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    • 1. 发明授权
    • Methods for manufacturing a metal-oxide thin film transistor
    • 金属氧化物薄膜晶体管的制造方法
    • US08927330B2
    • 2015-01-06
    • US13572710
    • 2012-08-13
    • Hsiao-Wen ZanChuang-Chuang TsaiChun-Cheng YehLiang-Hao Chen
    • Hsiao-Wen ZanChuang-Chuang TsaiChun-Cheng YehLiang-Hao Chen
    • H01L21/363H01L29/786
    • H01L29/7869
    • Disclosed herein is a method for manufacturing a metal-oxide thin film transistor. The method includes the steps of: (a1) forming a gate electrode on a substrate; (a2) forming a gate insulating layer over the gate electrode; (a3) forming a metal-oxide semiconductor layer having a channel region on the gate insulating layer; (a4) forming a source electrode and a drain electrode on the metal-oxide semiconductor layer, wherein the source electrode is spaced apart from the drain electrode by a gap exposing the channel region; (a5) forming a mobility-enhancing layer on the channel region, wherein the mobility-enhancing layer is not in contact with the source electrode and the drain electrode; and (a6) annealing the metal-oxide semiconductor layer and the mobility-enhancing layer in an environment at a temperature of about 200° C. to 350° C.
    • 本文公开了一种制造金属氧化物薄膜晶体管的方法。 该方法包括以下步骤:(a1)在基板上形成栅电极; (a2)在所述栅电极上形成栅极绝缘层; (a3)在栅极绝缘层上形成具有沟道区的金属氧化物半导体层; (a4)在所述金属氧化物半导体层上形成源电极和漏电极,其中所述源电极通过所述沟道区域露出的间隙与所述漏电极间隔开; (a5)在沟道区上形成迁移率增强层,其中迁移率增强层不与源电极和漏电极接触; 和(a6)在约200℃至350℃的温度的环境中退火金属氧化物半导体层和迁移率增强层。
    • 2. 发明申请
    • METAL OXIDE SEMICONDUCTOR TRANSISTOR
    • 金属氧化物半导体晶体管
    • US20120313084A1
    • 2012-12-13
    • US13480742
    • 2012-05-25
    • CHUANG-CHUANG TSAIHsiao-Wen ZanHsin-Fei MengChun-Cheng Yeh
    • CHUANG-CHUANG TSAIHsiao-Wen ZanHsin-Fei MengChun-Cheng Yeh
    • H01L29/22H01L51/30
    • H01L29/78696H01L29/78606H01L29/78693
    • A metal oxide semiconductor transistor includes a gate, a metal oxide active layer, a gate insulating layer, a source, and a drain. The metal oxide active layer has a first surface and a second surface, and the first surface faces to the gate. The gate insulating layer is disposed between the gate and the metal oxide active layer. The source and the drain are respectively connected to the metal oxide active layer. The second surface defines a mobility enhancing region between the source and the drain. An oxygen content of the metal oxide active layer in the mobility enhancing region is less than an oxygen content of the metal oxide active layer in the region outside the mobility enhancing region. The metal oxide semiconductor transistor has high carrier mobility.
    • 金属氧化物半导体晶体管包括栅极,金属氧化物有源层,栅极绝缘层,源极和漏极。 金属氧化物活性层具有第一表面和第二表面,并且第一表面面向栅极。 栅极绝缘层设置在栅极和金属氧化物有源层之间。 源极和漏极分别连接到金属氧化物活性层。 第二表面限定了源极和漏极之间的迁移率增强区域。 迁移率增强区域中的金属氧化物活性层的氧含量小于迁移率增强区域外的区域中的金属氧化物活性层的氧含量。 金属氧化物半导体晶体管具有高载流子迁移率。