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1. 发明专利

JP2012036338A Resin composition, resin cured product, wiring board, and method for manufacturing the wiring board 审中-公开
标题翻译：树脂组合物，树脂固化产品，接线板和制造接线板的方法
公开(公告)号：JP2012036338A
公开(公告)日：2012-02-23
申请号：JP2010179752
申请日：2010-08-10
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAKAMURA KONATSU , MORITA MASAKI , TAKANEZAWA SHIN , MURAI AKIRA , NAKANO HIROSHI , SUZUKI HITOSHI , AMO SATORU
IPC分类号： C08G59/40 , B32B15/08 , B32B15/092 , H05K1/03 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an insulating resin capable of showing high adhesion easily to a wiring conductor, even when a concavo-convex shape of an insulating resin layer surface is small, and to provide a wiring board and a method for manufacturing the wiring board.SOLUTION: This resin composition contains (A) an epoxy resin having two or more epoxy groups per molecule, (B) an ultraviolet-activable ester group-containing compound, (C) isocyanate silane, and (D) an epoxy resin curing accelerator.
摘要翻译：要解决的问题：即使当绝缘树脂层表面的凹凸形状小的情况下，也能够容易地对布线导体显示出高粘附性的绝缘树脂，并且提供一种布线板和方法制造接线板。解决方案：该树脂组合物包含（A）每分子具有两个或更多个环氧基的环氧树脂，（B）可紫外线活化的含酯基化合物，（C）异氰酸酯硅烷和（D）环氧树脂固化促进剂。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011195476A Bismaleimide derivative and method for producing the same, and thermosetting resin composition, prepreg and laminated board 有权
标题翻译：双马来酰亚胺衍生物及其制备方法和热固性树脂组合物，PREPREG和层压板
公开(公告)号：JP2011195476A
公开(公告)日：2011-10-06
申请号：JP2010061950
申请日：2010-03-18
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , MURAI AKIRA , IZUMI HIROYUKI
IPC分类号： C07D207/452 , B32B27/04 , B32B27/34 , B32B27/38 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition especially having copper foil adhesiveness, low thermal expansion and high glass transition temperature, and achieving excellent low dielectric properties, solder heat resistance, heat resistance with copper, flame retardancy and drill processability, and to provide a prepreg and a laminated board using the composition.SOLUTION: There are provided the bismaleimide derivative represented by formula (I), the method for producing the derivative, the thermosetting resin composition containing the bismaleimide derivative, the prepreg and the laminated board. In the formula, Aris a residue represented by formula (I-1), (I-2), (I-3) or (I-4) (each not shown); Aris a residue represented by formula (I-5) or (I-6) (each not shown); Ris a hydroxy, carboxy or sulfonic acid group of an acidic substituent; Ris hydrogen, 1C-5C aliphatic hydrocarbon or halogen; x is an integer of 1-5; y is an integer of 0-4; with the proviso that the total of x and y is 5; and n is 0 or a positive number.
摘要翻译：要解决的问题：提供一种特别是具有铜箔粘合性，低热膨胀和高玻璃化转变温度的热固性树脂组合物，并且获得优异的低介电性能，焊料耐热性，铜的耐热性，阻燃性和钻孔加工性，以及提供使用该组合物的预浸料坯和层压板。解决方案：提供由式（I）表示的双马来酰亚胺衍生物，衍生物的制备方法，含有双马来酰亚胺衍生物，预浸料和层压板的热固性树脂组合物。式中，Aris表示式（I-1），（I-2），（I-3）或（I-4）（各自未示出） Aris由式（I-5）或（I-6）表示的残基（每个未示出）; R是酸性取代基的羟基，羧基或磺酸基团; Ris氢，1C-5C脂族烃或卤素; x是1-5的整数; y是0-4的整数; 条件是x和y的总和为5; n为0或正数。

3. 发明专利

JP2011086729A Laminated board for wiring board and method of manufacturing the same, resin film for primer layer, and multilayer wiring board and method of manufacturing the same 有权
标题翻译：用于接线板的层压板及其制造方法，用于预制层的树脂膜和多层布线板及其制造方法
公开(公告)号：JP2011086729A
公开(公告)日：2011-04-28
申请号：JP2009237593
申请日：2009-10-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： OGAWA NOBUYUKI , MURAI AKIRA , TAKANEZAWA SHIN , MATSUURA MASAHARU , FUJIMOTO DAISUKE
IPC分类号： H05K1/03 , H05K3/18 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a laminated board for wiring board that has high adhesive strength to electroless copper plating although having a small surface roughness (Ra) of, for example, ≤0.2 and is adaptive to higher density of a semiconductor package and a method of manufacturing the same, a multilayer wiring board and a method of manufacturing the same, and a resin film for primer layer used therefor. SOLUTION: The present invention relates to a laminated board for wiring board which has a primer layer made of a resin composition containing a multifunctional epoxy resin, an epoxy resin curing agent, and a crosslinking organic filler of ≤1 μm in average primary particle size and a method of manufacturing the same, the resin composition containing the crosslinking organic filler by 20 to 40 mass%, and the primer layer being 1 to 10 μm thick. Further, the present invention relates to a wiring board using the laminated board for wiring board and a method of manufacturing the same. Furthermore, the present invention relates to the resin film for primer layer used for the laminated board for wiring board etc. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种对化学镀铜具有高粘合强度的布线板层压板，尽管其表面粗糙度（Ra）小于例如≤0.2，并适应于较高密度的半导体封装及其制造方法，多层布线板及其制造方法以及用于其的底漆层用树脂膜。解决方案：本发明涉及一种布线板层压板，其具有由包含多官能环氧树脂，环氧树脂固化剂和平均初级的≤1μm的交联有机填料的树脂组合物制成的底漆层粒径及其制造方法，所述树脂组合物含有20〜40质量％的交联有机填料，底涂层的厚度为1〜10μm。另外，本发明涉及使用该布线基板用层叠板的布线板及其制造方法。此外，本发明涉及用于布线板等的层压板的底漆层用树脂膜。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010235922A Varnish, prepreg, film with resin, metal foil-clad laminate, printed wiring board 有权
标题翻译： VARNISH，PREPREG，带树脂的薄膜，金属箔层压板，印刷线路板
公开(公告)号：JP2010235922A
公开(公告)日：2010-10-21
申请号：JP2010039388
申请日：2010-02-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , MURAI AKIRA , TAKANEZAWA SHIN , INOUE YASUO , SAKAI KAZUNAGA
IPC分类号： C08G59/06 , B32B15/08 , B32B27/04 , C08J5/04 , C08J5/24 , H05K1/03
CPC分类号： C09D163/00 , B32B5/022 , B32B5/024 , B32B15/14 , B32B2255/02 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/308 , B32B2379/00 , B32B2457/08 , C08G59/245 , C08G59/5086 , C08J5/24 , C08J2363/00 , H01L23/49894 , H01L2224/48227 , H01L2924/15311 , H01L2924/3511 , H05K1/0346 , H05K1/0366 , H05K2201/0355 , H05K2201/068 , Y10T428/31678 , Y10T442/2861 , Y10T442/2951
摘要： PROBLEM TO BE SOLVED: To provide varnishes high in storage stability at ambient temperatures, and excellent in workability when in use; and to provide a prepreg, a film with resin, a metal foil-clad laminate and a printed wiring board constituted using the same.
SOLUTION: The present invention relates to a varnish obtained by reacting at least a portion of functional groups of a resin having the functional groups which react with an amino group and including a polycyclic structure, with an amino group of a compound having the amino group in a solvent; and a varnish obtained by reacting at least a portion of functional groups of a resin having the functional groups which react with a phenolic hydroxy group and including a polycyclic structure, with a phenolic hydroxy group of a compound having the phenolic hydroxy group in a solvent. The present invention also provides a prepreg, a film with resin, a metal foil-clad laminate, and a printed wiring board obtained using any of these varnishes.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供在环境温度下储存稳定性高的清漆，使用时的加工性优异; 并且提供一种预浸料，具有树脂的膜，覆盖金属箔的层压板和使用其制成的印刷线路板。解决方案：本发明涉及通过使具有与氨基反应并包含多环结构的官能团的树脂的官能团的至少一部分与具有多环结构的化合物的氨基反应而获得的清漆溶剂中的氨基; 以及通过将具有与酚性羟基反应的官能团的官能团的官能团的至少一部分与包含多环结构的酚羟基的酚羟基在溶剂中反应而获得的清漆。本发明还提供了一种预浸料，具有树脂的薄膜，覆盖金属箔的层压板以及使用这些清漆得到的印刷布线板。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2007302877A Thermosetting resin composition of ipn type composite, and varnish, prepreg and metal-clad laminate using the same 有权
标题翻译： IPN型复合材料的热固化树脂组合物，以及使用其的变性，制备和金属层压板
公开(公告)号：JP2007302877A
公开(公告)日：2007-11-22
申请号：JP2007098607
申请日：2007-04-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIZUNO YASUYUKI , FUJIMOTO DAISUKE , DANSEIGEN KAZUTOSHI , MURAI AKIRA
IPC分类号： C08L47/00 , C08J5/24 , C08K3/00 , C08L21/00 , C08L71/12
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of producing a printed wiring board having good dielectric characteristics in high frequency zone, capable of significantly reducing transmition loss, excellent in hygroscopic heat resistance and thermal expansion properties and satisfying peeling strength between a resin and a metal foil. SOLUTION: The present invention relates to a thermosetting resin composition containing an uncured semi-IPN type composite obtained by compatibilizing a prepolymer formed from (A) polyphenylene ether, (B) a chemically unmodified butadiene polymer containing ≥40% 1,2-butadiene unit having 1,2-vinyl group on the side chain in the molecule and (C) a crosslinking agent and (D) a saturated type thermoplastic elastomer, and a resin varnish, prepreg and a metal-clad laminate each using the resin composition. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题的方案：提供一种热塑性树脂组合物，其能够制造在高频区具有良好介电特性的印刷线路板，能够显着降低透射损失，优异的耐吸湿性和热膨胀性，并且满足剥离强度在树脂和金属箔之间。解决方案：本发明涉及一种含有未固化的半IPN型复合材料的热固性树脂组合物，其通过使由（A）聚苯醚形成的预聚物相容而得到，（B）含有≥40％的1,2- - 丁二烯单元在分子中的侧链上具有1,2-乙烯基，（C）交联剂和（D）饱和型热塑性弹性体，以及使用该树脂的树脂清漆，预浸料和覆金属层压板组成。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007302876A Resin composition of semi-ipn type composite and varnish, prepreg and metal-clad laminate each using the same composition 有权
标题翻译： SEMI-IPN型复合材料的树脂组合物和使用相同组合物的各种复合材料，PREPREG和金属层压板
公开(公告)号：JP2007302876A
公开(公告)日：2007-11-22
申请号：JP2007098606
申请日：2007-04-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIZUNO YASUYUKI , FUJIMOTO DAISUKE , DANSEIGEN KAZUTOSHI , MURAI AKIRA
IPC分类号： C08L47/00 , B32B15/08 , C08G81/02 , C08J5/24 , C08L71/12 , C09D5/18 , C09D109/00 , C09D147/00 , C09D171/10 , C09D179/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition capable of producing a printed circuit board satisfying excellent laminate performances such as flame retardance and high heat resistance under conditions corresponding to lead-free solder, low heat expansion property and high metal foil-peeling strength while having good dielectric characteristics and low transmission loss in a high-frequency band. SOLUTION: The present invention relates to a resin composition containing a uncured semi-IPN type composite obtained by compatibilizing a prepolymer formed from (A) polyphenylene ether, (B) a chemically unmodified butadiene polymer containing ≥40% 1,2-butadiene unit having 1,2-vinyl group on the side chain in the molecule and (C) a crosslinking agent and (D) a bromine-based flame retardant having ≥300°C 5% mass-reducing temperature and not having reactivity with the component A, the component B, the component C and the uncured semi-IPN type composite, and a resin varnish, prepreg and a metal-clad laminate each using the resin composition. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种能够在与无铅焊料相对应的条件，低热膨胀性和高金属箔的条件下制造满足阻燃性和高耐热性等优异的层压性能的印刷电路板的树脂组合物，在高频带中具有良好的介电特性和低的传输损耗的剥离强度。解决方案：本发明涉及一种含有通过使由（A）聚苯醚形成的预聚物相容化而获得的未固化的半IPN型复合物的树脂组合物，（B）含有≥40％1,2-亚苯基的化学未改性的丁二烯聚合物，在分子侧链上具有1,2-乙烯基的丁二烯单元和（C）交联剂和（D）具有≥300℃5％质量降低温度并且不具有反应性的溴系阻燃剂组分A，组分B，组分C和未固化的半IPN型复合材料，以及使用树脂组合物的树脂清漆，预浸料和覆金属层压板。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007302843A Method for producing curing agent, and thermosetting resin composition using the same 有权
标题翻译：用于生产固化剂的方法和使用该固化剂热固化树脂组合物
公开(公告)号：JP2007302843A
公开(公告)日：2007-11-22
申请号：JP2006135035
申请日：2006-05-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , AKIYAMA MASANORI , MURAI AKIRA
IPC分类号： C08G59/62
摘要： PROBLEM TO BE SOLVED: To provide a method for inexpensively and safely producing a curing agent, and a thermosetting resin composition having excellent adhesiveness to a copper foil, heat resistance, flame retardancy, low dielectric characteristics and low dielectric loss tangent.
SOLUTION: The method for producing the curing agent having an acidic substituent and an unsaturated maleimide group includes a step for producing a maleimide resin by reacting (a) a compound having at least two primary amino groups bound to a benzene ring in one molecule with (b) maleic anhydride in (c) an organic solvent, and a step for reacting the maleimide resin with (d) an amine compound having the acidic substituent represented by general formula (I) (wherein, R
1 is a hydroxy group, a carboxy group or a sulfonic acid group; R
2 is a hydrogen atom, a 1-5C aliphatic hydrocarbon group, a halogen atom, a hydroxy group, a carboxy group or a sulfonic acid group; and x and y are each an integer of 1-4).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种廉价安全地生产固化剂的方法，以及对铜箔具有优异的粘附性的热固性树脂组合物，耐热性，阻燃性，低介电特性和低介电损耗角正切。解决方案：具有酸性取代基和不饱和马来酰亚胺基团的固化剂的制备方法包括通过使（a）具有至少两个与苯环结合的伯氨基的化合物在一个中生成马来酰亚胺树脂的步骤（c）有机溶剂中的（b）马来酸酐的分子，以及使马来酰亚胺树脂与（d）具有由通式（I）表示的酸性取代基的胺化合物反应的步骤（其中，R / SB>是羟基，羧基或磺酸基; R SB 2是氢原子，1-5C脂族烃基，卤素原子，羟基，羧基或磺酸基; x和y各自为1-4的整数）。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007039567A Composite molded article for high-frequency electronic component and composition for producing composite molded article for high-frequency electronic component 审中-公开
标题翻译：用于高频电子元件的复合成型制品和用于生产用于高频电子元件的复合成型制品的组合物
公开(公告)号：JP2007039567A
公开(公告)日：2007-02-15
申请号：JP2005225980
申请日：2005-08-03
申请人： Fujifilm Holdings Corp , Goo Chemical Co Ltd , Hitachi Chem Co Ltd , Kri Inc , Nippon Zeon Co Ltd , Osaka Gas Co Ltd , 互応化学工業株式会社 , 大阪瓦斯株式会社 , 富士フイルムホールディングス株式会社 , 日本ゼオン株式会社 , 日立化成工業株式会社 , 株式会社Kri
发明人： YAMAGUCHI KOICHI , OMODA AKIRA , HAYASHI HIROYUKI , TSURUMI MITSUYUKI , HIROKAWA YOSHITSUGU , YAMAMOTO KAZUNORI , MURAI AKIRA , SHIMADA YASUSHI , MIZUNO YASUYUKI , ODA TOSHIKAZU , HAMADA NOBUHITO , NISHINO HITOSHI
IPC分类号： C08L101/00 , B32B7/02 , B32B15/08 , B32B27/18 , C08K3/04 , C09J11/04 , C09K21/08 , H05K1/03 , H05K3/28 , H05K3/46
CPC分类号： C08J5/005 , C08J2363/00
摘要： PROBLEM TO BE SOLVED: To provide a composite molded article for a high-frequency electronic component, capable of reducing dielectric loss (or tanδ) in high-frequency band, especially GHz band; and to provide a method for producing the molded article, an electronic component, etc using the molded article. SOLUTION: The composite molded article for the high-frequency electronic component contains 0.0001-0.1 wt.% at least one kind selected from the group consisting of a nanotube and a nanowire in the matrix. The method for producing the molded article, the resin composition for producing the molded article, the electronic component or the like formed by using the molded article or the resin composition are also provided. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够降低高频带，特别是GHz频带的介电损耗（或tanδ）的高频电子部件用复合成形品。并且提供使用该模制品制造模塑制品，电子部件等的方法。解决方案：用于高频电子部件的复合成型体含有0.0001-0.1重量％的从基质中的纳米管和纳米线中选出的至少一种。还提供了使用该成型体或树脂组合物形成的成型体的制造方法，成型体的制造用树脂组合物，电子部件等。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2012052110A Thermosetting resin composition, and prepreg using the same, laminate 有权
标题翻译：热固性树脂组合物，以及使用它们的复合层压板
公开(公告)号：JP2012052110A
公开(公告)日：2012-03-15
申请号：JP2011172362
申请日：2011-08-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUCHIKAWA SHINJI , IZUMI HIROYUKI , ISHIKURA KUMIKO , MURAI AKIRA
IPC分类号： C08G73/06 , C08J5/24 , C08K9/06 , C08L79/04 , H05K1/03
CPC分类号： C08L83/06 , B32B5/022 , B32B5/024 , B32B5/08 , B32B7/06 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/046 , B32B2262/0276 , B32B2262/101 , B32B2307/306 , B32B2307/3065 , B32B2307/51 , B32B2307/714 , B32B2307/734 , B32B2307/748 , B32B2457/00 , C08G73/0644 , C08G73/0655 , C08G77/16 , C08G77/452 , C08J5/24 , C08J2383/10 , C08K9/06 , H05K1/0326 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , H05K2201/029 , C08L83/10
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition whose adhesiveness with a conductor layer, heat resistance, flame retardancy, low thermal expansibility, low dielectric properties, low dielectric dissipation factor, drillability or the like each satisfies both standards corresponding to a product and an environment using the composition.SOLUTION: The thermosetting resin composition comprises: a thermosetting resin (A); and fused silica (B). The thermosetting resin (A) is obtained by reacting a siloxane resin (a) having a hydroxy group at its terminal and a compound (b) having at least two cyanate groups in one molecule. The siloxane resin (a) and the compound (b) are contained in amounts of 10-70 pts.mass and 30-90 pts.mass, respectively, to 100 pts.mass of the total of the siloxane resin (a) and the compound (b). The reaction rate of the compound (b) is 40-70 mol%. The surface of the fused silica is treated with a trimethoxysilane compound.
摘要翻译：要解决的问题：提供一种与导体层的粘合性，耐热性，阻燃性，低热膨胀性，低介电性，低介电损耗因数，可钻性等的热固性树脂组合物都满足对应于使用该组合物的产品和环境。热固性树脂组合物包含：热固性树脂（A）; 和二氧化硅（B）。热固性树脂（A）通过在其末端具有羟基的硅氧烷树脂（a）和在一个分子中具有至少两个氰酸酯基的化合物（b）反应而获得。硅氧烷树脂（a）和化合物（b）的含量分别为10-70质量份和30-90质量分数，相对于硅氧烷树脂（a）和化合物（b）。化合物（b）的反应速度为40〜70摩尔％。熔融二氧化硅的表面用三甲氧基硅烷化合物处理。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011052184A Thermosetting insulating resin composition and insulating film with substrate using the same, prepreg, laminated board, and multilayer printed circuit board 有权
标题翻译：热固性绝缘树脂组合物和绝缘膜与使用其的基板，PREPREG，层压板和多层印刷电路板
公开(公告)号：JP2011052184A
公开(公告)日：2011-03-17
申请号：JP2009204904
申请日：2009-09-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , TSUCHIKAWA SHINJI , IZUMI HIROYUKI , MURAI AKIRA
IPC分类号： C08G59/40 , B32B27/38 , C08G73/12 , C08J5/24 , C08L21/00 , C08L29/14 , C08L63/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting insulating resin composition of a low thermal expansion property, with a high glass transition temperature and excellent heat resistance, an insulating film with a substrate using the same, a prepreg, a laminated board, and a multilayer printed circuit board. SOLUTION: The thermosetting insulating resin composition includes (A) a curing agent having a sulfur atom in the principal molecular chain, and an acidic substituent and an N-substituted maleimide group obtained by reacting (a) a diamine compound having a sulfur atom in the principal molecular chain, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure and (c) a monoamine compound, (B) an epoxy resin having at least two epoxy groups in the molecule, and (C) a compound enabling chemical roughing. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供具有低玻璃化转变温度和优异耐热性的低热膨胀特性的热固性绝缘树脂组合物，具有使用其的基板的绝缘膜，预浸料，层压板，和多层印刷电路板。解决方案：热固性绝缘树脂组合物包括（A）在主分子链中具有硫原子的固化剂和酸性取代基和N-取代的马来酰亚胺基团，其通过使（a）具有硫的二胺化合物（b）在分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物和（c）单胺化合物，（B）分子中具有至少两个环氧基的环氧树脂，和（C）化学粗化化合物。版权所有（C）2011，JPO＆INPIT

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