专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2006042231A2 METHOD AND SYSTEM FOR HIGH-SPEED PRECISE LASER TRIMMING, SCAN LENS SYSTEM FOR USE THEREIN AND ELECTRICAL DEVICE PRODUCED THEREBY 审中-公开
标题翻译：高速精密激光切割方法与系统及其使用的扫描镜头系统及其制造的电气设备
公开(公告)号：WO2006042231A2
公开(公告)日：2006-04-20
申请号：PCT/US2005036421
申请日：2005-10-07
申请人： GSI LUMONICS CORP , GU BO , LENTO JOSEPH V , EHRMANN JONATHAN S , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
发明人： GU BO , LENTO JOSEPH V , EHRMANN JONATHAN S , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
IPC分类号： G06K7/10
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/082
摘要： A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.
摘要翻译：提供了一种方法，系统和扫描透镜系统，用于高速，基于激光的，精确的激光修剪至少一个电气元件。该方法包括以重复率产生具有一个或多个激光脉冲的脉冲激光输出。每个激光脉冲具有脉冲能量，在激光波长范围内的激光波长和脉冲持续时间。所述方法还包括选择性地照射所述至少一个电气元件，所述一个或多个激光脉冲聚焦在沿着方向具有不均匀强度分布的至少一个点和小至约6微米至约15微米的光点直径上以使所述一个或多个激光脉冲从所述至少一个元件选择性地去除材料，并激光修整所述至少一个元件，同时避免所述至少一个元件内的实质性微裂纹。波长足够短以产生小斑点尺寸，紧度公差和高吸收性能所需的短波长益处，但不会如此短，从而导致微裂纹。

2. 发明申请

WO2007090051A2 METHOD AND SYSTEM FOR HIGH-SPEED PRECISE LASER TRIMMING AND SCAN LENS FOR USE THEREIN 审中-公开
标题翻译：用于高速精密激光切割和扫描镜头的方法和系统
公开(公告)号：WO2007090051A2
公开(公告)日：2007-08-09
申请号：PCT/US2007061121
申请日：2007-01-26
申请人： GSI GROUP CORP , GU BO , EHRMANN JONATHAN S , LENTO JOSEPH V , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
发明人： GU BO , EHRMANN JONATHAN S , LENTO JOSEPH V , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
IPC分类号： H01L21/00 , G06K7/10
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/351 , B23K26/361
摘要： A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.
摘要翻译：提供了一种用于其中的方法，系统和扫描透镜，用于沿着修剪路径的高速，基于激光的精确激光修整至少一个电气元件。该方法包括用激光产生脉冲激光输出，该输出具有一个或多个重复频率的激光脉冲。可以使用快速上升/下降时间，脉冲形q切换激光器或超快速激光器。光束成形光学元件可用于产生平顶光束轮廓。每个激光脉冲具有脉冲能量，在激光波长范围内的激光波长和脉冲持续时间。波长足够短以产生小斑点尺寸，紧公差，高吸收以及沿着修剪路径减少或消除的热影响区（HAZ）的期望的短波长益处，但不太短以致于引起微裂纹。以这种方式，减少了修整过程之后的电阻漂移。

3. 发明申请

WO2005038994A3 LASER-BASED SYSTEM FOR MEMORY LINK PROCESSING WITH PICOSECOND LASERS 审中-公开
标题翻译：基于激光的系统，用于使用PICOSECOND激光进行存储器链接处理
公开(公告)号：WO2005038994A3
公开(公告)日：2006-01-26
申请号：PCT/US2004032661
申请日：2004-10-05
申请人： GSI LUMONICS CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H01S3/067 , H01S3/16 , H01S3/23 , H05K3/00
CPC分类号： H01S3/2383 , B23K26/04 , B23K26/0624 , B23K26/0626 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2201/38 , B23K2201/40 , B23K2203/10 , B23K2203/12 , B23K2203/172 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H01S3/0085 , H01S3/06758 , H01S3/1618 , H01S3/23 , H05K3/0026 , H01L2924/00
摘要： A laser-based system for processing target material within a microscopic region without causing undesirable changes in electrical or physical characteristics of at least one material surrounding the target material, the system includes a seed laser, an optical amplifier, and a beam delivery system. The seed laser for generating a sequence of laser pulses having a first pre-determined wavelength. The optical amplifier for amplifying at least a portion of the sequence of pulses to obtain an amplified sequence of output pulses. The beam delivery system for delivering and focusing at least one pulse of the amplified sequence of pulses onto the target material. The at least one output pulse having a pulse duration in the range of about (10) picoseconds to less than (1) nanosecond. The pulse duration being within a thermal processing range. The at least one focused output pulse having sufficient power density at a location within the target material to reduce the reflectivity of the target material and efficiently couple the focused output into the target material to remove the target material.
摘要翻译：一种用于在微观区域内处理目标材料而不引起围绕靶材料的至少一种材料的电学或物理特性的不希望的变化的基于激光的系统，该系统包括种子激光器，光学放大器和光束传递系统。用于产生具有第一预定波长的激光脉冲序列的种子激光器。用于放大脉冲序列的至少一部分以获得放大的输出脉冲序列的光放大器。用于将放大的脉冲序列的至少一个脉冲传送和聚焦到目标材料上的光束传送系统。所述至少一个输出脉冲具有在约（10）皮秒至小于（1）纳秒范围内的脉冲持续时间。脉冲持续时间在热处理范围内。所述至少一个聚焦输出脉冲在目标材料内的位置处具有足够的功率密度，以减少目标材料的反射率并有效地将聚焦的输出耦合到目标材料中以去除目标材料。

4. 发明申请

WO2005038995A3 MEMORY LINK PROCESSING WITH PICOSECOND LASERS 审中-公开
标题翻译：使用PICOSECOND激光的存储器链接处理
公开(公告)号：WO2005038995A3
公开(公告)日：2006-03-16
申请号：PCT/US2004032972
申请日：2004-10-06
申请人： GSI LUMONICS CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H05K3/00 , H01L21/461
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2201/38 , B23K2201/40 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A laser-based method of removing a target link (107) structure of a circuit fabricated on a substrate (110) includes generating a pulsed laser output (104) at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.
摘要翻译：基于激光的方法去除在衬底（110）上制造的电路的目标连接（107）结构包括以小于衬底的吸收边缘的预定波长产生脉冲激光输出（104）。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传送和聚焦到目标链路结构上。聚焦的激光输出在目标结构内的位置处具有足够的功率密度，以减小目标结构的反射率，并将聚焦的激光输出有效地耦合到目标结构中以去除连接而不损坏基板。

5. 发明申请

WO2006053288A3 METHOD AND SYSTEM FOR LASER SOFT MARKING 审中-公开
标题翻译：用于激光软标记的方法和系统
公开(公告)号：WO2006053288A3
公开(公告)日：2007-01-04
申请号：PCT/US2005041144
申请日：2005-11-11
申请人： GSI LUMONICS CORP , GU BO , EHRMANN JONATHAN S
发明人： GU BO , EHRMANN JONATHAN S
IPC分类号： B23K26/00
CPC分类号： H01L21/67282 , B23K26/0622 , B23K26/40 , B23K2201/40 , B23K2203/50 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A laser marking system for marking a softmark on a semiconductor wafer includes a controller to set a pulse width (e.g. 10-200 nanoseconds) that affects the depth of a softmark that is to be formed. The controller further sets a pulse energy (e.g. 600 to 1100 microjoules) of the one or more output pulses to selectively provide the one or more output pulses having a set total output energy for producing the softmark.
摘要翻译：用于在半导体晶片上标记软标记的激光标记系统包括设置影响要形成的软标记的深度的脉冲宽度（例如10-200纳秒）的控制器。控制器还设置一个或多个输出脉冲的脉冲能量（例如600至1100微焦耳），以选择性地提供具有用于产生软标记的设定总输出能量的一个或多个输出脉冲。

6. 发明申请

WO2006012124A8 LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGETED SURFACE MATERIAL AND ARTICLE PRODUCED THEREBY 审中-公开
公开(公告)号：WO2006012124A8
公开(公告)日：2006-03-23
申请号：PCT/US2005021955
申请日：2005-06-21
申请人： GSI LUMONICS CORP , GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
发明人： GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
IPC分类号： B23K26/36 , G01Q30/02 , G01Q60/00
CPC分类号： G06K1/126 , B23K26/0084 , B23K26/0624 , B23K26/0676 , B23K26/361 , B23K26/40 , B23K2203/50 , B33Y80/00 , B41M5/24 , H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54453 , H05K1/0266 , H05K3/0026
摘要： A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.

7. 发明申请

WO2006012124A2 LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGETED SURFACE MATERIAL AND ARTICLE PRODUCED THEREBY 审中-公开
标题翻译：用于处理目标表面材料的激光基方法和系统及由其制造的制品
公开(公告)号：WO2006012124A2
公开(公告)日：2006-02-02
申请号：PCT/US2005021955
申请日：2005-06-21
申请人： GSI LUMONICS CORP , GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
发明人： GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
IPC分类号： B23K26/36 , G01Q30/02 , G01Q60/00
CPC分类号： G06K1/126 , B23K26/0084 , B23K26/0624 , B23K26/0676 , B23K26/361 , B23K26/40 , B23K2203/50 , B33Y80/00 , B41M5/24 , H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54453 , H05K1/0266 , H05K3/0026
摘要： A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.
摘要翻译：提供了用于处理目标表面材料和由此制造的物品的基于激光的方法和系统。该系统处理工件区域内的目标表面材料，同时避免对相邻非目标材料的不希望的改变。该系统包括主激光器子系统，该主激光器子系统包括用于产生包括至少一个脉冲的脉冲激光输出的主激光源，该脉冲具有小于1ns的波长和脉冲宽度。输送子系统利用包括至少一个脉冲的脉冲激光输出来照射工件的目标表面材料以纹理目标表面材料。脉冲激光输出具有足够的总注量以在目标表面材料的至少一部分内开始消融，并且脉冲宽度足够短以使围绕该材料的区域和非目标材料基本上没有炉渣。

8. 发明申请

WO2006078920A3 HIGH-SPEED, PRECISE, LASER-BASED MATERIAL PROCESSING METHOD AND SYSTEM 审中-公开
标题翻译：高速，精密，基于激光的材料加工方法与系统
公开(公告)号：WO2006078920A3
公开(公告)日：2007-07-12
申请号：PCT/US2006002063
申请日：2006-01-20
申请人： GSI LUMONICS CORP , JOHNSON SHEPARD D , GU BO , CORDINGLEY JAMES J
发明人： JOHNSON SHEPARD D , GU BO , CORDINGLEY JAMES J
IPC分类号： B23K26/36 , B23K26/40 , H01L21/00
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0622 , B23K26/08 , B23K26/0853 , B23K2201/36 , H01L2924/0002 , H01L2924/00
摘要： A high-speed, precise, laser-based material processing method and system are provided wherein relative movement of target material and a pulsed laser output used to process the material are synchronized. The laser-based system includes a pulsed laser source for generating a set of laser pulses, and a laser output control that controllably selects a subset of pulses from the set of laser pulses at a position beyond the laser source to obtain the pulsed laser output. The laser-based system further includes a mechanism for synchronizing the pulsed laser output with relative movement of the target material. A beam delivery and focusing subsystem delivers at least a portion of the synchronized pulsed laser output to the target material as a laser material processing output to process the target material. A positioning subsystem moves the target material relative to the pulsed laser output.
摘要翻译：提供了高速，精确的基于激光的材料处理方法和系统，其中用于处理材料的目标材料和脉冲激光输出的相对运动是同步的。基于激光的系统包括用于产生一组激光脉冲的脉冲激光源和激光输出控制器，该激光器输出控制器可在激光源之外的位置可控地选择来自该组激光脉冲的脉冲子集以获得脉冲激光输出。基于激光的系统还包括用于使脉冲激光输出与目标材料的相对运动同步的机构。光束传送和聚焦子系统将同步脉冲激光输出的至少一部分作为激光材料处理输出提供给目标材料，以处理目标材料。定位子系统相对于脉冲激光输出移动目标材料。

9. 发明申请

WO2006078920A8 HIGH-SPEED, PRECISE, LASER-BASED MATERIAL PROCESSING METHOD AND SYSTEM 审中-公开
标题翻译：高速，精密，基于激光的材料加工方法和系统
公开(公告)号：WO2006078920A8
公开(公告)日：2006-12-28
申请号：PCT/US2006002063
申请日：2006-01-20
申请人： GSI LUMONICS CORP , JOHNSON SHEPARD D , GU BO , CORDINGLEY JAMES J
发明人： JOHNSON SHEPARD D , GU BO , CORDINGLEY JAMES J
IPC分类号： B23K26/00
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0622 , B23K26/08 , B23K26/0853 , B23K2201/36 , H01L2924/0002 , H01L2924/00
摘要： A high-speed, precise, laser-based material processing method and system are provided wherein relative movement of target material and a pulsed laser output used to process the material are synchronized. The laser-based system includes a pulsed laser source for generating a set of laser pulses, and a laser output control that controllably selects a subset of pulses from the set of laser pulses at a position beyond the laser source to obtain the pulsed laser output. The laser-based system further includes a mechanism for synchronizing the pulsed laser output with relative movement of the target material. A beam delivery and focusing subsystem delivers at least a portion of the synchronized pulsed laser output to the target material as a laser material processing output to process the target material. A positioning subsystem moves the target material relative to the pulsed laser output.
摘要翻译：提供了一种高速，精确的基于激光的材料处理方法和系统，其中目标材料和用于处理材料的脉冲激光输出的相对运动是同步的。基于激光的系统包括用于生成一组激光脉冲的脉冲激光源和激光输出控制器，激光输出控制可控地从超出激光源的位置选择来自该组激光脉冲的脉冲子集以获得脉冲激光输出。基于激光的系统还包括用于使脉冲激光输出与目标材料的相对运动同步的机构。光束传送和聚焦子系统将同步脉冲激光输出的至少一部分作为激光材料处理输出传送到目标材料以处理目标材料。定位子系统相对于脉冲激光输出移动目标材料。

10. 发明申请

WO2007092803A3 LASER-BASED REMOVAL OF TARGET LINK STRUCTURES 审中-公开
标题翻译：目标链路结构的基于激光的移除
公开(公告)号：WO2007092803A3
公开(公告)日：2008-09-18
申请号：PCT/US2007061592
申请日：2007-02-05
申请人： GSI GROUP CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/40
CPC分类号： B23K26/0736 , B23K26/0624 , B23K26/40 , B23K2203/50
摘要： Laser-based methods and systems for removing one or more target link structures 107 of a circuit fabricated on a substrate 110 includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output ontothe target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：提供了用于去除在基板110上制造的电路的一个或多个目标链路结构107的基于激光的方法和系统，包括产生比基板的吸收边缘小的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传递和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式