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1. 发明专利

JP2010177340A Dicing method and expanding apparatus 有权
标题翻译：定标方法和扩展装置
公开(公告)号：JP2010177340A
公开(公告)日：2010-08-12
申请号：JP2009016612
申请日：2009-01-28
申请人： Laser Gijutsu Sogo Kenkyusho , Panasonic Electric Works Co Ltd , Tohoku Univ , パナソニック電工株式会社 , 国立大学法人東北大学 , 財団法人レーザー技術総合研究所
发明人： TANAKA HIDEJI , ESASHI MASAKI , YOSHIDA KAZUJI , TOMII KAZUYUKI , FUJITA MASAYUKI , MIYANAGA NORIAKI , NAKADA YOSHIKI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a dicing method and an expanding apparatus by which a wafer is divided precisely into individual chips collectively regardless of a type of the wafer, and a manufacturing yield is improved. SOLUTION: In an expanding process in the dicing method, a peripheral part of an adhesive resin tape 30 is fixed onto a table 41, and a ring stage 43 and a pressing stage 44 which are disposed inside the table 41 and hold a wafer ring 42, are raised relatively to a virtual plane including a surface to which the adhesive resin tape 30 is fixed, of the table 41 so as to perform a stretching step of stretching the adhesive resin tape 30 over the wafer ring 42. A dividing step is then performed wherein the pressing stage 44 is raised to expand the adhesive resin tape 30 and a bending stress is applied to a wafer 10 to divide the wafer into individual chips 1, and then, a restretching step is performed wherein the ring stage 43 is furthermore raised relatively to the virtual plane to stretch again the adhesive resin tape 30 over the wafer ring 42. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种切片方法和扩展装置，通过该切割方法和扩展装置，不管晶片的类型如何，晶片都被精确地划分成单独的芯片，并且提高了制造成品率。解决方案：在切割方法的扩展过程中，粘合树脂带30的周边部分固定在台41上，环台43和压制台44设置在工作台41的内部并保持晶片环42相对于包括固定有粘合树脂带30的表面的虚拟平面而升高，以便执行将粘合树脂带30拉伸在晶片环42上的拉伸步骤。分割然后进行步骤，其中按压台44升高以使粘合树脂带30膨胀，并且将弯曲应力施加到晶片10以将晶片分成单独的芯片1，然后进行再拉伸步骤，其中环形台43 进一步相对于虚拟平面升高，以将粘合树脂带30再次拉伸在晶片环42上。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009023215A Dividing method of laminate 有权
标题翻译：分层方法
公开(公告)号：JP2009023215A
公开(公告)日：2009-02-05
申请号：JP2007188511
申请日：2007-07-19
申请人： Laser Gijutsu Sogo Kenkyusho , Panasonic Electric Works Co Ltd , Tohoku Univ , パナソニック電工株式会社 , 国立大学法人東北大学 , 財団法人レーザー技術総合研究所
发明人： YOSHIDA KAZUJI , KUBO MASAO , FUJITA MASAYUKI , TANAKA HIDEJI , ESASHI MASAKI
IPC分类号： B28D5/00 , B23K26/38 , B23K26/40 , B32B17/06 , C03B33/09
CPC分类号： B23K26/0057 , B23K26/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To provide a dividing method of a laminate capable of dividing the laminate at a low cost while preventing breakage of the laminate having a laminate structure of a translucent material layer and a crystalline material layer.
SOLUTION: The dividing method of the laminate is provided with a modified part forming process for forming modified parts 20a and 20b on a surface 13 of the crystalline material layer (Si substrate) 12 on the translucent material layer (glass substrate) 11 side and in an inside of the translucent material layer 11 respectively by irradiating laser beams LBa and LBb to the surface 13 of the crystalline material layer 12 on the translucent material layer 11 side and the inside of the translucent material layer 11 respectively along a desired division schedule line L, and a dividing process for dividing the laminate 10 along the division schedule line L while having the modified parts 20a and 20b as the division starting points by thermal stress generated by partially imparting temperature change on the laminate 10 after the modified part forming process.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了提供能够以低成本分割层压体的层压体的分割方法，同时防止具有半透明材料层和结晶材料层的层叠结构的层压体的断裂。解决方案：层压体的分割方法设置有在半透明材料层（玻璃基板）11上的结晶材料层（Si基板）12的表面13上形成改性部分20a和20b的改性部分形成工艺分别通过将激光束LBa和LBb照射到半透明材料层11侧的半透明材料层11侧和透光性材料层11的内部的结晶材料层12的表面13，分别沿着期望的分割时间表线L，以及分割处理，用于沿着分割时间表线L分割层压体10，同时通过在改性部分形成之后在层压体10上部分地施加温度变化而产生的热应力使修改部分20a和20b作为分割开始点处理。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2010177341A Method for cutting laminate 审中-公开
标题翻译：切割层压板的方法
公开(公告)号：JP2010177341A
公开(公告)日：2010-08-12
申请号：JP2009016613
申请日：2009-01-28
申请人： Laser Gijutsu Sogo Kenkyusho , Panasonic Electric Works Co Ltd , Tohoku Univ , パナソニック電工株式会社 , 国立大学法人東北大学 , 財団法人レーザー技術総合研究所
发明人： FUJITA MASAYUKI , YOSHIDA KAZUJI , TOMII KAZUYUKI , ESASHI MASAKI , TANAKA HIDEJI
IPC分类号： H01L21/301 , B23K26/00 , B23K26/38
摘要： PROBLEM TO BE SOLVED: To provide a method for cutting a laminate, which is capable of more easily cutting the laminate formed by direct bonding of an Si substrate and a glass substrate and is capable of enhancing smoothness of a cut cross-section of the glass surface. SOLUTION: In the method for cutting the laminate 10 wherein a single crystal Si substrate 11 and a glass substrate 11 are directly bonded to each other, a stress concentration portion forming step is performed wherein a stress concentration portion 20 is formed on the side of the glass substrate 12 of the Si substrate 11 along a cutting scheduled line L as shown in Fig.1(a). Subsequently, a laser irradiation step is performed wherein a laser beam LBb from an infrared laser is radiated along the stress concentration portion 20 as shown in Fig.1(b) to give a temperature change to the stress concentration portion 20, and then, an expanding step of expanding an adhesive resin tape having the laminate 10 stuck thereto is performed. The laser irradiation step and the expanding step constitute a cutting step of applying stress to the stress concentration portion 20 of the laminate 10 to cut the laminate 10. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种能够更容易地切割由Si基板和玻璃基板直接接合形成的层叠体的层叠体切断方法，能够提高切断面的平滑性的玻璃表面。解决方案：在将单晶Si衬底11和玻璃衬底11彼此直接接合的层压体10的切割方法中，应力集中部分形成步骤被执行，其中应力集中部分20形成在如图1（a）所示，沿着切断预定线L，Si基板11的玻璃基板12的侧面。随后，如图1（b）所示，沿着应力集中部20照射来自红外线激光的激光束LBb，对应力集中部20进行温度变化，进行激光照射工序，进行使贴附有层叠体10的粘合树脂带膨胀的膨胀工序。激光照射步骤和扩展步骤构成对层压体10的应力集中部分20施加应力以切割层压体10的切割步骤。（C）2010，JPO＆INPIT

4. 发明专利

JP2009010048A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2009010048A
公开(公告)日：2009-01-15
申请号：JP2007168223
申请日：2007-06-26
申请人： Panasonic Electric Works Co Ltd , パナソニック電工株式会社
发明人： TANAKA KENICHIRO , KAMAKURA MASANAO , YOSHIDA KAZUJI , KIRIHARA MASAO , NAKASUJI TAKESHI , SHIROISHI HISATOKU , TAURA TAKUMI
IPC分类号： H01L33/56 , H01L33/62
CPC分类号： H01L2224/32225 , H01L2224/48227 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/00 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device which can detect the light emitted from an LED chip and establish high efficiency of light-extraction to the outside. SOLUTION: The light-emitting device is provided with an LED chip 1 to emit visible light, a mounting substrate 2 wherein a housing recessed part 2a for housing the LED chip 1 is formed on one surface thereof and the LED chip 1 is mounted on the inner bottom of the housing recessed part 2a; a translucent member 4 which is fixed onto the mounting substrate 2, in a manner of blocking the housing recessed part 2a on the one surface of the mounting substrate 2; and an optical detection part 3 wherein a light-receiving part is formed around the housing recessed part 2a on the one surface of the mounting substrate 2 so as to receive the light emitted from the LED chip 1. The translucent member 4 is provided with a light-extracting surface 41 wherein lights emitted from the LED chip 1 are refracted and discharged to the air, and a reflecting part 42 which guides the light emitted from the LED chip 1 to the light-receiving surface of the light-receiving part by total reflection by the difference of refraction index. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以检测从LED芯片发出的光并且向外部建立高效率的光提取的发光装置。解决方案：发光装置设置有用于发射可见光的LED芯片1，安装基板2，其中在其一个表面上形成有用于容纳LED芯片1的壳体凹部2a，并且LED芯片1是安装在壳体凹部2a的内底上; 固定在安装基板2上的半透明部件4，以将安装基板2的一个面上的壳体凹部2a挡住的方式，以及光检测部3，其中，在安装基板2的一个表面上的壳体凹部2a周围形成有光接收部，以接收从LED芯片1发射的光。透光部件4设置有从LED芯片1发射的光被折射并排出到空气中的光提取面41和将从LED芯片1发射的光引导到光接收部的受光面的反射部42，反射的折射率差异。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2010011547A Power generation device 有权
标题翻译：发电装置
公开(公告)号：JP2010011547A
公开(公告)日：2010-01-14
申请号：JP2008164678
申请日：2008-06-24
申请人： Panasonic Electric Works Co Ltd , パナソニック電工株式会社
发明人： YOSHIDA KAZUJI , TAKANO HITOMICHI
IPC分类号： H02N1/00 , G06F1/26 , H01G5/01 , H01G5/14
摘要： PROBLEM TO BE SOLVED: To provide a power generation device whose planar size can be reduced. SOLUTION: The power generation device includes: a base substrate 10; a frame portion 21 bonded to one surface side of the base substrate 10; an oscillator 23 placed away from the base substrate 10 inside the frame portion 21; a pair of support spring portions 22, 22 that are disposed so that the oscillator 23 is sandwiched therebetween inside the frame portion 21 and couple the frame portion 21 and the oscillator 23 together; a variable capacitance capacitor 26 comprised of a fixed electrode 24 provided on the frame portion 21 and a movable electrode 25 provided on the oscillator 23; and an electret 30 (voltage applying means) for applying voltage to the variable capacitance capacitor 26. Each of the support spring portions 22, 22 is comprised of a torsion spring that can be deformed under torsion so that the oscillator 23 can freely oscillate on the frame portion 21. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供可以减小其平面尺寸的发电装置。发电装置包括：基底基板10; 接合到基底基板10的一个表面侧的框架部分21; 在框架部分21内部远离基底基板10放置的振荡器23; 一对支撑弹簧部分22,22，被布置为使得振荡器23夹在框架部分21之间并将框架部分21和振荡器23连接在一起; 包括设置在框架部分21上的固定电极24和设置在振荡器23上的可移动电极25的可变电容电容器26; 以及用于向可变电容电容器26施加电压的驻极体30（电压施加装置）。每个支撑弹簧部分22,22由扭转弹簧构成，扭转弹簧可以在扭转下变形，使得振荡器23可以在框架部分21.版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009177099A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2009177099A
公开(公告)日：2009-08-06
申请号：JP2008016917
申请日：2008-01-28
申请人： Panasonic Electric Works Co Ltd , パナソニック電工株式会社
发明人： YOSHIDA KAZUJI
IPC分类号： H01L33/48 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that has a structure, in which multiple photodetection elements each independently detecting a light beam emitted from one of multiple light-emitting elements are integrated into a package, and that can prevent the reduction in detection accuracy of each photodetection element resulting from leak current between the photodetection elements. SOLUTION: In a light-emitting device, a package 2 includes: a mounting substrate 2a where housing recesses 2b for housing multiple LED chips (light-emitting elements) 1a through 1d are formed on one surface thereof; and a photodetection element formation substrate 40 that is formed by using a silicon substrate (semiconductor substrate) 40a and is bonded to the one surface side of the mounting substrate 2a. The photodetection element formation substrate 40 has a light extracting hole 41 in communication with the housing recesses 2b and light-receiving surfaces that are formed for the respective photodetection elements and are provided around the light extracting hole 41 on the surface side facing the housing recesses 2b, and is split into small pieces 42 each having one photodetection element by multiple splitting slits 49 formed so as to be spaced apart from each other in a circumferential direction of the light extracting hole 41. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种具有以下结构的发光装置，其中多个光检测元件各自独立地检测从多个发光元件中的一个发射的光束被集成到封装中，并且可以防止由光检测元件之间的漏电流导致的每个光检测元件的检测精度的降低。解决方案：在发光装置中，封装2包括：安装基板2a，其在其一个表面上形成有用于容纳多个LED芯片（发光元件）1a至1d的壳体凹部2b; 以及通过使用硅衬底（半导体衬底）40a形成并且被结合到安装衬底2a的一个表面侧的光电检测元件形成衬底40。光检测元件形成基板40具有与壳体凹部2b连通的光取出孔41和形成于各光检测元件的受光面，并且设置在面向壳体凹部2b的表面侧的光取出孔41周围并且被分割成具有通过多个分割狭缝49的一个光电检测元件的小片42，所述多个分割狭缝49在光提取孔41的圆周方向上彼此间隔开。版权所有：（C）2009，JPO＆INPIT

7. 发明专利

JP2009158505A Light emitting device and manufacturing method thereof 有权
标题翻译：发光装置及其制造方法
公开(公告)号：JP2009158505A
公开(公告)日：2009-07-16
申请号：JP2007331445
申请日：2007-12-25
申请人： Panasonic Electric Works Co Ltd , パナソニック電工株式会社
发明人： KAMAKURA MASANAO , TANAKA KENICHIRO , YOSHIDA KAZUJI , KIRIHARA MASAO , SHIROISHI HISATOKU , TAURA TAKUMI , NAKASUJI TAKESHI
IPC分类号： H01L33/48 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device capable of suppressing output variation of an optical detection unit due to a rise in temperature of an LED chip although employing constitution such that the optical detection unit composed of a photodiode detecting light emitted from the LED chip is integrally provided to a package, and a manufacturing method thereof. SOLUTION: The light emitting device includes the LED chip 1 and the package 2 made of a semiconductor material (silicon) and containing the LED chip 1, and is provided with the optical detection unit 4 composed of the photodiode detecting the light emitted from the LED chip 1 integrally with the package 2. The package 2 includes a heat insulating portion 6 which stops heat conduction from the LED chip 1 to the optical detection unit 4. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够抑制由于LED芯片的温度升高引起的光学检测单元的输出变化的发光器件，尽管采用如下结构，使得由光电二极管检测发光的光检测单元从LED芯片一体地提供给封装，及其制造方法。解决方案：发光器件包括LED芯片1和由半导体材料（硅）制成并且包含LED芯片1的封装2，并且设置有由检测发射的光的光电二极管组成的光学检测单元4 从LED芯片1与封装2一体化。封装2包括绝热部分6，其阻止从LED芯片1到光学检测单元4的热传导。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2009010044A Light emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2009010044A
公开(公告)日：2009-01-15
申请号：JP2007168191
申请日：2007-06-26
申请人： Panasonic Electric Works Co Ltd , パナソニック電工株式会社
发明人： YOSHIDA KAZUJI , KAMAKURA MASANAO , KIRIHARA MASAO , NAKASUJI TAKESHI , TANAKA KENICHIRO , SHIROISHI HISATOKU , TAURA TAKUMI
IPC分类号： H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device capable of improving detection precision of a light detection unit detecting light emitted by an LED chip.
SOLUTION: The light emitting device has the LED chip 1 and a package 10 in which the LED chip 1 is stored, wherein the package 10 is provided with a light detecting element (light detection unit) 4 which detects the light emitted by the LED chip 1 and a temperature detecting element (temperature detection unit) 5 which detects the temperature of the light detecting element 4. The light detecting element 4 is composed of a photodiode, and the temperature detecting element 5 is composed of a diode which has the same diode structure as that of the photodiode and also has a light shield structure blocking light incident on the diode structure. Here, the temperature detecting element 5 has, as the light shield structure, a first light shield film 45 blocking light incident from the LED chip 1 and a second light shield film 46 blocking light incident from outside.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够提高检测由LED芯片发出的光的光检测单元的检测精度的发光装置。解决方案：发光器件具有LED芯片1和其中存储LED芯片1的封装10，其中封装10设置有光检测元件（光检测单元）4，光检测元件（光检测单元）4检测由 LED芯片1和检测光检测元件4的温度的温度检测元件（温度检测单元）5。光检测元件4由光电二极管构成，温度检测元件5由具有与光电二极管相同的二极管结构，并且还具有阻挡入射在二极管结构上的光的遮光结构。这里，温度检测元件5具有遮挡从LED芯片1入射的光的第一遮光膜45和遮挡从外部入射的光的第二遮光膜46作为遮光结构。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2011177019A Portable thermoelectric generator 审中-公开
标题翻译：便携式热电发生器
公开(公告)号：JP2011177019A
公开(公告)日：2011-09-08
申请号：JP2011085072
申请日：2011-04-07
申请人： Panasonic Electric Works Co Ltd , パナソニック電工株式会社
发明人： SAITO HIROSHI , TOMONARI SHIGEAKI , YOSHIDA KAZUJI
IPC分类号： H02N11/00 , H01L35/30
摘要： PROBLEM TO BE SOLVED: To provide a portable thermoelectric generator which can attain more miniaturization, slimness and weight reduction of the whole apparatus and produce larger power output than before.
SOLUTION: The thermoelectric generator 11 is structured so that a power generation unit 2 having a number of thermoelectric elements 7 is retained between a heat input part 3 for heating the heat generation unit 2 by burning fuel and a heat radiation part 5 for radiating heat generated from the power generation unit 2. The heat radiation part 5 has a flow path 23 for cooling liquid therein and cools the power generation unit 2 with the evaporation heat of the cooling liquid flowing inside the flow path 23.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种便携式热电发电机，其能够实现整个装置的更小型化，细长度和重量减轻，并且产生比以前更大的功率输出。解决方案：热电发电机11的结构使得具有多个热电元件7的发电单元2被保持在用于通过燃烧燃料加热发热单元2的热输入部分3和用于散发从发电单元2产生的热量。散热部分5具有用于冷却液体的流路23，并且在流路23内流动的冷却液的蒸发热使发电单元2冷却。：（C）2011，JPO＆INPIT

10. 发明专利

JP2010216846A Sensor device 有权
标题翻译：传感器设备
公开(公告)号：JP2010216846A
公开(公告)日：2010-09-30
申请号：JP2009060990
申请日：2009-03-13
申请人： Panasonic Electric Works Co Ltd , パナソニック電工株式会社
发明人： YOSHIDA KAZUJI , TAKANO HITOMICHI
IPC分类号： G01L9/00 , G01K1/02 , G01K7/18 , G01K7/20 , G08C17/00 , H01L41/08 , H01L41/187
摘要： PROBLEM TO BE SOLVED: To provide a sensor device operable without being supplied with external electric power. SOLUTION: The sensor device includes: a base substrate 10 that is formed using a first glass substrate 10a; an oscillator formation substrate 20 having a frame 21 that is formed using a semiconductor substrate 20a and fixed to one surface side of the base substrate 10 and an oscillator 23 that is disposed inside the frame 21 and swingingly supported via a flexible deflection part 22; a cover substrate 30 that is formed using a second glass substrate 30a and fixed to the oscillator formation substrate 20 so as to form a displacement space 35 between the cover substrate and the oscillator formation substrate 20 in which the oscillator 23 is displaceable; a power generation part 24 that is formed in the deflection part 22 and composed of a piezoelectric transducing part for generating an AC voltage according to the oscillation of the oscillator 23; and a sensor 25 that is composed of a movable electrode 27 also disposed in a diaphragm 26 of the frame 21 and a fixed electrode 37 disposed on the cover substrate 30 and biased by the AC voltage from the power generation part 24. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供可在不被外部电力供应的情况下操作的传感器装置。传感器装置包括：使用第一玻璃基板10a形成的基底基板10; 具有使用半导体基板20a形成并固定在基板10的一个表面侧上的框架21的振荡器形成基板20和设置在框架21的内部并通过柔性偏转部22摆动支撑的振荡器23; 覆盖基板30，其使用第二玻璃基板30a形成并固定到振荡器形成基板20，以在盖基板和振荡器形成基板20之间形成位移空间35，振荡器23可位移; 形成在偏转部22中并由根据振荡器23的振荡产生AC电压的压电换能部构成的发电部24; 以及还设置在框架21的隔膜26中的可动电极27和设置在盖基板30上并由来自发电部24的交流电压偏置的固定电极37的传感器25。（C）2010，JPO＆INPIT

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