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1. 发明授权

US5100737A Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof 失效
标题翻译：包含柔性石墨的多层材料，通过金属和其生产工艺进行机械，电和热的加强
公开(公告)号：US5100737A
公开(公告)日：1992-03-31
申请号：US610139
申请日：1990-11-07
申请人： Gabriel Colombier , Philippe Gimenez , Claude Drapier , Michel Moreau
发明人： Gabriel Colombier , Philippe Gimenez , Claude Drapier , Michel Moreau
IPC分类号： B32B15/04 , B32B7/02 , B32B7/10 , B32B9/00 , C01B31/04 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C09K3/10 , F16J15/12 , H01L23/373 , H05K9/00
CPC分类号： H05K9/0088 , C04B41/009 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , F16J15/122 , H01L23/3735 , H01L2924/0002 , Y10T428/12472 , Y10T428/12486 , Y10T428/12535 , Y10T428/12625 , Y10T428/28 , Y10T428/2804 , Y10T428/2813 , Y10T428/30 , Y10T428/31678
摘要： A multi-layer material comprises at least two layers of flexible material, including one layer based on electrically conductive, expanded recompressed graphite and another layer based on a metal, wherein the layer of graphite has at least one face thereof covered at every point by a layer of metal and in direct electrical contact with the layer of metal, and wherein the layer of metal is obtained by electrodeposition or by chemical deposit of at least one metal on the layer of graphite in such a way that the layer of metal adheres directly to the layer of graphite and closely matches the micro-relief thereof.
摘要翻译：多层材料包括至少两层柔性材料，包括基于导电的膨胀再压缩石墨的一层和基于金属的另一层，其中所述石墨层的至少一个面在每一点由一个金属层，并且与金属层直接电接触，并且其中金属层通过电沉积或通过在石墨层上化学沉积至少一种金属而获得，使得金属层直接粘附到石墨层与其微浮雕紧密匹配。

2. 发明授权

US5230788A Insulated metal substrates and process for the production thereof 失效
标题翻译：绝缘金属基板及其制造方法
公开(公告)号：US5230788A
公开(公告)日：1993-07-27
申请号：US828679
申请日：1992-01-31
申请人： Jacques Rabiet , Philippe Gimenez , Remi Guillou , Claude Drapier
发明人： Jacques Rabiet , Philippe Gimenez , Remi Guillou , Claude Drapier
IPC分类号： C25D11/12 , H05K1/05 , H05K3/38 , H05K3/44
CPC分类号： C25D11/12 , H05K1/053 , H05K3/44 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , H05K3/386
摘要： The disclosure relates to insulated metal substrates and to a process for producing these substrates. These substrates have an aluminium base, an insulant constituted by an alumina film obtained by anodizing at least one of the faces of said base and at least one metal film which is to be transformed by chemical etching into a network of conductors. The alumina film is formed by a uniform compact zone adhering to the aluminium and having a thickness in excess of 500 nm and a porous layer with a rough outer surface. The process of making these substrates includes a step during which at least one of the faces of the aluminium base undergoes a treatment in a porous anodization layer forming bath and then in a barrier anodization layer forming bath. The invention is used in the production of substrates for single face, double face, with metallized holes, and multilayer conductive circuits. The substrates produced have a planar or non-planar configuration, and may also have resistive networks.
摘要翻译：本公开涉及绝缘金属基板和制造这些基板的方法。这些基材具有铝基材，由氧化铝膜构成的绝缘体，该氧化铝膜通过阳极氧化所述基材的至少一个面和通过化学蚀刻转化为导体网络的至少一个金属膜而获得。氧化铝膜由粘附在铝上的厚度超过500nm的均匀致密区域和具有粗糙外表面的多孔层形成。制造这些基材的方法包括以下步骤：铝基材的至少一个表面在多孔阳极氧化层形成浴中进行处理，然后在阻挡阳极氧化层形成浴中进行处理。本发明用于单面，双面，带有金属化孔的基板和多层导电电路的制造。所生产的基板具有平面或非平面配置，并且还可以具有电阻网络。

3. 发明授权

US5112668A Insulated metal substrates and process for the production thereof 失效
标题翻译：绝缘金属基材及其生产方法
公开(公告)号：US5112668A
公开(公告)日：1992-05-12
申请号：US506108
申请日：1990-04-09
申请人： Jacques Rabiet , Philippe Gimenez , Remi Guillou , Claude Drapier
发明人： Jacques Rabiet , Philippe Gimenez , Remi Guillou , Claude Drapier
IPC分类号： C25D11/04 , C25D11/12 , H01L23/14 , H05K1/05 , H05K3/38 , H05K7/20
CPC分类号： C25D11/12 , H05K1/053 , H01L2924/0002 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , H05K3/386 , Y10T428/24322 , Y10T428/24851 , Y10T428/24926
摘要： The disclosure relates to insulated metal substrates and to a process for producing these substrates. These substrates have an aluminium base, an insulant constituted by an alumina film obtained by anodizing at least one of the faces of said base and at least one metal film which is to be transformed by chemical etching into a network of conductors. The alumina film is formed by a uniform compact zone adhering to the aluminium and having a thickness in excess of 500 nm and a porous layer with a rough outer surface. The process of making these substrates includes a step during which at least one of the faces of the aluminium base undergoes a treatment in a porous anodization layer forming bath and then in a barrier anodization layer forming bath. The invention is used in the production of substrates for single face, double face, with metallized holes, and multilayer conductive circuits. The substrates produced have a planar or non-planar configuration, and may also have resistive networks.
摘要翻译：本公开涉及绝缘金属基板和制造这些基板的方法。这些基材具有铝基材，由氧化铝膜构成的绝缘体，该氧化铝膜通过阳极氧化所述基材的至少一个面和通过化学蚀刻转化为导体网络的至少一个金属膜而获得。氧化铝膜由粘附在铝上的厚度超过500nm的均匀致密区域和具有粗糙外表面的多孔层形成。制造这些基材的方法包括以下步骤：铝基材的至少一个表面在多孔阳极氧化层形成浴中进行处理，然后在阻挡阳极氧化层形成浴中进行处理。本发明用于单面，双面，带有金属化孔的基板和多层导电电路的制造。所生产的基板具有平面或非平面配置，并且还可以具有电阻网络。

4. 发明授权

US5283219A Active composite and its use as reaction medium 失效
标题翻译：活性复合材料及其用作反应介质
公开(公告)号：US5283219A
公开(公告)日：1994-02-01
申请号：US777537
申请日：1992-01-13
申请人： Sylvain Mauran , Michel Lebrun , Philippe Prades , Michel Moreau , Bernard Spinner , Claude Drapier
发明人： Sylvain Mauran , Michel Lebrun , Philippe Prades , Michel Moreau , Bernard Spinner , Claude Drapier
IPC分类号： B01D5/00 , B01D53/02 , B01D53/14 , B01J12/00 , B01J15/00 , B01J20/20 , B01J21/18 , C04B35/52 , C04B35/536 , F25B35/04 , F28F21/02 , B01J8/02 , C04B35/54 , F25B17/08
CPC分类号： B01J21/18 , B01J20/20 , C04B35/536 , F25B35/04 , F28F21/02 , Y10S165/905
摘要： An active composite consists of a compressed support and an agent which reacts with a gas. According to the invention, the compressed support comprises recompressed expanded graphite having a density between 0.02 and 1.5. A process for implementing gas-solid type reactions in which said active composite is used as the reaction medium is also described.
摘要翻译： PCT No.PCT / FR91 / 00303 Sec。 371日期1992年1月13日 102（e）日期1992年1月13日PCT 1991年4月11日提交PCT公布。出版物WO91 / 15292 日期为1991年10月17日。活性复合材料由压缩载体和与气体反应的试剂组成。根据本发明，压缩载体包括密度在0.02和1.5之间的再压缩膨胀石墨。还描述了用于实施气固反应的方法，其中使用所述活性复合材料作为反应介质。

5. 发明授权

US4915899A Process for co-sintering conductors of copper or copper-base alloys and their ceramic substrate of cordierite 失效
标题翻译：共烧铜或铜基合金导体及其堇青石陶瓷基体的方法
公开(公告)号：US4915899A
公开(公告)日：1990-04-10
申请号：US299335
申请日：1989-01-23
申请人： Veronique Oliver , Jean-Louis Guille , Jean-Claude Bernier , Claude Drapier
发明人： Veronique Oliver , Jean-Louis Guille , Jean-Claude Bernier , Claude Drapier
IPC分类号： C04B41/51 , C04B41/88 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/46
CPC分类号： C04B41/009 , C04B41/5127 , C04B41/88 , H01L21/4867 , C04B2111/00844 , H05K1/0306 , H05K1/092 , H05K3/4629 , Y10T428/12056
摘要： The invention comprises a process for co-sintering of conductors of copper or copper-based alloy and a ceramic substrate, the substrate being produced from a ceramic powder of cordierite type, having a sintering temperature of lower than 950.degree. C.The process comprises the following steps:(a) shaping of the ceramic substrate from a powder of cordierite type,(b) deposit of copper on the ceramic substrate, and(c) co-sintering heat treatment, during which the organic compounds are removed, the copper is regenerated in a reducing atmosphere, and co-sintering of the conductors and the substrate is carried out in a flow of moist inert gas with a plateau at a temperature of between 1065.degree. and 1080.degree. C.The process according to the invention makes it possible to produce substrates of cordierite with internal and external conductors.
摘要翻译：本发明包括一种用于共烧烧铜或铜基合金和陶瓷基体的导体的方法，该基底由堇青石型陶瓷粉末制成，烧结温度低于950℃。该方法包括以下步骤：（a）从堇青石型粉末中形成陶瓷衬底，（b）在陶瓷衬底上沉积铜，和（c）共烧结热处理，其中除去有机化合物，铜是在还原气氛中再生，并且导体和衬底的共烧结在具有1065和1080℃之间的平台的湿惰性气体流中进行。根据本发明的方法使得可能以生产具有内部和外部导体的堇青石衬底。

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