butt to each other inside the same pipe having a bore slightly larger than the outer diameter of the optical fibers and are stuck to each other in an optically coupled state, thereby suppressing deviation in optical coupling which is caused by an external force and by eccentricity of optical fibers through the rotation.

10. 发明专利

JPH10300992A OPTICAL ELEMENT MODULE 失效
公开(公告)号：JPH10300992A
公开(公告)日：1998-11-13
申请号：JP10576197
申请日：1997-04-23
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKANO SEISHI , KIMURA TAKAHIRO , SAKAZAKI YUJI
IPC分类号： G02B6/42 , H01L33/58 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To make it possible to easily form a lead of an optical element by bending the lead of the optical element in a form of DIP(Dual In-line Package) along a groove of a case. SOLUTION: An optical element module is arranged so that a holder, a ferrule holder 6 and a case 13 are fixed by bonding and a lead of the optical element is formed along a groove of the case in a form of DIP type. An optical fiber 4 transmits an optical signal of a light emitting element externally; the ferrule 5 holds the optical fiber 4; and the ferrule holder 6 holds the ferrule 5. The DIP type case 13 of an insulating material holds the light emitting element, holder, and ferrule holder 6. The case 13 is provided with a groove 14. It becomes possible to avoid contact of leads and easily form the leads in DIP type and reduce a time for assembly and costs by bending the lead of the light emitting element along the groove of the DIP type case 13 of insulating material.

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