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    • 3. 发明授权
    • System and methods for semiconductor device performance prediction during processing
    • 处理过程中半导体器件性能预测的系统和方法
    • US08962353B2
    • 2015-02-24
    • US13234964
    • 2011-09-16
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • H01L21/66
    • H01L22/20H01L22/12
    • Methods and systems for predicting semiconductor device performance criteria during processing. A method is described that includes receiving a semiconductor wafer; performing semiconductor processing on the semiconductor wafer forming active devices that, when completed, will exhibit a device performance criteria; during the semiconductor processing, measuring in line at least one device performance criteria related physical parameter; projecting an estimated value for the device performance criteria of the active devices using the at least one in line measurement and using estimated measurements for device performance criteria related physical parameters corresponding to later semiconductor processing steps; comparing the estimated value for the device performance criteria to an acceptable range; and determining, based on the comparing, whether the active devices on the semiconductor wafer will have a device performance criteria within the acceptable range. A system for processing semiconductor wafers that includes a programmable processor for performing the methods is described.
    • 用于在处理过程中预测半导体器件性能标准的方法和系统。 描述了一种包括接收半导体晶片的方法; 在形成有源器件的半导体晶片上执行半导体处理,其在完成时将呈现器件性能标准; 在半导体处理期间,测量至少一个器件性能标准相关的物理参数; 使用所述至少一个在线测量来估计所述有源器件的器件性能标准的估计值,并使用对应于后续半导体处理步骤的器件性能标准相关物理参数的估计测量值; 将设备性能标准的估计值与可接受范围进行比较; 以及基于所述比较来确定所述半导体晶片上的有源器件是否将器件性能标准在可接受的范围内。 描述了一种用于处理半导体晶片的系统,其包括用于执行该方法的可编程处理器。
    • 4. 发明申请
    • System and Methods for Semiconductor Device Performance Prediction During Processing
    • 半导体器件性能预测的系统和方法
    • US20130071957A1
    • 2013-03-21
    • US13234964
    • 2011-09-16
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • Jen-Pan WangChao-Chi ChenYaling Huang
    • H01L21/66
    • H01L22/20H01L22/12
    • Methods and systems for predicting semiconductor device performance criteria during processing. A method is described that includes receiving a semiconductor wafer; performing semiconductor processing on the semiconductor wafer forming active devices that, when completed, will exhibit a device performance criteria; during the semiconductor processing, measuring in line at least one device performance criteria related physical parameter; projecting an estimated value for the device performance criteria of the active devices using the at least one in line measurement and using estimated measurements for device performance criteria related physical parameters corresponding to later semiconductor processing steps; comparing the estimated value for the device performance criteria to an acceptable range; and determining, based on the comparing, whether the active devices on the semiconductor wafer will have a device performance criteria within the acceptable range. A system for processing semiconductor wafers that includes a programmable processor for performing the methods is described.
    • 用于在处理过程中预测半导体器件性能标准的方法和系统。 描述了一种包括接收半导体晶片的方法; 在形成有源器件的半导体晶片上执行半导体处理,其在完成时将呈现器件性能标准; 在半导体处理期间,测量至少一个器件性能标准相关的物理参数; 使用所述至少一个在线测量来估计所述有源器件的器件性能标准的估计值,并使用对应于后续半导体处理步骤的器件性能标准相关物理参数的估计测量值; 将设备性能标准的估计值与可接受范围进行比较; 以及基于所述比较来确定所述半导体晶片上的有源器件是否将器件性能标准在可接受的范围内。 描述了一种用于处理半导体晶片的系统,其包括用于执行该方法的可编程处理器。