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1. 发明专利

JP2005336430A Acrylic resin, and resin composition using the same 有权
标题翻译：丙烯酸树脂和使用其的树脂组合物
公开(公告)号：JP2005336430A
公开(公告)日：2005-12-08
申请号：JP2004161096
申请日：2004-05-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KONDO MADOKA , MASUDA KATSUYUKI , YANAGIDA MAKOTO
IPC分类号： C08L33/14 , C08F20/26 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To obtain an acrylic resin with its flame retardancy efficiently improved, and to obtain a resin composition containing the same and high in flame retardancy.
SOLUTION: In the acrylic resin, a phosphorous compound is bonded to the whole or a part of the ester chain of the acrylic resin.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得有效改善其阻燃性的丙烯酸树脂，并获得含有相同和高阻燃性的树脂组合物。解决方案：在丙烯酸树脂中，磷化合物结合到丙烯酸树脂的全部或部分酯链上。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005325162A Prepreg, metal foil-clad laminated plate and printed circuit board obtained using these 审中-公开
标题翻译： PREPREG，金属箔层压板和印刷电路板使用这些
公开(公告)号：JP2005325162A
公开(公告)日：2005-11-24
申请号：JP2004142226
申请日：2004-05-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , YANAGIDA MAKOTO , YAMAGUCHI MAKI
IPC分类号： C08J5/24 , B32B15/08 , B32B15/088 , C08G73/14 , C08L63/00 , C08L79/08 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board which is excellent in dimensional stability and heat resistance and can be folded to be highly densely contained in a housing of an electronic apparatus, and a prepreg and a metal foil-clad laminated plate for obtaining the printed circuit board.
SOLUTION: The prepreg is obtained by impregnating a fibrous base material with a resin composition comprising a compound having a structure represented by general formula (1) (wherein R
1 is an optionally substituted divalent aliphatic group consisting of C, O and H; and R
2 , R
3 , R
4 and R
5 are each a carbon atom as a part of a cyclic structure or a linear structure constituting the resin).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种尺寸稳定性和耐热性优异的印刷电路板，并且可以折叠成高密度地包含在电子设备的壳体中，并且预浸料和覆盖金属箔的叠层用于获得印刷电路板的板。解决方案：通过用包含具有由通式（1）表示的结构的化合物的树脂组合物浸渍纤维基材获得预浸料（其中R SB = 1任选取代的二价脂族基团由C，O和H构成; R SB 2，R SB 3，R SB 4，SB SB 5和SB SB 5 作为环状结构的一部分的碳原子或构成树脂的线状结构）。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005320495A Prepreg, metal foil clad laminate and printed circuit board obtained using the same 有权
标题翻译： PREPREG，金属箔层压板和使用其的印刷电路板
公开(公告)号：JP2005320495A
公开(公告)日：2005-11-17
申请号：JP2004202400
申请日：2004-07-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , YANAGIDA MAKOTO , YAMAGUCHI MAKI
IPC分类号： C08J5/24 , C08G73/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a metal foil-clad laminate and a printed-circuit board attaining both bond strength between a metal foil and a substrate and heat resistance on sufficiently high levels and prepreg to provide them.
SOLUTION: The prepreg 100 is obtained by removing a solvent from a varnish that comprises the solvent and a polyamide-imide resin dissolved in the solvent and is impregnated into a fiber substrate. The solvent is a mixed solvent composed of a good solvent and a poor solvent for the polyamide-imide resin.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得金属箔和基板之间的粘合强度两者的金属箔覆层压板和印刷电路板，并且具有足够高的水平的耐热性和预浸料以提供它们。解决方案：通过从包含溶剂的清漆和溶解在溶剂中的聚酰胺 - 酰亚胺树脂中除去溶剂并浸渍到纤维基材中来获得预浸料坯100。溶剂是由用于聚酰胺 - 酰亚胺树脂的良溶剂和不良溶剂组成的混合溶剂。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005307148A Prepreg and metal foil-adhered lamination plate and printed circuit board using it 审中-公开
标题翻译： PREPREG和金属箔粘合层压板和印刷电路板使用它
公开(公告)号：JP2005307148A
公开(公告)日：2005-11-04
申请号：JP2004192020
申请日：2004-06-29
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , YANAGIDA MAKOTO , YAMAGUCHI MAKI
IPC分类号： C08J5/24 , B32B15/08 , B32B15/088 , C08G18/38 , C08G73/10 , C08K5/13 , C08K5/372 , C08L79/08 , C08L87/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a copper-adhered lamination plate and a printed-circuit board each of which has a high moist heat resistance even when a thin fiber substrate is used and to provide a prepreg for obtaining them.
SOLUTION: A prepreg 100 has a fiber substrate and a resin composition which is impregnated in the substrate. The resin composition contains (a) a polyamideimide resin, (b) a thermosetting resin and (c) a phenolic antioxidant or a sulfuric antioxidant.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使使用薄纤维基材，也提供一种具有高耐湿热性的铜粘合层压板和印刷电路板，并提供用于获得它们的预浸料。解决方案：预浸料坯100具有纤维基材和浸渍在基材中的树脂组合物。树脂组合物含有（a）聚酰胺酰亚胺树脂，（b）热固性树脂和（c）酚类抗氧化剂或硫酸抗氧化剂。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2012012591A Prepreg, metal-clad laminate, and printed wiring board 有权
标题翻译： PREPREG，金属层压板和印刷线路板
公开(公告)号：JP2012012591A
公开(公告)日：2012-01-19
申请号：JP2011122806
申请日：2011-05-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： AITSU SHUJI , YANAGIDA MAKOTO
IPC分类号： C08J5/24 , B32B15/08 , B32B17/04 , C08G59/40 , C08K3/22 , C08K3/40 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg in which inorganic fillers are dispersed uniformly therein, and which can provide a metal-clad laminate excellent in workability and having a low coefficient of thermal expansion despite using aluminum hydroxide together with an inorganic filler such as silica; and to provide a metal-clad laminate and a printed wiring board.SOLUTION: The prepreg comprises a base material impregnated with a resin composition, and the resin composition includes aluminum hydroxide having mean particle diameter of 2.5-4.5 μm and a glass filler whose SiOcontent is 50-65 mass%, whose mean particle diameter is 1.0-3.0 μm, and whose specific gravity is 2.3-2.6 g/cm. In the prepreg, the total amount of the aluminum hydroxide and the glass filler contained in the solid material of the resin composition is 30-50 mass%. The metal-clad laminate and the printed wiring board are produced by using the prepreg.
摘要翻译：要解决的问题：提供一种其中无机填料均匀分散在其中的预浸料，并且其可以提供加工性优异且具有低热膨胀系数的覆金属层压板，尽管使用氢氧化铝和无机填料如二氧化硅; 并提供覆金属层压板和印刷线路板。解决方案：预浸料包括浸渍有树脂组合物的基材，并且树脂组合物包括平均粒径为2.5-4.5μm的氢氧化铝和SiO 2μm的玻璃填料， SB>含量为50-65质量％，平均粒径为1.0-3.0μm，比重为2.3-2.6g / cm 3。SP SP =“POST”> 3 。在预浸料中，树脂组合物的固体成分中所含的氢氧化铝和玻璃填料的总量为30〜50质量％。通过使用预浸料制造覆金属层压板和印刷线路板。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2007297599A Curable resin composition, resin-impregnated base material, prepreg, substrate, metal foil with adhesive layer thereon, and printed wiring board 有权
标题翻译：可固化树脂组合物，树脂印刷基材，PREPREG，基材，带有粘合层的金属箔和印刷线路板
公开(公告)号：JP2007297599A
公开(公告)日：2007-11-15
申请号：JP2007075412
申请日：2007-03-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YANAGIDA MAKOTO , KAWAGUCHI AKIKO
IPC分类号： C08L33/08 , B32B15/08 , C08G59/40 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition that has satisfactory flame retardancy though it is halogen-free and can afford excellent flexibility, heat resistance and adhesive properties, and provide a prepreg, a resin-impregnated base material, a substrate, a metal foil with an adhesive layer thereon and a printed wiring board each produced by using the curable resin composition.
SOLUTION: The curable resin composition comprises an acrylic rubber, a thermosetting resin, a phosphorus compound, and urea and/or a urea derivative.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有令人满意的阻燃性但是不含卤素并且可以提供优异的柔软性，耐热性和粘合性能的固化性树脂组合物，并且提供预浸料，树脂浸渍的基材，基板，其上具有粘合剂层的金属箔和通过使用该可固化树脂组合物制造的印刷线路板。解决方案：可固化树脂组合物包含丙烯酸橡胶，热固性树脂，磷化合物和尿素和/或脲衍生物。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2012012588A Epoxy resin composition, and prepreg, resin film with support, metal foil-clad laminate and multilayer printed wiring board using the same 有权
标题翻译：环氧树脂组合物和PREPREG，带支撑的树脂膜，金属箔层压板和多层印刷线路板
公开(公告)号：JP2012012588A
公开(公告)日：2012-01-19
申请号：JP2011122797
申请日：2011-05-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YANAGIDA MAKOTO , AITSU SHUJI
IPC分类号： C08G59/62 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in handleability, high in reactivity and excellent in flame retardancy, and further imparted with high heat resistance, and to provide a prepreg, a resin film with a support, a metal foil-clad laminate and a multilayer printed wiring board using the same.SOLUTION: The epoxy resin composition comprises (A) a phosphorus-containing curing agent, and (B) an epoxy resin, wherein (A) the phosphorus-containing curing agent is a phosphorus compound represented by chemical formula (1) wherein an organic group represented by R has one or two or more structures selected from chemical formulae (2), (3), (4), (5) and (6), and has two or more phenolic hydroxyl groups.
摘要翻译：要解决的问题：提供可操作性优异，反应性高，阻燃性优异的环氧树脂组合物，并且进一步赋予高耐热性，并且提供预浸料，具有载体的树脂膜，金属箔覆层压板和使用其的多层印刷线路板。解决方案：环氧树脂组合物包含（A）含磷固化剂和（B）环氧树脂，其中（A）含磷固化剂是由化学式（1）表示的磷化合物，其中由R表示的有机基团具有选自化学式（2），（3），（4），（5）和（6）中的一种或两种以上的结构，并且具有两个或更多个酚羟基。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2011176013A Printed circuit board and metal foil plating lamination plate 审中-公开
标题翻译：印刷电路板和金属箔玻璃层压板
公开(公告)号：JP2011176013A
公开(公告)日：2011-09-08
申请号：JP2010037366
申请日：2010-02-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAWAGUCHI AKIKO , YANAGIDA MAKOTO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board with superior folding endurance.
SOLUTION: The printed circuit board 100 includes: a core substrate 30 where a fiber base material is embedded in a first resin; a pair of second resin layers 10 arranged to hold the core substrate 30 between them; and a conductor 7 arranged on at least one of a surface 100a opposed to the core substrate 30 in the resin layer 10 or the interface of the resin layer and the core substrate. In the printed circuit board 100, the thickness of the fiber base material is ≤40 μm, and a tension elastic modulus in the cured object of the first resin at a temperature of 25°C is larger than that in the second resin layers 10 at a temperature of 25°C and also ≤3.0 GPa.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的耐折性的印刷电路板。解决方案：印刷电路板100包括：芯基板30，其中纤维基材嵌入第一树脂中; 布置成将芯基板30保持在它们之间的一对第二树脂层10; 以及布置在树脂层10中的与芯基板30相对的表面100a或树脂层和芯基板的界面中的至少一个的导体7。在印刷电路板100中，纤维基材的厚度为≤40μm，在25℃的温度下第一树脂的固化物的拉伸弹性模量大于第二树脂层10的固化物的拉伸弹性模量温度为25°C，也不超过3.0GPa。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2006124670A Prepreg and metal foil-clad laminate and printed circuit board using the same 有权
标题翻译： PREPREG和金属箔层压板和印刷电路板使用它
公开(公告)号：JP2006124670A
公开(公告)日：2006-05-18
申请号：JP2005280457
申请日：2005-09-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , YANAGIDA MAKOTO , YAMAGUCHI MAKI
IPC分类号： C08J5/24 , B32B15/08 , C08G59/44 , C08G73/14 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg having sufficiently excellent circuit filling property and heat resistance and giving a printed circuit board which can be bent and highly densely stored in a chasis of an electronic equipment.
SOLUTION: The prepreg comprises a fibrous base material and resin composition impregnated in the above material. The resin composition contains a polyamideimide resin and a naphthalene diglycidyl compound.
COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2005281661A Prepreg and metal foil-clad laminate and printed circuit board using the same 有权
标题翻译： PREPREG和金属箔层压板和印刷电路板使用它
公开(公告)号：JP2005281661A
公开(公告)日：2005-10-13
申请号：JP2004220674
申请日：2004-07-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , YANAGIDA MAKOTO , YAMAGUCHI MAKI
IPC分类号： C08J5/24 , B32B15/08 , C08G73/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a prepreg affording a metal foil-clad laminate and a printed circuit board simultaneously achieving both flexibility and flame retardance at high levels.
SOLUTION: The prepreg 100 solving the problems is obtained by impregnating a fiber substrate with a resin composition. A substrate obtained by curing the prepreg has prescribed flame retardance.
COPYRIGHT: (C)2006,JPO&NCIPI

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