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1. 发明申请

US20070065653A1 Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices 审中-公开
公开(公告)号：US20070065653A1
公开(公告)日：2007-03-22
申请号：US11603151
申请日：2006-11-22
申请人： Kouichi Meguro , Toru Nishino , Noboru Hayasaka
发明人： Kouichi Meguro , Toru Nishino , Noboru Hayasaka
IPC分类号： B32B3/26 , B32B3/00 , B32B3/02
CPC分类号： H01L21/4846 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , Y10T428/21 , Y10T428/249953 , Y10T428/249971 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

2. 发明授权

US07157311B2 Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices 有权
标题翻译：半导体装置用基板片材及其制造方法，使用基板片材的成型方法，半导体装置的制造方法
公开(公告)号：US07157311B2
公开(公告)日：2007-01-02
申请号：US10718677
申请日：2003-11-24
申请人： Kouichi Meguro , Toru Nishino , Noboru Hayasaka
发明人： Kouichi Meguro , Toru Nishino , Noboru Hayasaka
IPC分类号： H01L21/50
CPC分类号： H01L21/4846 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , Y10T428/21 , Y10T428/249953 , Y10T428/249971 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.
摘要翻译：半导体装置用基板材料及其制造方法以及使用该基板片材的半导体装置的制造方法，即使在形成于基板片材中的多个半导体芯片也能够抑制和减少基板片材中可能发生的翘曲材料一次成型。在基板片材中形成用于制造半导体封装的多个基板。将基材片材的外部构造制成圆形。

3. 发明授权

US07056770B2 Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material 有权
标题翻译：树脂封装方法，树脂封装装置，半导体器件制造方法，半导体器件和树脂材料
公开(公告)号：US07056770B2
公开(公告)日：2006-06-06
申请号：US10719379
申请日：2003-11-20
申请人： Hiroshi Uragami , Osamu Nakagawa , Kinya Fujino , Shinji Takase , Hideki Tokuyama , Koichi Meguro , Toru Nishino , Noboru Hayasaka
发明人： Hiroshi Uragami , Osamu Nakagawa , Kinya Fujino , Shinji Takase , Hideki Tokuyama , Koichi Meguro , Toru Nishino , Noboru Hayasaka
IPC分类号： H01L21/44
CPC分类号： H01L21/565 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.
摘要翻译：首先，将板放置在具有下模具的板安装部分上，并且打开上模具。然后，具有与形成在下模具中的空腔的尺寸和形状相对应的尺寸和形状的树脂材料装配在空腔中。此后，加热树脂材料，使其熔化。此后，下模和上模封闭，上模和下模形成的空间减压。结果，芯片和电线被浸入熔融的树脂中。之后，设定熔融树脂，从而形成包括该板和固化树脂的树脂模制品。

4. 发明授权

US08769810B2 Part mounting method 有权
标题翻译：零件安装方法
公开(公告)号：US08769810B2
公开(公告)日：2014-07-08
申请号：US12699958
申请日：2010-02-04
申请人： Toru Nishino , Kazuyuki Ikura
发明人： Toru Nishino , Kazuyuki Ikura
IPC分类号： H05K3/30 , H05K13/00 , H05K13/04 , H05K13/08 , H01L21/70 , H01L21/82 , H01L23/00 , H01L25/00
CPC分类号： H05K13/0015 , H01L21/70 , H01L21/82 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/85 , H01L25/50 , H01L27/14601 , H01L31/18 , H01L2224/16 , H01L2224/279 , H01L2224/43 , H01L2224/75 , H01L2224/75743 , H01L2224/81121 , H01L2224/81801 , H01L2224/82 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H05K13/0413 , H05K13/0452 , H05K13/0478 , H05K13/08 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49147 , Y10T29/49169 , Y10T29/53174 , H01L2224/0401 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.
摘要翻译：将第一安装部件和第二安装部件安装到基板的部件安装方法包括：拍摄第二安装部件的构造的图像并执行图像识别，基于所述第一安装部件的结果将所述第一安装部件安装到所述板上对第二安装部件的构造进行图像识别，以及基于安装到板的第一安装部件的图像识别的结果将第二安装部件安装到基板。

5. 发明授权

US07276924B2 Electrical connecting method 有权
标题翻译：电气连接方式
公开(公告)号：US07276924B2
公开(公告)日：2007-10-02
申请号：US10937401
申请日：2004-09-10
申请人： Shigeyuki Maruyama , Toru Nishino
发明人： Shigeyuki Maruyama , Toru Nishino
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R31/2875 , G01R1/0735
摘要： An electrical connecting method has the step of bringing a contact member connected to an electric circuit into contact with a terminal of an electronic part. A desired processing is performed by feeding current to the terminal via the contact member. The contact member is then separated from the terminal. When the contact member is brought into contact with the terminal, energy is applied to the contact member or the terminal in order to locally soften a portion of the terminal contacting the contact member. Thereafter, the desired processing is performed, in the state that the contacting portion of the terminal with the contact member is softened so as to reduce the contact resistance and so as to increase the subsequent separatability of the contact member from the terminal.
摘要翻译：电连接方法具有使与电路连接的接触构件与电子部件的端子接触的步骤。通过经由接触构件将电流馈送到端子来执行所需的处理。然后将接触构件与端子分离。当接触构件与端子接触时，能量被施加到接触构件或端子，以便局部软化接触接触构件的端子的一部分。此后，在端子与接触构件的接触部分被软化以便降低接触电阻并且增加接触构件与端子的随后的分离性的状态下进行所需的处理。

6. 发明申请

US20100325884A1 MOUNTING APPARATUS AND MOUNTING METHOD 有权
标题翻译：安装设备和安装方法
公开(公告)号：US20100325884A1
公开(公告)日：2010-12-30
申请号：US12824707
申请日：2010-06-28
申请人： Toru Nishino , Kazuyuki Ikura
发明人： Toru Nishino , Kazuyuki Ikura
IPC分类号： H05K3/30 , H05K13/04
CPC分类号： H05K3/305 , H05K2203/0195 , H05K2203/1115 , Y02P70/613 , Y10T29/49131 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.
摘要翻译：一种安装装置，包括：台架装置，其上设置有安装基板和部件;垂直设置在平台装置上方的抽吸头，所述抽吸单元沿垂直于所述平台装置的方向移动，附接到所述抽吸头的接触件与构件的电极接触，垂直设置在吸头上方的照相机，照相机沿垂直于吸头的方向移动;以及控制单元，其控制舞台装置的操作，吸头的操作，接触电，以及相机的操作。

7. 发明申请

US20070222070A1 Contact piece member, contactor and contact method 有权
标题翻译：接触件，接触器和接触方式
公开(公告)号：US20070222070A1
公开(公告)日：2007-09-27
申请号：US11802315
申请日：2007-05-22
申请人： Shigeyuki Maruyama , Toru Nishino
发明人： Shigeyuki Maruyama , Toru Nishino
IPC分类号： H01L23/48
CPC分类号： G01R1/06755 , H01L2924/0002 , H01L2924/00
摘要： In a contactor contact piece members can be arranged at a fine pitch, and a contact can be made surely by a small contact pressure. The contact piece members electrically connect an electronic part to an external circuit. The contact piece member is formed of an electrically conductive material in a generally spherical shape. A molecular density of a central part of the contact piece member is lower than a molecular density of a part near a surface. The electrically conductive material may include at least one of an electrically conductive fine particle, an electrically conductive fiber and an electrically conductive filler.
摘要翻译：在接触器中，接触件部件可以以细间距布置，并且可以通过小的接触压力可靠地进行接触。接触件将电子部件电连接到外部电路。接触片部件由大致球形的导电材料形成。接触片构件的中心部分的分子密度低于靠近表面的部分的分子密度。导电材料可以包括导电细颗粒，导电纤维和导电填料中的至少一种。

8. 发明申请

US20050189649A1 LSI package, LSI element testing method, and semiconductor device manufacturing method 有权
标题翻译： LSI封装，LSI元件测试方法和半导体器件制造方法
公开(公告)号：US20050189649A1
公开(公告)日：2005-09-01
申请号：US11113063
申请日：2005-04-25
申请人： Shigeyuki Maruyama , Toru Nishino , Kazuhiro Tashiro
发明人： Shigeyuki Maruyama , Toru Nishino , Kazuhiro Tashiro
IPC分类号： G01R31/28 , H01L21/44 , H01L21/60 , H01L21/68 , H01L23/48 , H01L23/498 , H01L23/58
CPC分类号： H01L23/49838 , G01R31/2886 , H01L21/6835 , H01L22/32 , H01L24/48 , H01L24/72 , H01L24/81 , H01L2221/68354 , H01L2224/0401 , H01L2224/05599 , H01L2224/05624 , H01L2224/16 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/81193 , H01L2224/81801 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12044 , H01L2924/15173 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An LSI package comprises an LSI element and a wiring board. The plurality of pin terminals of the LSI element each includes a first conductive layer and a second conductive layer superposed on the first conductive layer. The plurality of pin terminals of the wiring board each includes a third conductive layer joined to the second conductive layer, and the wiring board further comprises outer joining terminals. The first, second, and third conductive layers are made of materials causing the metallic bond between the second conductive layer and third conductive layer to be stronger than the metallic bond between the first conductive layer and second conductive layer. The LSI element is tested using the outer joining terminals of the wiring board. The second conductive layer and third conductive layer are joined to attain a metallic bond through aggregation derived from pressure, and are reliably brought into electrical contact with each other for a test. After the test is completed, the terminals of the LSI element are peeled off from the terminals of the wiring board. At this time, the second conductive layer is transferred to the third conductive layer, and the first conductive layer is left intact in each of the terminals of the LSI element. The LSI element is then mounted on another wiring board.
摘要翻译： LSI封装包括LSI元件和布线板。 LSI元件的多个引脚端子各自包括叠置在第一导电层上的第一导电层和第二导电层。布线基板的多个引脚端子各自包括接合到第二导电层的第三导电层，并且布线板还包括外连接端子。第一，第二和第三导电层由使得第二导电层和第三导电层之间的金属键合比第一导电层和第二导电层之间的金属键更强的材料制成。使用布线板的外部接合端子来测试LSI元件。第二导电层和第三导电层被接合以通过来自压力的聚集获得金属键，并且可靠地彼此进行电接触以进行测试。测试完成后，LSI元件的端子从布线板的端子剥离。此时，第二导电层被转移到第三导电层，并且第一导电层在LSI元件的每个端子中保持完整。然后将LSI元件安装在另一个布线板上。

9. 发明授权

US08471901B2 Image input module adjusting device and image input module adjusting method 有权
标题翻译：图像输入模块调整装置和图像输入模块调整方法
公开(公告)号：US08471901B2
公开(公告)日：2013-06-25
申请号：US12170510
申请日：2008-07-10
申请人： Toru Nishino , Koichi Shimamura
发明人： Toru Nishino , Koichi Shimamura
IPC分类号： H04N7/18
CPC分类号： G02B7/005 , G02B7/023 , G02B7/10 , H04N5/2254 , H04N5/2257
摘要： An image input module adjusting device includes a board moving mechanism configured to movably hold a board in directions crossing each other; a board moving restriction mechanism configured to restrict movement of the board; an engaging member moving mechanism configured to move an engaging member engaged with a position adjusting component provided on the board; a control part configured to drive the engaging member moving mechanism while allowing the board moving restriction mechanism to move the board, to move and thereby the engaging member is engaged with the position adjusting component and the board is moved to an adjusting original position; a lens position adjusting mechanism configured to perform the position adjusting of the lens; and a focus adjusting mechanism configured to perform the focus adjusting of the lens relative to the image input sensor while the movement of the board is restricted.
摘要翻译：图像输入模块调整装置包括：板移动机构，其构造成在彼此交叉的方向上可移动地保持板; 板移动限制机构，其构造成限制所述板的移动; 接合构件移动机构，其构造成移动与设置在所述板上的位置调整构件接合的接合构件; 控制部，其配置为在允许所述板移动限制机构移动所述板的同时驱动所述接合构件移动机构，从而移动，从而所述接合构件与所述位置调整构件接合，并且所述板移动到调整原始位置; 透镜位置调节机构，被配置为执行所述透镜的位置调整; 以及焦点调节机构，被配置为当所述板的移动被限制时，相对于所述图像输入传感器执行所述透镜的聚焦调整。

10. 发明授权

US07152322B2 Toner supply roller 失效
公开(公告)号：US07152322B2
公开(公告)日：2006-12-26
申请号：US10885799
申请日：2004-07-08
申请人： Masayuki Nakashima , Toru Nishino , Takeo Taniguchi , Ikuo Nishiyama
发明人： Masayuki Nakashima , Toru Nishino , Takeo Taniguchi , Ikuo Nishiyama
IPC分类号： B21D53/00
CPC分类号： G03G15/0808 , G03G2215/0869 , Y10T29/49549 , Y10T29/4956 , Y10T29/49563
摘要： A toner supply roller comprises a metallic core shaft and an electrically conductive elastic layer formed to surround the outer surface of the shaft. The conductive elastic layer is formed of open-cell polyurethane foam. The polyurethane foam is impregnated with an electrically conductive polymer and a binder.

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