专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070217469A1 Laser diode stack side-pumped solid state laser 审中-公开
标题翻译：激光二极管堆叠侧泵浦固态激光器
公开(公告)号：US20070217469A1
公开(公告)日：2007-09-20
申请号：US11417726
申请日：2006-05-04
申请人： Mark DeFranza , David Dawson , Jason Farmer
发明人： Mark DeFranza , David Dawson , Jason Farmer
IPC分类号： H01S3/04 , H01S5/00
CPC分类号： H01S5/4025 , H01S3/061 , H01S3/0941 , H01S5/02264 , H01S5/02272 , H01S5/02469 , H01S5/4087
摘要： A side-pumped solid state laser utilizing a laser diode stack of laser diode submount assemblies is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode submount assembly includes a submount to which one or more laser diodes are attached. The radiation-emitting active layer of each laser diode is positioned substantially parallel to the mounting surfaces of the submount, causing the fast axis of each laser diode's output beam to be substantially orthogonal to the submount mounting surfaces. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. Preferably the laser diode stack is thermally coupled to a cooling block.
摘要翻译：提供了利用激光二极管底座组件的激光二极管堆叠的侧泵浦固态激光器。固体激光器的激光增益介质包含在由一对反射元件限定的激光腔内。每个激光二极管基座组件包括附接有一个或多个激光二极管的基座。每个激光二极管的辐射发射有源层基本上平行于基座的安装表面定位，使得每个激光二极管的输出光束的快轴基本上与底座安装表面正交。激光二极管可以是一个波长或多个波长。优选地，底座具有高的热导率和与激光二极管匹配的CTE。在基座的顶部，与激光二极管相邻，是间隔物。激光二极管堆叠通过将每个基座的底表面机械耦合到相邻的底座组件的间隔件而形成。优选地，激光二极管堆叠热耦合到冷却块。

2. 发明申请

US20070217470A1 Laser diode stack end-pumped solid state laser 审中-公开
标题翻译：激光二极管堆栈端泵浦固体激光器
公开(公告)号：US20070217470A1
公开(公告)日：2007-09-20
申请号：US11436232
申请日：2006-05-18
申请人： Mark DeFranza , David Dawson , Jason Farmer
发明人： Mark DeFranza , David Dawson , Jason Farmer
IPC分类号： H01S3/04 , H01S5/00
CPC分类号： H01S5/4025 , H01L2224/48091 , H01L2224/49111 , H01L2224/49175 , H01S3/061 , H01S3/09415 , H01S5/02264 , H01S5/02272 , H01S5/02469 , H01S5/4037 , H01S5/4087 , H01L2924/00012
摘要： An end-pumped solid state laser utilizing a laser diode stack of laser diode subassemblies as the pump source is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode subassembly includes a submount to which one or more laser diodes are attached. The fast axis corresponding to each output beam of each laser diode is substantially perpendicular to the mounting surfaces of the submount. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. Preferably the laser diode stack is thermally coupled to a cooling block.
摘要翻译：使用激光二极管组件的激光二极管叠层作为泵浦源的端泵浦固态激光器。固体激光器的激光增益介质包含在由一对反射元件限定的激光腔内。每个激光二极管子组件包括附接有一个或多个激光二极管的基座。对应于每个激光二极管的每个输出光束的快轴基本上垂直于底座的安装表面。激光二极管可以是一个波长或多个波长。优选地，底座具有高的热导率和与激光二极管匹配的CTE。在基座的顶部，与激光二极管相邻，是间隔物。激光二极管堆叠通过将每个基座的底表面机械耦合到相邻的底座组件的间隔件而形成。优选地，激光二极管堆叠热耦合到冷却块。

3. 发明申请

US20070217471A1 Laser diode stack utilizing a non-conductive submount 审中-公开
标题翻译：激光二极管堆叠采用非导电底座
公开(公告)号：US20070217471A1
公开(公告)日：2007-09-20
申请号：US11492140
申请日：2006-07-24
申请人： Mark DeFranza , David Dawson , Jason Farmer
发明人： Mark DeFranza , David Dawson , Jason Farmer
IPC分类号： H01S3/04 , H01S5/00
CPC分类号： H01S5/405 , H01S5/02272 , H01S5/02469 , H01S5/02476 , H01S5/4018
摘要： A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each laser diode submount assembly includes a submount comprised of a non-conductive material. At least one laser diode is attached to a first portion of one surface of each submount while a spacer is attached to a second portion of the same submount surface. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. The individual laser diodes of the fabricated stack can be serially coupled together, coupled together in parallel, or individually addressable. To provide package cooling, the laser diode stack is thermally coupled to a cooling block.
摘要翻译：提供了一种激光二极管封装，该封装包括多个激光二极管底座组件。每个激光二极管底座组件包括由非导电材料构成的基座。至少一个激光二极管附接到每个子安装座的一个表面的第一部分，而间隔件连接到同一基座表面的第二部分。优选地，底座具有高的热导率和与激光二极管匹配的CTE。激光二极管堆叠通过将每个基座的底表面机械耦合到相邻的底座组件的间隔件而形成。制造的叠层的各个激光二极管可以串联耦合在一起，并联耦合在一起或者可单独寻址。为了提供封装冷却，激光二极管堆叠热耦合到冷却块。

4. 发明申请

US20070217468A1 Laser diode package utilizing a laser diode stack 审中-公开
标题翻译：使用激光二极管叠层的激光二极管封装
公开(公告)号：US20070217468A1
公开(公告)日：2007-09-20
申请号：US11417581
申请日：2006-05-04
申请人： Mark DeFranza , David Dawson , Jason Farmer
发明人： Mark DeFranza , David Dawson , Jason Farmer
IPC分类号： H01S3/04 , H01S5/00
CPC分类号： H01S5/4025 , H01L2224/48091 , H01S5/02248 , H01S5/02264 , H01S5/02272 , H01S5/02469 , H01S5/02476 , H01S5/4018 , H01L2924/00014
摘要： A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each submount assembly includes a submount. At least one laser diode is attached to a front portion of each submount while a spacer, preferably comprised of an electrically isolating pad and an electrical contact pad, is attached to a rear portion of each submount. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the electrical contact pad, either directly or indirectly. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.
摘要翻译：提供了一种激光二极管封装，该封装包括多个激光二极管底座组件。每个子安装组件都包括一个子安装板。至少一个激光二极管连接到每个子安装座的前部，而优选地由电绝缘垫和电接触垫构成的间隔件附接到每个副安装座的后部。诸如导线或带状互连的电互连将激光二极管或二极管直接或间接地连接到电接触焊盘。优选地，激光二极管堆叠通过电气和机械地将每个子安装座的底表面电连接到相邻的底座组件的电接触焊盘而形成。激光二极管堆叠热耦合到冷却块。优选地，导热和电绝缘构件插入在激光二极管叠层和冷却块之间。

5. 发明申请

US20070217467A1 Laser diode package utilizing a laser diode stack 审中-公开
标题翻译：使用激光二极管叠层的激光二极管封装
公开(公告)号：US20070217467A1
公开(公告)日：2007-09-20
申请号：US11384940
申请日：2006-03-20
申请人： Mark DeFranza , David Dawson , Jason Farmer
发明人： Mark DeFranza , David Dawson , Jason Farmer
IPC分类号： H01S5/00
CPC分类号： H01S5/024 , H01L2224/34 , H01L2224/37599 , H01L2224/49175 , H01L2924/00014 , H01S5/02264 , H01S5/02272 , H01S5/4025 , H01L2224/37099
摘要： A laser diode package is provided. The laser diode package includes a plurality of laser diode submount assemblies, each assembly including a submount to which one or more laser diodes are attached. An electrically isolating pad is attached to the same surface of the submount as the laser diode. A metallization layer is deposited onto the outermost surface of the electrically isolating pad, to which an electrical contact pad is bonded. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the metallization layer. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.
摘要翻译：提供激光二极管封装。激光二极管封装包括多个激光二极管基座组件，每个组件包括附接有一个或多个激光二极管的基座。电绝缘垫连接到基座的与激光二极管相同的表面。金属化层沉积在电绝缘焊盘的最外表面上，电接触焊盘与之结合。诸如导线或带状互连的电互连将激光二极管或二极管连接到金属化层。优选地，激光二极管堆叠通过电气和机械地将每个子安装座的底表面电连接到相邻的底座组件的电接触焊盘而形成。激光二极管堆叠热耦合到冷却块。优选地，导热和电绝缘构件插入在激光二极管叠层和冷却块之间。

6. 发明申请

US20180309264A1 LOW SWAP TWO-PHASE COOLED DIODE LASER PACKAGE 审中-公开
公开(公告)号：US20180309264A1
公开(公告)日：2018-10-25
申请号：US15961750
申请日：2018-04-24
申请人： Manoj Kanskar , Mark DeFranza
发明人： Manoj Kanskar , Mark DeFranza
IPC分类号： H01S5/024 , H01S5/00
CPC分类号： H01S5/02423 , H01S5/005 , H01S5/0071 , H01S5/02216 , H01S5/02252 , H01S5/02284 , H01S5/02469 , H01S5/02492 , H01S5/4012 , H01S5/4056
摘要： Apparatus include a conductive block including a base surface and a plurality of parallel stepped surfaces opposite the base surface and defining respective mounting surfaces situated to receive respective laser diodes having respective thermal paths defining a common thermal path distance from the mounting surfaces to the base surface, and a two-phase cooling unit including a coupling surface attached to the base surface of the conductive block and wherein the two-phase cooling unit is situated to conduct heat generated through the emission of laser beams from the laser diodes along the thermal paths.

7. 发明申请

US20190252863A1 DIODE LASER APPARATUS WITH FAC LENS OUT-OF-PLANE BEAM STEERING 审中-公开
公开(公告)号：US20190252863A1
公开(公告)日：2019-08-15
申请号：US16269387
申请日：2019-02-06
申请人： Zhigang Chen , Manoj Kanskar , Shuang Li , Jim Zhang , Mark DeFranza , David Martin Hemenway , Eric Martin , Jay Small
发明人： Zhigang Chen , Manoj Kanskar , Shuang Li , Jim Zhang , Mark DeFranza , David Martin Hemenway , Eric Martin , Jay Small
IPC分类号： H01S5/40 , H01S5/022
摘要： Apparatus include a first laser diode situated to emit a beam from an exit facet along an optical axis, the beam as emitted having perpendicular fast and slow axes perpendicular to the optical axis, a first fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the first laser diode, a second laser diode situated to emit a beam from an exit facet of the second laser diode along an optical axis parallel to the optical axis of the first laser diode and with a slow axis in a common plane with the slow axis of the first laser diode, and a second fast axis collimator (FAC) optically coupled to the beam as emitted from the exit facet of the second laser diode and configured to direct the beam along a redirected beam axis having a non-zero angle with respect to the optical axis of the second laser diode.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式