会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Plasma processing apparatus for large area ion irradiation
    • 用于大面积离子照射的等离子体处理装置
    • US4859908A
    • 1989-08-22
    • US100148
    • 1987-09-23
    • Akihisa YoshidaKentaro SetsuneTakashi Hirao
    • Akihisa YoshidaKentaro SetsuneTakashi Hirao
    • C30B31/22H01J37/32H01J27/02
    • H01J37/32091C30B31/22H01J37/32357H01J37/3266
    • A plasma processing apparatus performs various plasma processings of a substrate having a large area in a semiconductor element manufacturing process, by using highly excited plasma generated at a low pressure under the application of RF power and a magnetic field. In this plasma processing apparatus, a gas is introduced into a vacuum chamber to be used as an ion source, RF power is applied to two electrodes having respective surfaces opposite to each other through the gas to thereby generate the plasma in the vacuum chamber, and a magnetic field is applied to the plasma from a magnetic field source arranged at a predetermined position. The intensity of the applied magnetic field is set to be 1.5 times or more the magnetic field intensity which causes electron cyclotron resonance to occur at the frequency f of the applied RF power. Particularly, when the frequency f of the RF power is 13.56 MHz, the magnetic field intensity is selected to be in the range from 25 gausses to 35 gausses.
    • 等离子体处理装置通过使用在RF功率和磁场的应用下在低压下产生的高激发等离子体,在半导体元件制造工艺中执行具有大面积的衬底的各种等离子体处理。 在该等离子体处理装置中,将气体引入到真空室中以用作离子源,通过气体将两相电极的两个电极施加RF功率,从而在真空室中产生等离子体, 从布置在预定位置的磁场源向等离子体施加磁场。 所施加的磁场的强度被设定为在所施加的RF功率的频率f处发生电子回旋共振的磁场强度的1.5倍或更多。 特别地,当RF功率的频率f为13.56MHz时,磁场强度被选择在从25高斯到35高斯的范围内。
    • 4. 发明授权
    • Silicon structure, method for producing the same, and solar battery using the silicon structure
    • 硅结构体及其制造方法以及使用硅结构的太阳能电池
    • US06518494B1
    • 2003-02-11
    • US08701292
    • 1996-08-22
    • Munehiro ShibuyaMasatoshi KitagawaYuuji MukaiAkihisa Yoshida
    • Munehiro ShibuyaMasatoshi KitagawaYuuji MukaiAkihisa Yoshida
    • H01L3100
    • H01L31/0547H01L31/02363H01L31/035227Y02E10/52
    • A silicon structure having little solar light beam reflection, which is suitable for a solar battery. On the entire surface of a quartz substrate, Mo is deposited at a thickness of approximately 51 &mgr;m to form a lower electrode. On the entire surface of the lower electrode, a p type silicon structure having a thickness of 30 to 40 &mgr;m comprising an aggregate of a plurality of columnar silicon members mainly comprising silicon and having random orientations is formed via a film mainly comprising silicon, using Si2Cl6 mixed with BCl3. On the surface of the p type silicon structure, P is diffused by a thermal diffusion method using POCl3 to form an n type region at the periphery of the columnar silicon members. On the entire surface of the p type silicon structure, a transparent electrode comprising indium-tin oxide having a thickness of 30 to 40 &mgr;m is formed, and an upper electrode comprising Al having a thickness of approximately 1 &mgr;m is formed on the transparent electrode.
    • 具有太阳光反射少的硅结构,适用于太阳能电池。 在石英衬底的整个表面上,以约51μm的厚度沉积Mo以形成下电极。 在下电极的整个表面上,通过使用Si 2 Cl 6混合的主要包含硅的膜,形成厚度为30至40μm的包含多个主要由硅构成并具有随机取向的多个柱状硅构件的聚集体的ap型硅结构 与BCl3。 在p型硅结构的表面上,P通过使用POCl 3的热扩散法扩散,在柱状硅构件的周围形成n型区域。 在p型硅结构的整个表面上,形成厚度为30〜40μm的氧化铟锡的透明电极,在透明电极上形成厚度约为1μm的包含Al的上部电极。
    • 8. 发明授权
    • Method of manufacturing transistor
    • 制造晶体管的方法
    • US6127211A
    • 2000-10-03
    • US162450
    • 1998-09-29
    • Takashi HiraoAkihisa YoshidaToru FukumotoKazuyasu Adachi
    • Takashi HiraoAkihisa YoshidaToru FukumotoKazuyasu Adachi
    • H01L21/18H01L21/336H01L21/84H01L29/786
    • H01L29/78621
    • In a method of manufacturing a semiconductor device having an LDD structure, source gases for generating plural types of impurity ions exhibiting different molecular weights and different projected ranges in a target during impurity implantation are supplied to a plasma space, ionized, accelerated with a voltage, and implanted in a semiconductor region on the target substrate. In the case of manufacturing a top-gate transistor, a gate electrode on the semiconductor region has a sufficient thickness to serve as a mask. In the case of manufacturing a bottom-gate transistor, a mask and a resistor are used. An implantation angle is set to an optimum value as desired. Thereafter, the impurity is activated as desired. Thus, the semiconductor device having the LDD structure is manufactured by a single step of impurity implantation.
    • 在制造具有LDD结构的半导体器件的方法中,在杂质注入期间在靶中产生表现出不同分子量和不同投影范围的多种杂质离子的源气体被提供给等离子体空间,电离电压加速, 并注入目标衬底上的半导体区域。 在制造顶栅晶体管的情况下,半导体区域上的栅电极具有足够的厚度用作掩模。 在制造底栅晶体管的情况下,使用掩模和电阻器。 根据需要将植入角度设定为最佳值。 此后,根据需要激活杂质。 因此,具有LDD结构的半导体器件通过杂质注入的一个步骤来制造。
    • 10. 发明授权
    • Semiconductor laser and optical system having a collimator lens
    • 具有准直透镜的半导体激光器和光学系统
    • US06320689B1
    • 2001-11-20
    • US09369513
    • 1999-08-06
    • Naotaro NakataAkihisa Yoshida
    • Naotaro NakataAkihisa Yoshida
    • G02B2608
    • G02B26/124G02B27/30
    • An optical system includes a semiconductor laser. The semiconductor laser is accommodated within a case. The case is formed with a window to pass through laser light emitted from the semiconductor laser. The laser light passed through the window comes to a collimator lens. Between semiconductor laser and the collimator lens is provided a light shield member having a pinhole to pass through the laser light having passed the window. Laser light made in a parallel luminous flux is outputted from the collimator lens. This laser light is deflected toward a main scanning direction by a deflector and further collected on a scanning surface by a light collector.
    • 光学系统包括半导体激光器。 半导体激光器容纳在壳体内。 壳体形成有通过从半导体激光器发射的激光的窗口。 通过窗口的激光进入准直透镜。 在半导体激光器和准直透镜之间设置有具有针孔以穿过已经通过窗口的激光的遮光部件。 从准直透镜输出以平行光束形成的激光。 该激光通过偏转器朝向主扫描方向偏转,并通过集光器在扫描面上进一步收集。