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1. 发明申请

US20050139846A1 High power light emitting diode package and fabrication method thereof 审中-公开
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US20050139846A1
公开(公告)日：2005-06-30
申请号：US10859144
申请日：2004-06-03
申请人： Jung Park , Chan Wang Park , Joon Yoon , Chang Kim , Young Park
发明人： Jung Park , Chan Wang Park , Joon Yoon , Chang Kim , Young Park
IPC分类号： H01L33/44 , H01L21/00 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.
摘要翻译：公开了一种大功率LED封装。在LED封装中，下板在LED安装区域具有散热构件，并且在散热构件周围具有至少一个通孔。第一和第二底部电极形成在下板的下侧，并连接到散热构件和通孔。在下板上形成绝缘层以覆盖散热构件。绝缘层上的第一和第二电极图案通过通孔连接到第一和第二底部电极。

2. 发明申请

US20050265042A1 Vertical light emitting type backlight module 失效
标题翻译：垂直发光型背光模组
公开(公告)号：US20050265042A1
公开(公告)日：2005-12-01
申请号：US10917383
申请日：2004-08-13
申请人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
发明人： Hyung Kim , Young Park , Hun Hahm , Jung Park , Young Jeong
IPC分类号： F21K99/00 , F21V7/04 , G02F1/13357
CPC分类号： G02F1/133603 , F21K9/00 , F21Y2105/10 , F21Y2115/10
摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.
摘要翻译：本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板在水平方向读取，以将光线的路径改变为垂直方向。

3. 发明申请

US20060034097A1 Light emitting diode lens and backlight apparatus having the same 有权
标题翻译：发光二极管透镜和具有相同的背光装置
公开(公告)号：US20060034097A1
公开(公告)日：2006-02-16
申请号：US10953816
申请日：2004-09-30
申请人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
发明人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
IPC分类号： F21V7/04
CPC分类号： H01L33/58 , H01L33/54 , H01L33/60
摘要： The present invention relates to an LED lens, in which a planar bottom has a pair of halves symmetrically connected with each other about a reference line and narrowed in the vicinity of the reference line. A pair of substantially semicircular reflecting surfaces are extended from both edges of the bottom connected with both ends of the reference line. A radiating surface is connected with remaining edges of the bottom and semicircular edges of the reflecting surfaces. The reflecting surfaces reflect light beams are introduced from the LED chip through the bottom toward the radiating surface. The radiating surface radiates the light beams to the outside when the light beams are introduced to the radiating surface through reflection from the reflecting surfaces and directly through the bottom, so that the light beams are radiated to the outside in a predetermined beam angle.
摘要翻译：本发明涉及一种LED透镜，其中平面底部具有围绕参考线彼此对称连接并在基准线附近变窄的一对半部。一对基本上半圆形的反射表面从与参考线的两端连接的底部的两个边缘延伸。辐射表面与反射表面的底部和半圆形边缘的剩余边缘连接。反射面反射光束从LED芯片通过底部朝向辐射表面引入。当光束通过反射表面反射而直接通过底部将光束引入辐射表面时，辐射表面将光束照射到外部，使得光束以预定的光束角度辐射到外部。

4. 发明申请

US20060273338A1 High power LED package and fabrication method thereof 有权
公开(公告)号：US20060273338A1
公开(公告)日：2006-12-07
申请号：US11445227
申请日：2006-06-02
申请人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
发明人： Seon Lee , Hun Hahm , Jung Park , Kyung Han , Seong Han , Dae Kim , Young Park
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

5. 发明申请

US20060157657A1 Led array circuit 审中-公开
标题翻译： LED阵列电路
公开(公告)号：US20060157657A1
公开(公告)日：2006-07-20
申请号：US11304821
申请日：2005-12-16
申请人： Young Jeong , Hun Hahm , Hyung Kim , Jung Park , Young Park , Ho Ahn , Bum Kim
发明人： Young Jeong , Hun Hahm , Hyung Kim , Jung Park , Young Park , Ho Ahn , Bum Kim
IPC分类号： G02B27/00
CPC分类号： H05B33/0821 , G02F1/133603 , Y02B20/341
摘要： Provided is an LED array circuit that has reduced power consumption and can protect an LED from a reverse voltage. The LED array circuit includes an LED pair, and an AC power source for supplying an AC voltage to the LED pair. The LED pair includes a first LED and a second LED that are connected in parallel to each other with biasing polarity connected in reverse.
摘要翻译：提供了一种LED阵列电路，其具有降低的功率消耗并且可以保护LED免受反向电压的影响。 LED阵列电路包括LED对，以及用于向LED对提供AC电压的AC电源。 LED对包括彼此并联连接的偏置极性相反的第一LED和第二LED。

6. 发明申请

US20060083019A1 Backlight apparatus reduced in thickness 失效
标题翻译：背光装置的厚度减小
公开(公告)号：US20060083019A1
公开(公告)日：2006-04-20
申请号：US11059406
申请日：2005-02-17
申请人： Hun Hahm , Hyung Kim , Jung Park , Ho Anh , Young Park , Bum Kim , Young Jeong
发明人： Hun Hahm , Hyung Kim , Jung Park , Ho Anh , Young Park , Bum Kim , Young Jeong
IPC分类号： G02F1/1335
CPC分类号： G02B6/0068 , G02B6/0016 , G02B6/0043 , G02F1/133603
摘要： The invention relates to a backlight apparatus in use for an LCD, in which a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.
摘要翻译：本发明涉及一种用于LCD的背光装置，其中多个条形第一LED光源被布置在反射板上以横向发光。多个浅色调布置在第一光源的上方。透明板放置在浅色调之上。散射图案形成在透明板底部的对应于浅色调的位置上。在透明板的一侧设置条状的第二LED光源，以将光发射到透明板中。布置在透明板一侧的光源防止了现有技术中的黑色区域的形成，从而增强了光的整体均匀性。然后，即使应用于大型LCD也能够使背光装置保持薄型化。

7. 发明申请

US20060055843A1 LCD Backlight unit and LCD having the same 有权
标题翻译： LCD背光单元和LCD具有相同的功能
公开(公告)号：US20060055843A1
公开(公告)日：2006-03-16
申请号：US10997895
申请日：2004-11-29
申请人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
发明人： Hun Hahm , Jung Park , Young Jeong , Young Park , Hyung Kim , Ho Ahn
IPC分类号： G02F1/1335
CPC分类号： G02B6/0028 , G02B5/021 , G02B5/0284 , G02B6/0018 , G02B6/003 , G02B6/0038 , G02B6/0068 , G02B6/0073
摘要： The invention relates to an LCD backlight apparatus, which includes a light guide plate placed under an LCD panel of the LCD to guide light to the LCD panel. The light guide plate has an even upper surface and a scattering pattern formed in a bottom surface. A plurality of monochromatic light sources are placed in line at a side of the light guide plate to radiate light along the plane direction of the light guide plate between the upper and bottom surfaces of the light guide plate. The light sources are adapted to radiate light beams in a predetermined beam angle so that the light beams reach the scattering pattern only after having propagated a predetermined reference length necessary for forming white light when mixed together. The LCD backlight apparatus can reduce the Bezel width without increasing the thickness of an LCD.
摘要翻译：本发明涉及一种LCD背光装置，其中包括一个导光板，该导光板放置在LCD的LCD面板的下方，以将光引向LCD面板。导光板具有均匀的上表面和形成在底面中的散射图案。多个单色光源在导光板的一侧成直线放置，以在导光板的上表面和底表面之间沿着导光板的平面方向辐射光。光源适于以预定的光束角度辐射光束，使得光束仅在已经传播了当混合在一起形成白光所需的预定参考长度之后才到达散射图案。 LCD背光装置可以在不增加LCD的厚度的情况下减少边框宽度。

8. 发明申请

US20070045644A1 Light emitting diode package with diffuser and method of manufacturing the same 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US20070045644A1
公开(公告)日：2007-03-01
申请号：US11491947
申请日：2006-07-25
申请人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
发明人： Seong Han , Seon Lee , Chang Song , Jung Park , Young Park , Kyung Han
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

9. 发明申请

US20070012939A1 Flip chip light emitting diode and method of manufacturing the same 审中-公开
标题翻译：倒装芯片发光二极管及其制造方法
公开(公告)号：US20070012939A1
公开(公告)日：2007-01-18
申请号：US11412984
申请日：2006-04-28
申请人： Seok Hwang , Je Kim , Young Park , Kun Ko , Jee Kim , Jung Park , Bok Min
发明人： Seok Hwang , Je Kim , Young Park , Kun Ko , Jee Kim , Jung Park , Bok Min
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/08 , H01L33/32 , H01L33/38 , H01L2933/0016
摘要： The present invention relates to a flip chip light emitting diode, in which the flow of current concentrated on a portion adjacent to an n-type electrode can be induced into the center of a light emitting section and a current-spreading effect is accordingly enhanced, thereby increasing light emission efficiency of a light emitting diode chip, and a method of manufacturing the same. The method of manufacturing a flip chip light emitting diode includes sequentially forming an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer on an optically-transparent substrate; etching predetermined regions of the active layer and p-type nitride semiconductor layer and exposing a plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of mesas; etching predetermined regions of the active layer and p-type nitride semiconductor layer positioned between the formed mesas and exposing the plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of grooves; forming an insulating layer on the surface of the groove; forming a p-type electrode across the insulating layer formed on the upper portion of the p-type nitride semiconductor layer and the surface of the groove; and forming an n-type electrode on the formed mesa.
摘要翻译：倒装芯片发光二极管技术领域本发明涉及一种倒装芯片发光二极管，其中集中在与n型电极相邻的部分上的电流可以被感应到发光部分的中心，从而相应地提高了电流扩展效果，从而提高发光二极管芯片的发光效率及其制造方法。制造倒装芯片发光二极管的方法包括在光学透明基板上依次形成n型氮化物半导体层，有源层和p型氮化物半导体层; 蚀刻有源层和p型氮化物半导体层的预定区域，并露出n型氮化物半导体层的多个区域以形成多个台面; 蚀刻位于形成的台面之间的有源层和p型氮化物半导体层的预定区域，并暴露出n型氮化物半导体层的多个区域以形成多个沟槽; 在所述槽的表面上形成绝缘层; 在形成在p型氮化物半导体层的上部和沟槽的表面上的绝缘层上形成p型电极; 并在形成的台面上形成n型电极。

10. 发明申请

US20060187651A1 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US20060187651A1
公开(公告)日：2006-08-24
申请号：US11136529
申请日：2005-05-25
申请人： Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Young Park , Hun Hahm , Bum Kim
发明人： Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Young Park , Hun Hahm , Bum Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus uses LEDs as a light source. This backlight apparatus comprises: a flat reflective plate; an LED light source arranged on the reflective plate; a transparent plate arranged above the LED light source; a scattering pattern arranged on an underside of the transparent plate in a position corresponding to the LED light source; and a light guide made of transparent material, and arranged around the scattering pattern to introduce light incident from below into the transparent plate so that the light is internally reflected by the transparent plate. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel. This can remove any dark area above the LED light source in the transparent plate and thus reduce the thickness of the direct-illumination backlight apparatus.
摘要翻译：直接照明背光装置使用LED作为光源。该背光装置包括：平面反射板; 布置在所述反射板上的LED光源; 布置在LED光源上方的透明板; 散布图案，布置在与LED光源相对应的位置的透明板的下侧上; 以及由透明材料制成的导光体，并且布置在散射图案周围以将从下方入射的光引入透明板，使得光被透明板内部反射。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。这可以去除透明板中的LED光源上方的任何暗区，从而减小直射照明背光装置的厚度。

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