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    • 4. 发明授权
    • Integrated circuit configuration having at least one transistor and one capacitor, and method for fabricating it
    • 具有至少一个晶体管和一个电容器的集成电路配置及其制造方法
    • US06593614B1
    • 2003-07-15
    • US09716336
    • 2000-11-20
    • Franz HofmannWolfgang Krautschneider
    • Franz HofmannWolfgang Krautschneider
    • H01L27108
    • H01L27/10852H01L27/10808H01L27/10823H01L27/10876
    • A patterned conductive layer and a structure via which a transistor can be driven, e.g. a word line, are disposed one above the other. A vertical conductive structure, e.g. a spacer, connects a first source/drain region of the transistor to the conductive layer, with which it forms a first capacitor electrode which has a large effective area in conjunction with a high packing density. A capacitor dielectric is disposed over the vertical conductive structure and the conductive layer, and a second capacitor electrode is disposed over the capacitor dielectric. The vertical conductive structure may be disposed on a first sidewall of the first source/drain region and a gate electrode of the transistor may be disposed on an adjoining second sidewall of the first source/drain region. The circuit configuration may form a DRAM cell configuration.
    • 图案化的导电层和可以驱动晶体管的结构,例如, 一个字线,一个在另一个之上。 垂直导电结构,例如 间隔件将晶体管的第一源极/漏极区域连接到导电层,由此形成第一电容器电极,其具有大的有效面积并结合高的堆积密度。 电容器电介质设置在垂直导电结构和导电层之上,并且第二电容器电极设置在电容器电介质上。 垂直导电结构可以设置在第一源极/漏极区域的第一侧壁上,并且晶体管的栅电极可以设置在第一源极/漏极区域的相邻的第二侧壁上。 电路配置可以形成DRAM单元配置。
    • 10. 发明授权
    • Method for fabricating a memory cell
    • 用于制造存储单元的方法
    • US06399433B2
    • 2002-06-04
    • US09773218
    • 2001-01-31
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • H01L218242
    • H01L27/10852H01L27/10817H01L28/55
    • A method for producing a storage cell includes forming a polycrystalline silicon layer on a semiconductor body having at least one selection transistor disposed in a first plane. An interspace is formed between two adjacent structures of the layer and one of the adjacent structures of the layer is placed on a surface of a first silicon plug. A cell plate electrode is formed in the interspace and a trench is formed in the layer. The trench reaches as far as the first plug surface and is filled with an insulating layer. The-layer is removed. A storage capacitor having a high-epsilon or ferroelectric dielectric and a storage node electrode is formed. The capacitor is disposed in a second plane in and above the body. The insulating layer is replaced with silicon to form a second silicon plug directly connected to the first plug. The second plug is electrically connected to the storage node electrode, and the first plane is electrically connected to the second plane through the first and second plugs.
    • 一种存储单元的制造方法包括在半导体本体上形成多晶硅层,该多晶硅层具有设置在第一平面中的至少一个选择晶体管。 在层的两个相邻结构之间形成间隙,并且该层的相邻结构之一被放置在第一硅插头的表面上。 在该间隙中形成单元板电极,并在该层中形成沟槽。 沟槽达到第一插头表面的最远处,并且填充有绝缘层。 该层被删除。 形成具有高ε或铁电介质的存储电容器和存储节点电极。 电容器设置在身体内和上方的第二平面内。 绝缘层被硅替代以形成直接连接到第一插头的第二硅插头。 第二插头电连接到存储节点电极,第一平面通过第一和第二插头电连接到第二平面。