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1. 发明授权

US07873204B2 Method for detecting lithographically significant defects on reticles 有权
标题翻译：在光罩上检测光刻显着缺陷的方法
公开(公告)号：US07873204B2
公开(公告)日：2011-01-18
申请号：US11622432
申请日：2007-01-11
申请人： Mark J. Wihl , Yalin Xiong , Lih-Huah Yiin
发明人： Mark J. Wihl , Yalin Xiong , Lih-Huah Yiin
IPC分类号： G06K9/00
CPC分类号： G03F1/84
摘要： A method for identifying lithographically significant defects. A photomask is illuminated to produce images that experience different parameters of the reticle as imaged by an inspection tool. Example parameters include a transmission intensity image and a reflection intensity image. The images are processed together to recover a band limited mask pattern associated with the photomask. A model of an exposure lithography system for chip fabrication is adapted to accommodate the band limited mask pattern as an input which is input into the model to obtain an aerial image of the mask pattern that is processed with a photoresist model yielding a resist-modeled image. The resist-modeled image is used to determine if the photomask has lithographically significant defects.
摘要翻译：用于识别光刻显着缺陷的方法。光掩模被照亮以产生经由检查工具成像的掩模版的不同参数的图像。示例性参数包括传输强度图像和反射强度图像。一起处理图像以恢复与光掩模相关联的带限制掩模图案。用于芯片制造的曝光光刻系统的模型适于适应带限制掩模图案作为输入到输入到模型中以获得用光致抗蚀剂模型处理的掩模图案的空间图像，产生抗蚀剂建模图像。使用抗蚀剂建模的图像来确定光掩模是否具有光刻的显着缺陷。

2. 发明申请

US20080170773A1 METHOD FOR DETECTING LITHOGRAPHICALLY SIGNIFICANT DEFECTS ON RETICLES 有权
标题翻译：用于检测反应物上的重要缺陷的方法
公开(公告)号：US20080170773A1
公开(公告)日：2008-07-17
申请号：US11622432
申请日：2007-01-11
申请人： Mark J. Wihl , Yalin Xiong , Lih-Huah Yiin
发明人： Mark J. Wihl , Yalin Xiong , Lih-Huah Yiin
IPC分类号： G06K9/00
CPC分类号： G03F1/84
摘要： A method for identifying lithographically significant defects. A photomask is illuminated to produce images that experience different parameters of the reticle as imaged by an inspection tool. Example parameters include a transmission intensity image and a reflection intensity image. The images are processed together to recover a band limited mask pattern associated with the photomask. A model of an exposure lithography system for chip fabrication is adapted to accommodate the band limited mask pattern as an input which is input into the model to obtain an aerial image of the mask pattern that is processed with a photoresist model yielding a resist-modeled image. The resist-modeled image is used to determine if the photomask has lithographically significant defects.
摘要翻译：用于识别光刻显着缺陷的方法。光掩模被照亮以产生经由检查工具成像的掩模版的不同参数的图像。示例性参数包括传输强度图像和反射强度图像。一起处理图像以恢复与光掩模相关联的带限制掩模图案。用于芯片制造的曝光光刻系统的模型适于适应带限制掩模图案作为输入到输入到模型中以获得用光致抗蚀剂模型处理的掩模图案的空间图像，产生抗蚀剂建模图像。使用抗蚀剂建模的图像来确定光掩模是否具有光刻显着的缺陷。

3. 发明授权

US07027635B1 Multiple design database layer inspection 有权
标题翻译：多设计数据库层检查
公开(公告)号：US07027635B1
公开(公告)日：2006-04-11
申请号：US10193965
申请日：2002-07-10
申请人： Mark J. Wihl , George Q. Chen , Jun Ye , Lih-Huah Yiin , Pei-Chun Chiang
发明人： Mark J. Wihl , George Q. Chen , Jun Ye , Lih-Huah Yiin , Pei-Chun Chiang
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G03F1/30 , G03F1/50 , G03F1/84 , G06T2207/30148
摘要： Techniques that use the design databases used in each of the expose/etch steps during construction of phase shift masks are described. A model or reference image is rendered, accounting for systematic variations, from the design databases to represent what a layer of the PSM should look like after processing. The reference image is compared to an optically acquired image of a specimen phase shift mask to find defects. The technique of the present invention can be used to inspect EAPSM, APSM and tritone masks. The technique inspects all layers in one pass and is therefore more efficient.
摘要翻译：描述了在构造相移掩模期间使用在每个曝光/蚀刻步骤中使用的设计数据库的技术。渲染来自设计数据库的模型或参考图像，以计算系统的变化，以表示处理后的PSM层的外观。将参考图像与样本相移掩模的光学获取图像进行比较以发现缺陷。本发明的技术可用于检查EAPSM，APSM和三色面罩。该技术在一次通过中检查所有层，因此效率更高。

4. 发明授权

US4926489A Reticle inspection system 失效
标题翻译：标线检查系统
公开(公告)号：US4926489A
公开(公告)日：1990-05-15
申请号：US104740
申请日：1987-10-05
申请人： Donald L. Danielson , Mark J. Wihl , David A. Joseph
发明人： Donald L. Danielson , Mark J. Wihl , David A. Joseph
IPC分类号： G01N21/956 , G03F1/84 , G06T7/00
CPC分类号： G06K9/00 , G01N21/95607 , G03F1/84 , G06T7/001 , G06T7/0024 , G01N2021/95676 , G06K2209/19 , G06T2207/30148
摘要： An automatic inspection system including an illuminator for illuminating a reticle or photomask to be inspected, while optically projecting a magnified image of the reticle or photomask onto a plurality of detector elements. A carriage assembly moves the object at a constant velocity to allow the detector elements to sequentially view the entire surface to be inspected. The detector elements are responsive to the intensity of light incident thereupon and are periodically scanned to obtain a two-dimensional measured representation of the object. A database adaptor formulates a two-dimensional representation from the design database description corresponding to the scanned object simultaneously and in synchronism with the scanning of the photomask or reticle. The measured and database adapted representation of the scanned object are input to a signal processor for alignment and defect detection. While the representations are shifted through a memory, an alignment circuit dynamically measures and corrects for misalignment between the representations, so that a defect detector can effectively compare the representations for defects. Additional correction of misalignment between the representations is obtained by modulating the size of the measured representation as detected by the detector elements. At the operator's option, a second measured image of a multi-cell reticle or photomask may be used for comparison as a substitute for the database representation.
摘要翻译：一种自动检查系统，包括用于照亮要检查的掩模版或光掩模的照明器，同时将掩模版或光掩模的放大图像光学投影到多个检测器元件上。托架组件以恒定速度移动物体，以允许检测器元件依次观察要检查的整个表面。检测器元件响应于其上入射的光的强度并被周期性扫描以获得物体的二维测量表示。数据库适配器同时和与光掩模或掩模版的扫描同步地从与扫描对象相对应的设计数据库描述中形成二维表示。扫描对象的测量和数据库适配表示被输入到用于对准和缺陷检测的信号处理器。当表示通过存储器移位时，对准电路动态地测量和校正表示之间的未对准，使得缺陷检测器可以有效地比较缺陷的表示。通过调制由检测器元件检测到的测量表示的大小来获得表示之间的未对准的附加校正。在操作者的选择下，可以使用多单元掩模版或光掩模的第二测量图像作为数据库表示的替代来进行比较。

5. 发明授权

US4633504A Automatic photomask inspection system having image enhancement means 失效
标题翻译：具有图像增强装置的自动光掩模检查系统
公开(公告)号：US4633504A
公开(公告)日：1986-12-30
申请号：US625903
申请日：1984-06-28
申请人： Mark J. Wihl
发明人： Mark J. Wihl
IPC分类号： G01B11/30 , G01B11/24 , G01B11/245 , G01N21/956 , G03F1/84 , G06T1/00 , G06T5/20 , G06T7/00 , H01L21/027 , H01L21/30 , H01L21/66 , H04N7/18 , G06K9/40
CPC分类号： G03F1/84 , G06T5/003 , G06T5/20 , G06T7/0004 , G06T2207/30148
摘要： Optical inspection apparatus for detecting defects in a visually perceptible pattern including image acquistion means for inspecting the pattern on a pixel-by-pixel basis, developing digital data signals corresponding to each pixel and feeding the signals so developed to an imaging enhancement means. The imaging enhancement means compensates for equipment related degradations in the images and converts the digital data signal value corresponding to each pixel into a corrected signal value by operating on the digital data signal with a two dimensional finite impulse response filter. The corrected signal values of the image enhancement means are received by a defect detection means which evaluates the signal values for defects in the pattern. Any defects so determined are recorded and/or displayed on data recording means.
摘要翻译：用于检测视觉上可察觉图案中的缺陷的光学检查装置，包括用于逐像素地检查图案的图像获取装置，显影对应于每个像素的数字数据信号，并将如此显影的信号馈送到成像增强装置。成像增强装置补偿图像中与设备有关的劣化，并且通过利用二维有限脉冲响应滤波器对数字数据信号进行操作，将与每个像素对应的数字数据信号值转换为校正信号值。图像增强装置的校正信号值由缺陷检测装置接收，该缺陷检测装置对图案中的缺陷的信号值进行评估。如此确定的任何缺陷将被记录和/或显示在数据记录装置上。

6. 发明授权

US4555798A Automatic system and method for inspecting hole quality 失效
标题翻译：自动检测孔质量的系统和方法
公开(公告)号：US4555798A
公开(公告)日：1985-11-26
申请号：US505848
申请日：1983-06-20
申请人： William H. Broadbent, Jr. , Steve Buchholz , Peter Eldredge , Mark J. Wihl
发明人： William H. Broadbent, Jr. , Steve Buchholz , Peter Eldredge , Mark J. Wihl
IPC分类号： G01N21/956 , G06T7/00 , G06K9/60
CPC分类号： G06T7/0008 , G01N21/95607 , G06T7/604 , G06T2207/10056 , G06T2207/30148
摘要： An automatic inspection system for inspecting holes in a mask including carriage means 30, illumination means 44, optical means 48, photosensitive detector means 46, and signal processing means 56. The mask 34 to be inspected is positioned by the carriage means in a horizontal plane. The optical means projects a focused image of a portion of the mask onto the photosensitive detector means. Photodiodes in the detector means are responsive to light from the illumination means that is transmitted through the holes in the mask. The signal processing means scans the outputs of the photodiodes and stores in memory a digital representation of the mask. The signal processing means performs inspection measurements and comparison tests. A smoothness checker circuit 240 measures the local radius of curvature of each hole at several places and compares the measurements to predetermined curvature limits to detect nicks and sharp protrusion defects. An area check circuit 246 measures the area of the hole and compares it to predetermined area limits. A diameter check circuit 244 measures the diameter of the hole in two dimensions and compares it to predetermined diameter limits. If either the hole area or the hole diameter is outside their respective limits, a hole size defect is indicated. Means are also provided for locating completely blocked, mispositioned or unintended holes by comparing detected information to a data base.
摘要翻译：用于检查掩模中的孔的自动检查系统，包括托架装置30，照明装置44，光学装置48，光敏检测装置46和信号处理装置56.待检查的掩模34由托架装置定位在水平面。光学装置将一部分掩模的聚焦图像投射到光敏检测器装置上。检测器装置中的光电二极管响应来自照射装置的光，透射通过掩模中的孔。信号处理装置扫描光电二极管的输出并在存储器中存储掩模的数字表示。信号处理装置执行检查测量和比较测试。平滑度检查器电路240测量几个位置处的每个孔的局部曲率半径，并将测量值与预定的曲率极限进行比较，以检测刻痕和尖锐的突出缺陷。区域检查电路246测量孔的面积并将其与预定面积限制进行比较。直径检查电路244测量孔的直径，并将其与预定的直径限制进行比较。如果孔面积或孔径都在其各自的极限之外，则表示孔尺寸缺陷。还提供了用于通过将检测到的信息与数据库进行比较来定位完全阻塞，错位或非预期的孔的手段。

7. 发明授权

US5085517A Automatic high speed optical inspection system 失效
标题翻译：自动高速光学检测系统
公开(公告)号：US5085517A
公开(公告)日：1992-02-04
申请号：US429963
申请日：1989-10-31
申请人： Curt H. Chadwick , Robert R. Sholes , John D. Greene , Francis D. Tucker, III , Michael E. Fein , P. C. Jann , David J. Harney , William Bell , Bin-Ming B. Isai , Walter I. Novak , Mark J. Wihl
发明人： Curt H. Chadwick , Robert R. Sholes , John D. Greene , Francis D. Tucker, III , Michael E. Fein , P. C. Jann , David J. Harney , William Bell , Bin-Ming B. Isai , Walter I. Novak , Mark J. Wihl
IPC分类号： G01B11/24 , G01B11/30 , G01N21/64 , G01N21/88 , G01N21/93 , G01N21/956 , G01R31/308 , G06T1/00 , G06T1/20
CPC分类号： G01R31/308 , G01N21/956 , G01N2021/8887 , G01N2021/95615 , G01N2021/95638 , G01N21/64 , G01N21/95607 , G01N2201/06126 , G01N2201/0826
摘要： In each configuration, at least one TDI sensor is used to image the portions of interest of the substrate that are substantially uniformly or critically illuminated. In one configuration, the substrate is compared to the expected characteristic features prestored in memory. In a second configuration, a first and second pattern in a region of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other. This is accomplished by illuminating the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. With each comparison whether there has been agreement between the two patterns is noted. After all of the patterns are sequentially compared, the bad ones are identified by identifying those that did not compare with other patterns in the test process. This inspection technique is useful for doing die-to-die inspections, as well as repeating patern inspections within the same die. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns eliminating the need for the temporary memory.

8. 发明授权

US5572598A Automated photomask inspection apparatus 失效
公开(公告)号：US5572598A
公开(公告)日：1996-11-05
申请号：US202868
申请日：1994-02-25
申请人： Mark J. Wihl , Tao-Yi Fu , Marek Zywno , Damon F. Kvamme , Michael E. Fein
发明人： Mark J. Wihl , Tao-Yi Fu , Marek Zywno , Damon F. Kvamme , Michael E. Fein
IPC分类号： G01B11/30 , G01N21/93 , G01N21/956 , G03F1/84 , G06K9/00 , G06T7/00 , H01L21/66
CPC分类号： G03F1/84 , G01N21/95607 , G01N2021/95676
摘要： An automated photomask inspection apparatus including an XY state (12) for transporting a substrate (14) under test in a serpentine path in an XY plane, an optical system (16) comprising a laser (30), a transmission light detector (34), a reflected light detector (36), optical elements defining reference beam paths and illuminating beam paths between the laser, the substrate and the detectors and an acousto-optical beam scanner (40, 42) for reciprocatingly scanning the illuminating and reference beams relative to the substrate surface, and an electronic control, analysis and display system for controlling the operation of the stage and optical system and for interpreting and storing the signals output by the detectors. The apparatus can operate in a die-to-die comparison mode or a die-to-database mode.

9. 发明授权

US4532650A Photomask inspection apparatus and method using corner comparator defect detection algorithm 失效
标题翻译：光掩模检查装置及方法采用拐角比较器缺陷检测算法
公开(公告)号：US4532650A
公开(公告)日：1985-07-30
申请号：US494762
申请日：1983-05-12
申请人： Tim S. Wihl , Mark J. Wihl
发明人： Tim S. Wihl , Mark J. Wihl
IPC分类号： G03F1/84 , G06T7/00 , G06K9/00
CPC分类号： G03F1/84 , G06T7/001 , G06T2207/30148
摘要： Defect detection apparatus including a mechanical and optical system for scanning duplicate areas of a photomask to be inspected, electronic means for converting the optically scanned information to digitized form, memory for storing such information, and means for comparing information obtained from one inspected area to the other inspected area to determine differences therebetween, such differences being classified as defects. The detection is accomplished using a vector gradient within a matrix technique to develop candidate and cancellor information which is then logically manipulated to qualify the data obtained from each pixel matrix and then, after qualification, is used to determine whether or not a defect has been detected. The subject invention has particular application to the detection of defects occurring at pattern corners within the inspected photomask and is specifically directed to overcoming difficulties previously encountered in detecting such defects.
摘要翻译：缺陷检测装置，包括用于扫描要检查的光掩模的重复区域的机械和光学系统，用于将光学扫描信息转换为数字化形式的电子装置，用于存储此类信息的存储器，以及用于将从一个检查区域获得的信息与其他检查区域以确定其间的差异，这种差异被分类为缺陷。使用矩阵技术内的向量梯度来完成检测，以开发候选和取消信息，然后在逻辑上操纵它们以对从每个像素矩阵获得的数据进行限定，然后在鉴定之后，确定是否检测到缺陷。本发明特别适用于检测在检查的光掩模内的图案角落处发生的缺陷，并且具体涉及克服先前在检测这些缺陷中遇到的困难。

10. 发明授权

US5737072A Automated photomask inspection apparatus and method 失效
公开(公告)号：US5737072A
公开(公告)日：1998-04-07
申请号：US726291
申请日：1996-10-04
申请人： David Garth Emery , Zain Kahuna Saidin , Mark J. Wihl , Tao-Yi Fu , Marek Zywno , Damon F. Kvamme , Michael E. Fein
发明人： David Garth Emery , Zain Kahuna Saidin , Mark J. Wihl , Tao-Yi Fu , Marek Zywno , Damon F. Kvamme , Michael E. Fein
IPC分类号： G01B11/30 , G01N21/88 , G01N21/93 , G01N21/94 , G01N21/956 , G03F1/00 , H01L21/027 , H01L21/66
CPC分类号： G03F1/84 , G01N21/95607 , G01N2021/95676
摘要： A method and apparatus for inspecting patterned transmissive substrates, such as photomasks, for unwanted particles and features occurring on the transmissive, opaque portions and at the transition regions of the opaque and transmissive portions of the substrate. A transmissive substrate is illuminated by a laser through an optical system comprised of a laser scanning system, individual transmitted and reflected light collection optics and detectors collect and generate signals representative of the light transmitted and reflected by the substrate as the substrate is scanned repeatedly in one axis in a serpentine pattern by a laser beam which is focused on the patterned substrate surface. The defect identification of the substrate is performed using only those transmitted and reflected light signals, and other signals derived from them, such as the second derivative of each of them. The actual defect identification is then performed by comparing combinations of at least two of those measured and derived signals. Simultaneously, defect and particle inspection using the same measured transmitted and reflected light signals. Additionally, phase shift and line widths on the substrate can also be performed simultaneously using the same transmitted light signal that is collected for defect analysis.

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