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1. 发明授权

US4803734A Method of and apparatus for detecting pattern defects 失效
标题翻译：检测图案缺陷的方法和装置
公开(公告)号：US4803734A
公开(公告)日：1989-02-07
申请号：US940272
申请日：1986-12-10
申请人： Hiroyuki Onishi , Tetsuo Sano , Tetsuo Hoki , Eiji Kodama , Hisayuki Tsujinaka , Ryuji Kitakado
发明人： Hiroyuki Onishi , Tetsuo Sano , Tetsuo Hoki , Eiji Kodama , Hisayuki Tsujinaka , Ryuji Kitakado
IPC分类号： H04N7/18 , G01B11/24 , G01B11/30 , G06K9/64 , G06T1/00 , G06T7/00 , H05K3/00
CPC分类号： G06T7/001 , G01N21/956 , G06K9/6203 , G03F1/84 , G06T2207/30141 , G06T2207/30148
摘要： The periphery of an area of a master pattern is expanded by a required number of pixels to define a plurality of master pattern areas two-dimensionally misregistered pixel by pixel, for performing pattern comparison of the respective master pattern areas with an area of an object pattern. The object pattern is deemed defective when all of the comparisons indicate pattern mismatches. The pattern is deemed not defective when at least one comparison indicates a pattern match. Thus, even if an inspected object includes misregistration errors, pattern defects can be detected with high accuracy.
摘要翻译：主图案的区域的周边被扩展所需数量的像素以限定像素逐个二维不对准的多个主图案区域，用于执行各个主图案区域与对象图案的区域的图案比较。当所有比较指示图案不匹配时，对象图案被认为是有缺陷的。当至少一个比较表示模式匹配时，该模式被认为没有缺陷。因此，即使检查对象包括不对准误差，也可以高精度地检测图案缺陷。

2. 发明授权

US5347591A Method of and device for determining positioning between a hole and a wiring pattern on a printed circuit board by utilizing a set of area values 失效
标题翻译：用于通过利用一组面积值来确定印刷电路板上的孔和布线图案之间的定位的方法和装置
公开(公告)号：US5347591A
公开(公告)日：1994-09-13
申请号：US784574
申请日：1991-10-29
申请人： Hiroyuki Onishi , Tetsuo Hoki
发明人： Hiroyuki Onishi , Tetsuo Hoki
IPC分类号： G01B11/24 , G01B11/245 , G01N21/88 , G01N21/93 , G01N21/956 , G06T1/00 , G06T7/00 , H01L21/66 , H05K3/00 , G06K9/00
CPC分类号： G06K9/03 , G06T7/004 , G06K2209/19 , G06T2207/30141 , Y10S706/912
摘要： A printed board, on which a wiring pattern and a through hole to be inspected are provided, is scanned pixel by pixel and is read optically. The data obtained by scanning is converted into an electric signal to obtain image data. On the basis of the image data thus obtained, a pattern image representing the wiring pattern an a hole image representing the through hole are obtained. A center and a radius of the hole image are obtained from the image data. Then, a plurality of ring-shaped masks are obtained by magnifying the hole image at a plurality of magnifications. The size of the pattern image is normalized by the size of the hole image, and the, respective areas of overlapped regions between a plurality of the ringshaped masks and the pattern image are detected. Since these areas are obtained with an isotropic method, they do not depend on the directions of a line entering a land. By simulation, correspondence between the area of the overlapped regions and a relative positional relation between the wiring pattern and the through hole is obtained in advance. On the basis of this known correspondence, a relative positional relation between the wiring pattern and the through hole is evaluated by utilizing a neural network that has been taught such known correspondence.
摘要翻译：将要检查的布线图案和通孔设置在其上的印刷电路被逐个扫描并被光学读取。通过扫描获得的数据被转换为电信号以获得图像数据。基于这样获得的图像数据，获得表示布线图案的图形图像和表示通孔的孔图像。从图像数据获得孔图像的中心和半径。然后，通过以多个放大率放大孔图像来获得多个环形掩模。图案图像的尺寸通过孔图像的大小归一化，并且检测多个环形掩模和图案图像之间的重叠区域的各个区域。由于这些区域是用各向同性方法获得的，它们不依赖于进入陆地的线路的方向。通过模拟，预先获得重叠区域的区域与布线图案与通孔之间的相对位置关系的对应关系。基于这种已知的对应关系，通过利用已经教导了这样已知的对应关系的神经网络来评估布线图案和通孔之间的相对位置关系。

3. 发明授权

US5408538A Method of and apparatus for inspecting the minimum annular width of a land on a printed circuit board 失效
标题翻译：用于检查印刷电路板上的焊盘的最小环形宽度的方法和装置
公开(公告)号：US5408538A
公开(公告)日：1995-04-18
申请号：US283982
申请日：1994-08-01
申请人： Ryuji Kitakado , Hisayuki Tsujinaka , Tetsuo Hoki , Takao Omae
发明人： Ryuji Kitakado , Hisayuki Tsujinaka , Tetsuo Hoki , Takao Omae
IPC分类号： G01B11/24 , G01B11/245 , G01N21/88 , G01N21/93 , G01N21/956 , G01R31/309 , G06T1/00 , G06T7/00 , H05K3/00 , G01G11/02 , G06K9/36
CPC分类号： G06T7/0006 , G01N21/956 , G01R31/309 , G06T7/602 , G01N2021/95646 , G01N2021/95653 , G06T2207/30141
摘要： A printed pattern is provided with a wiring pattern having a land and a through hole surrounded by the land. The wiring pattern and the through hole are read by a photoelectric image sensor to obtain a pattern image and a hole image, respectively. A pattern gauge image is defined by the pattern image, and a hole gauge image having a ring-like shape is obtained from the hole image. A logical product between the inversion image of the pattern gauge image and the hole gauge signal provides a protrusion region image. Since the hole gauge image has an isotropic contour, the minimum annular width of the land is detected, independent of the direction in which the through hole is deviated from the land.
摘要翻译：印刷图案设置有布线图案，该布线图案具有由陆片包围的平台和通孔。布线图案和通孔由光电图像传感器读取，以分别获得图案图像和孔图像。图案图像由图案图像定义，并且从孔图像获得具有环状形状的孔规图像。图案规格图像的反转图像和孔规信号之间的逻辑积产生突出区域图像。由于孔规图像具有各向同性轮廓，因此检测出平台的最小环形宽度，而与通孔偏离地面的方向无关。

4. 发明授权

US5272762A Method of and apparatus for inspecting wiring pattern on printed board 失效
标题翻译：检查印刷电路板布线图案的方法和装置
公开(公告)号：US5272762A
公开(公告)日：1993-12-21
申请号：US831898
申请日：1992-02-06
申请人： Yoshinori Sezaki , Tetsuo Hoki , Takao Kanai , Hitoshi Atsuta
发明人： Yoshinori Sezaki , Tetsuo Hoki , Takao Kanai , Hitoshi Atsuta
IPC分类号： G01N21/88 , G01N21/93 , G01N21/956 , G06T1/00 , G06T7/00 , H05K3/00 , G06K9/00
CPC分类号： G06T7/0004 , G06T2207/30141
摘要： The image of a wiring pattern provided on a printed board is obtained and binarized. A square pixel operator comprised of a matrix of pixels is applied to the pattern image. Pixel trains extending in different directions are extracted from the result of applying the square operator. The numbers of pixels having the binary value "1" on the pixel trains are counted to obtain the respective sizes of the pattern image on the pixel trains. Signals representing the respective sizes are subjected to timing adjustment operation and to obtain the width of the wiring pattern on an area larger than the square operator.

5. 发明授权

US5197105A Method of reading optical image of inspected surface and image reading system employabale therein 失效
标题翻译：检查表面光学图像的方法和图像读取系统的应用方法
公开(公告)号：US5197105A
公开(公告)日：1993-03-23
申请号：US706801
申请日：1991-05-29
申请人： Haruo Uemura , Tetsuo Hoki
发明人： Haruo Uemura , Tetsuo Hoki
IPC分类号： G01N21/956 , G01R31/309 , G06K9/00
CPC分类号： G01N21/956 , G01R31/309 , G01N2021/8845 , G01N2021/95638 , G01N2021/95653
摘要： A set of red light sources (111-113) are provided above a printed board (20). One (111) of the light sources located in the angular aperture of an imaging lens system (140). The red light is applied to the printed board and reflected on a wiring pattern (22) provided thereon. Another light source (120) is provided under the printed board, and emits infrared light to the back surface of the printed board. The infrared light passes through a through hole (25) formed in the printed board and then enters the imaging lens system together with the red light reflected. Compound light consisting of the red light and the infrared light passes through the imaging lens system and is then splitted into the red light and the infrared light at a cold mirror (150). The respective lights are detected by image sensors (161, 162), to thereby obtain respective images of the wiring pattern and the through hole.

6. 发明授权

US5774574A Pattern defect detection apparatus 失效
标题翻译：图案缺陷检测装置
公开(公告)号：US5774574A
公开(公告)日：1998-06-30
申请号：US563684
申请日：1995-11-28
申请人： Tetsuo Hoki
发明人： Tetsuo Hoki
IPC分类号： G01B11/24 , G01B11/30 , G01N21/88 , G01N21/93 , G01N21/956 , G06T1/00 , G06T7/00 , G06T7/60 , G06K9/00
CPC分类号： G06T7/001 , G06T2207/20021 , G06T2207/30141
摘要： In a printed substrate inspection apparatus for dividing an inspection objective image into divided areas and comparing divided areas with a plurality of reference images which are included in a standard pattern image, an affect of a positional deviation of the inspection objective image is obviated. A size K of each inspection objective divided area is determined in such a manner that a difference between a positional deviation within each inspection objective divided area and a positional deviation of the inspection objective image does not exceed a quantity corresponding to 1 pixel. Further, a maximum shifting quantity M of the reference images with respect to each inspection objective divided area is set equal to or larger than a positional deviation maximum value of the inspection objective image. A positional deviation of the inspection objective image as a whole does not manifests itself as an inclination or a distortion within each inspection objective divided area. The plurality of reference images include images which correspond to images of the inspection objective divided areas. Hence, comparison inspection is accurate.
摘要翻译：在将检查对象图像分割为分割区域并将分割区域与包含在标准图案图像中的多个参考图像进行比较的印刷基板检查装置中，消除了检查对象图像的位置偏差的影响。每个检查对象分割区域的尺寸K以每个检查对象分割区域内的位置偏差与检查对象图像的位置偏差之间的差不超过对应于1个像素的量的方式来确定。此外，参考图像相对于每个检查对象分割区域的最大偏移量M被设置为等于或大于检查对象图像的位置偏差最大值。检查对象图像整体的位置偏差本身不表现为每个检查目标分割区域内的倾斜度或变形。多个参考图像包括对应于检查对象分割区域的图像的图像。因此，比较检查是准确的。

7. 发明授权

US5150422A Method of and apparatus for inspecting conductive pattern on printed board 失效
公开(公告)号：US5150422A
公开(公告)日：1992-09-22
申请号：US674547
申请日：1991-03-22
申请人： Ryuji Kitakado , Hironobu Yano , Hiroaki Kakuma , Tetsuo Hoki , Takao Kanai
发明人： Ryuji Kitakado , Hironobu Yano , Hiroaki Kakuma , Tetsuo Hoki , Takao Kanai
IPC分类号： G06T7/00
CPC分类号： G06T7/0006 , G06T2207/30141
摘要： A printed circuit board (11) is provided with a conductive pattern (P, R) and a through hole (H) thereon. Respective images of the conductive pattern and a through hole are photoelectrically read with an image reader (20). The conductive pattern image is magnified in size to obtain a magnified pattern image (PI.sub.m), while the hole image is magnified at different magnification factors to obtain magnified hole images (HI.sub.n, HI.sub.n-i). A ring image (RP) is defined by the difference of the magnified hole images. The overlapped region (WR) on which the ring image and the magnified pattern image overlap each other is then calculated, and a defect or an opening of the conductive pattern is detected by calculating the aperture angle (.theta.) of the overlapped image.

8. 发明授权

US5046113A Method of and apparatus for detecting pattern defects by means of a plurality of inspecting units each operating in accordance with a respective inspecting principle 失效
标题翻译：通过多个检查单元检测图案缺陷的方法和装置，每个检查单元根据各自的检查原理操作
公开(公告)号：US5046113A
公开(公告)日：1991-09-03
申请号：US296435
申请日：1989-01-12
申请人： Tetsuo Hoki
发明人： Tetsuo Hoki
IPC分类号： G01B11/24 , G01N21/956 , G06T1/00 , G06T7/00 , H01L21/027 , H01L21/30 , H01L21/66 , H05K3/00
CPC分类号： G06T7/0006 , G01N21/956 , G06T7/001 , G06T2207/20036 , G06T2207/30148
摘要： An apparatus for inspecting pattern defects in circuit board conductors or other images has inspecting units which perform inspection operations based on various pattern matching approaches, which include design rule checking and expansion/contraction processing. Each of the inspecting units inspects a part of the pattern of an object. The part of a pattern is defined by a respective inspection and inhibition domain defining signals. The domain signals are formed with the aid of a scanning device and a binarizing circuit, a CAD system and a converter, a digitizer and a converter and the like. The apparatus then displays inspection decisions derived from each inspecting unit on a display unit, with respect to the different domains.
摘要翻译：用于检查电路板导体或其他图像中的图案缺陷的装置具有基于各种图案匹配方法执行检查操作的检查单元，其包括设计规则检查和扩展/收缩处理。每个检查单元检查物体的一部分图案。模式的一部分由相应的检测和禁止域定义信号定义。借助于扫描装置和二值化电路，CAD系统和转换器，数字转换器和转换器等形成域信号。然后，该装置相对于不同的域显示在显示单元上从每个检查单元导出的检查决定。

9. 发明授权

US4797939A Pattern masking method and an apparatus therefor 失效
标题翻译：图案掩模方法及其装置
公开(公告)号：US4797939A
公开(公告)日：1989-01-10
申请号：US914863
申请日：1986-10-02
申请人： Tetsuo Hoki , Tetsuo Sano , Ryuji Kitakado , Yoshinori Sezaki , Tomiji Hotta , Hironobu Yano
发明人： Tetsuo Hoki , Tetsuo Sano , Ryuji Kitakado , Yoshinori Sezaki , Tomiji Hotta , Hironobu Yano
IPC分类号： G01N21/956 , G06T7/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/956 , G06T2207/30141
摘要： A binarized image data group of an inspected object for a plurality of pixels arrayed in the sub-scanning direction is sequentially created in order along the main scanning direction to determine whether or not the pattern of an inputted image corresponds to a standard through-hole pattern on the basis of the binarized image data group. When the determination is of yes, through-hole diameter masking data are sequentially created in order along the main scanning direction to sequentially perform masking processing on the binarized image data group of the inspected object arrayed in the sub-scanning direction. Thus, the through-hole pattern is automatically detected to be subjected to masking processing, whereby an inspected object having through-holes can be inspected by a pattern matching method.
摘要翻译：沿着主扫描方向顺序地创建沿副扫描方向排列的多个像素的检查对象的二值化图像数据组，以确定输入图像的图案是否对应于标准通孔图案在二值化图像数据组的基础上。当确定为是时，沿着主扫描方向依次创建通孔直径掩蔽数据，以顺序对沿副扫描方向排列的被检查对象的二值化图像数据组执行掩蔽处理。因此，通孔图案被自动检测以进行掩模处理，从而可以通过图案匹配方法检查具有通孔的检查对象。

10. 发明授权

US5161202A Method of and device for inspecting pattern of printed circuit board 失效
标题翻译：用于检查印刷电路板图案的方法和装置
公开(公告)号：US5161202A
公开(公告)日：1992-11-03
申请号：US731851
申请日：1991-07-16
申请人： Ryuji Kitakado , Hironobu Yano , Tetsuo Hoki
发明人： Ryuji Kitakado , Hironobu Yano , Tetsuo Hoki
IPC分类号： G01B11/24 , G01B11/245 , G01N21/88 , G01N21/93 , G01N21/956 , G01R31/308 , G06T1/00 , G06T7/00 , H05K3/00
CPC分类号： G06T7/001 , G01R31/308 , G06T2207/30141
摘要： Respective images of a conductive pattern and through holes of a printed circuit board are obtained. The through holes are classified into normal through holes having a relatively large diameter and mini via holes having a comparatively small diameter. The mini via hole image is enlarged to become an enlarged mini via hole image (SHSm). The image of the conductive pattern has hole parts therein, which are filled with images generated from the normal through hole image and the mini via hole image to obtain a corrected pattern image (CPS). The edge of the corrected pattern image is detected and enlarged to obtain an enlarged edge image (SES). The enlarged edge image is classified into two areas, one of which overlaps with the enlarged mini via hole image (SHSm). These two areas are subjected to inspection in different inspection modes.

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