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1. 发明授权

US06877998B1 Power and ground connectors for socket 有权
标题翻译：插座的电源和接地连接器
公开(公告)号：US06877998B1
公开(公告)日：2005-04-12
申请号：US10728463
申请日：2003-12-05
申请人： Hyunjun Kim , Jianggi He , Dong-Ho Han , Joong-Ho Kim
发明人： Hyunjun Kim , Jianggi He , Dong-Ho Han , Joong-Ho Kim
IPC分类号： H01R12/16 , H05K7/10 , H01R4/66 , H01R13/648
CPC分类号： H01R12/7088 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K7/1092
摘要： A socket electrically connects an integrated circuit package and a circuit board. The socket includes a frames having a plurality of electrical connectors mounted to the frame. The plurality of electrical connectors includes at least one pair of power and ground connectors, with power connector including a first broadside portion and the ground connector including a second broadside portion. The first and second broadside portion are disposed in an adjacent, spaced-apart, and substantially parallel relationship.
摘要翻译：插座电连接集成电路封装和电路板。插座包括具有安装到框架的多个电连接器的框架。多个电连接器包括至少一对电源和接地连接器，其中电源连接器包括第一宽边部分，接地连接器包括第二宽侧部分。第一和第二宽边部分以相邻的，间隔开的和基本平行的关系设置。

2. 发明申请

US20060125574A1 Transmission line impedance matching 有权
标题翻译：传输线阻抗匹配
公开(公告)号：US20060125574A1
公开(公告)日：2006-06-15
申请号：US11352182
申请日：2006-02-10
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jianggi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jianggi He
IPC分类号： H01P5/02
CPC分类号： H01P3/081 , H01P3/08 , H01P5/02
摘要： Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.
摘要翻译：传输线阻抗匹配，用于匹配传输信号迹线上的阻抗不连续性，其中一个或多个非传输迹线布置在对应于阻抗不连续性的区域处的传输信号迹线附近。

3. 发明申请

US20050285695A1 Transmission line impedance matching 有权
标题翻译：传输线阻抗匹配
公开(公告)号：US20050285695A1
公开(公告)日：2005-12-29
申请号：US10880637
申请日：2004-06-29
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H01P3/08 , H01P5/02
CPC分类号： H01P3/081 , H01P3/08 , H01P5/02
摘要： Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The non-transmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.
摘要翻译：描述传输线阻抗匹配以匹配传输信号迹线上的阻抗不连续性。该装置包括发送信号跟踪和非传输迹线。发送信号迹线具有阻抗不连续性，第一长度和预定的第一宽度。在与阻抗不连续性对应的区域处，将非传输迹线布置在发射信号迹线附近。非透射迹线具有基本上小于发射信号迹线的第一长度的第二长度。此外，非传输轨迹被配置为在存在传输信号迹线上的电流的情况下电磁耦合到传输信号迹线，以在传输信号迹线上提供匹配的阻抗。

4. 发明授权

US07611924B2 Integrated circuit package with chip-side signal connections 有权
标题翻译：具有芯片侧信号连接的集成电路封装
公开(公告)号：US07611924B2
公开(公告)日：2009-11-03
申请号：US12015985
申请日：2008-01-17
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/00
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

5. 发明授权

US07432779B2 Transmission line impedance matching 有权
标题翻译：传输线阻抗匹配
公开(公告)号：US07432779B2
公开(公告)日：2008-10-07
申请号：US11709972
申请日：2007-02-22
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H03H7/38
CPC分类号： H01P3/081 , H01P3/08 , H01P5/02
摘要： Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.
摘要翻译：传输线阻抗匹配，用于匹配传输信号迹线上的阻抗不连续性，其中一个或多个非传输迹线布置在对应于阻抗不连续的区域处的传输信号迹线附近。

6. 发明授权

US07218183B2 Transmission line impedance matching 有权
标题翻译：传输线阻抗匹配
公开(公告)号：US07218183B2
公开(公告)日：2007-05-15
申请号：US11352182
申请日：2006-02-10
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H03H7/38
CPC分类号： H01P3/081 , H01P3/08 , H01P5/02
摘要： Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.
摘要翻译：传输线阻抗匹配，用于匹配传输信号迹线上的阻抗不连续性，其中一个或多个非传输迹线布置在对应于阻抗不连续的区域处的传输信号迹线附近。

7. 发明申请

US20050087877A1 Differential signal traces coupled with high permittivity material 审中-公开
标题翻译：差分信号迹线耦合高介电常数材料
公开(公告)号：US20050087877A1
公开(公告)日：2005-04-28
申请号：US10690928
申请日：2003-10-22
申请人： Dong-Ho Han , Joong-Ho Kim , Jiangqi He , Hyunjun Kim
发明人： Dong-Ho Han , Joong-Ho Kim , Jiangqi He , Hyunjun Kim
IPC分类号： H05K1/02 , H05K1/16 , H05K3/28 , H01L23/48 , H01L23/52
CPC分类号： H05K1/024 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/09236 , H05K2201/09881
摘要： In some embodiments, an apparatus includes a substrate and a pair of signal traces formed on the substrate. The signal traces may be spaced apart from each other. The apparatus may also include a filler material on the substrate and between the signal traces. The filler material may have a dielectric constant that is higher than a dielectric constant of a material of which the substrate is formed.
摘要翻译：在一些实施例中，装置包括衬底和形成在衬底上的一对信号迹线。信号迹线可以彼此间隔开。该装置还可以在衬底上和信号迹线之间包括填充材料。填充材料可以具有高于形成衬底的材料的介电常数的介电常数。

8. 发明申请

US20080131997A1 INTEGRATED CIRCUIT PACKAGE WITH CHIP-SIDE SIGNAL CONNECTIONS 有权
标题翻译：集成电路封装与芯片信号连接
公开(公告)号：US20080131997A1
公开(公告)日：2008-06-05
申请号：US12015985
申请日：2008-01-17
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/71
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

9. 发明授权

US07345359B2 Integrated circuit package with chip-side signal connections 有权
标题翻译：具有芯片侧信号连接的集成电路封装
公开(公告)号：US07345359B2
公开(公告)日：2008-03-18
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L23/02
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括用于在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

10. 发明申请

US20050194669A1 Integrated circuit package with chip-side signal connections 有权
标题翻译：具有芯片侧信号连接的集成电路封装
公开(公告)号：US20050194669A1
公开(公告)日：2005-09-08
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/60 , H01L23/02 , H01L23/498 , H01L23/538 , H01L23/552 , H05K1/14
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

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