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    • 9. 发明申请
    • LED backlight unit
    • LED背光单元
    • US20070195551A1
    • 2007-08-23
    • US11708037
    • 2007-02-20
    • Chang Ho Shin
    • Chang Ho Shin
    • F21V7/04
    • G02B6/0021G02B6/0068G02B6/0085G02B6/0091
    • An LED backlight unit which can be assembled without a thermosetting adhesive, improved in heat radiation effects to maintain high brightness, and also significantly improved in productivity. A light source has a substrate and a plurality of light emitting diodes disposed on the substrate. A light guide plate is placed adjacent to the light source. A chassis fixes the light source and the light guide plate therein. Fixing means engagingly fit a side of the light guide plate into the light source plate and chassis. Here, the substrate of the light source is fixed in surface contact with the chassis. The light guide plate assemblable without a thermosetting adhesive facilitates assembling and ensures effective radiation of heat generated from the LED, thereby maintaining high brightness and achieving superb light emitting capability.
    • 可以在没有热固性粘合剂的情况下组装的LED背光单元,改善了散热效果以保持高亮度,并且还显着提高了生产率。 光源具有基板和设置在基板上的多个发光二极管。 导光板与光源相邻放置。 底盘将光源和导光板固定在其中。 固定装置将导光板的一侧接合地配合到光源板和底盘中。 这里,光源的基板与底盘表面接触地固定。 不具有热固性粘合剂组装的导光板便于组装,并且确保从LED产生的热量的有效辐射,从而保持高亮度并获得极好的发光能力。