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1. 发明授权

US06193135B1 System for providing back-lighting of components during fluxless soldering 失效
标题翻译：在无焊接焊接期间提供部件背光照明的系统
公开(公告)号：US06193135B1
公开(公告)日：2001-02-27
申请号：US09394983
申请日：1999-09-13
申请人： Lu Fang , Brian Dale Pottelger , Dominic Paul Rinaudo , Frederick Arthur Yeagle
发明人： Lu Fang , Brian Dale Pottelger , Dominic Paul Rinaudo , Frederick Arthur Yeagle
IPC分类号： B23K100
CPC分类号： B23K1/012 , B23H1/00 , B23K35/383 , B23K2101/36
摘要： An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i.e., the inert gases provide a “shield” or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering. The apparatus may also include an optics holder for transmitting light from an external light source into the enclosure, to permit visual alignment of component parts.
摘要翻译：用于进行无流动焊接的装置包括具有气体入口的外壳，惰性气体通过该入口引入以产生惰性气体富含环境。组件通过一个进入口放置在外壳中，该进入口也起排气口的作用，以便吹扫气体从外壳排出。在一个实施例中，在外壳中提供加热台，其提供足够的热量以回流在两个或更多个部件之间提供的焊料。惰性气体不断流动，或者吹扫外壳以便置换最初存在于系统中的氧气。不含其它材料的惰性气体的存在提供无氧环境，即，惰性气体在待焊接的部件周围提供“屏蔽”或环境，以在焊接期间抑制附加氧化物的形成。该装置还可以包括用于将光从外部光源传输到外壳中的光学保持器，以允许组件的视觉对准。

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