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1. 发明专利

JP2010076049A Dressing method, method for determining dressing condition, program for determining dressing condition, and polishing device 有权
标题翻译：连接方法，确定连接条件的方法，用于确定连接条件的程序和抛光装置
公开(公告)号：JP2010076049A
公开(公告)日：2010-04-08
申请号：JP2008247450
申请日：2008-09-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUDA AKIRA , MOCHIZUKI NOBUHIRO , WADA TAKETAKA , SHIOKAWA YOICHI , HIYAMA HIROKUNI
IPC分类号： B24B37/00 , B24B53/00 , B24B53/017 , B24B53/02 , H01L21/304
CPC分类号： B24B53/017
摘要： PROBLEM TO BE SOLVED: To provide a method capable of dressing a polishing member with a cutting amount sufficiently close to a predicted one by determining a dressing condition using the simulation having higher accuracy than the conventional one. SOLUTION: The dressing method dresses the polishing member 10 under a dressing condition determined by simulating sliding distance distribution of a diamond dresser 5 on a surface of the polishing member 10. The simulation takes into consideration the depth of cut made to the polishing member 10 by diamond particles disposed on a surface of the diamond dresser 5. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过使用具有比常规的更高精度的模拟来确定修整条件来修整具有足够接近预测的切削量的抛光构件的方法。
解决方案：修整方法将抛光构件10穿过通过模拟抛光构件10的表面上的金刚石修整器5的滑动距离分布所确定的修整条件。该模拟考虑了对抛光的切割深度成员10由设置在钻石修整器5的表面上的金刚石颗粒组成。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2007270720A Tube for liquid transfer and pump 审中-公开
标题翻译：用于液体转移和泵的管
公开(公告)号：JP2007270720A
公开(公告)日：2007-10-18
申请号：JP2006096998
申请日：2006-03-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NOMI MOTOHIKO , MOCHIZUKI NOBUHIRO , ICHIKI KATSUNORI , HIYAMA HIROKUNI , HIRATA KAZUYA
IPC分类号： F04B43/12
摘要： PROBLEM TO BE SOLVED: To provide a tube for liquid transfer having a high pressure resistance and deformable and recoverable easily. SOLUTION: This tube 10 comprises a metal hollow tube 11 made of a shape memory alloy and a solid elastic body 12 inserted into the metal hollow tube 11. A fluid flows in a ring-like space 13 formed between the solid elastic body 12 and the metal hollow tube 11. The solid elastic body 12 is easily deformed by an external force from the projecting part 32 of a rotary body 30, and recovered to its original shape when the external force is removed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有高耐压性和容易变形和回收的用于液体转移的管。解决方案：该管10包括由形状记忆合金制成的金属中空管11和插入金属中空管11中的固体弹性体12.流体在形成在固体弹性体 12和金属中空管11.固体弹性体12容易由旋转体30的突出部32的外力而变形，并且在去除外力时恢复到原来的形状。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2006114861A Polishing apparatus and polishing method 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2006114861A
公开(公告)日：2006-04-27
申请号：JP2005024182
申请日：2005-01-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KODERA MASAKO , MOCHIZUKI NOBUHIRO , FUKUDA AKIRA , KODERA AKIRA , HIYAMA HIROKUNI , TSUJIMURA MANABU
IPC分类号： H01L21/304 , B24B37/00 , B24B53/017 , B24B53/02 , B24B57/02 , H01L21/3205 , H01L21/321 , H01L21/768 , H01L23/52 , H01L23/522
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus and a polishing method which can prevent defects of wiring when an insulating material having a low mechanical strength is used. SOLUTION: The polishing apparatus comprises a polishing pad 9, a wafer holder 23 which polishes a wafer W with the wafer W slidably brought into contact with the polishing pad 9, and a dresser 33 which dresses the polishing pad 9 so as to increase the actual contact area between the polishing pad 9 and the wafer W. As a configuration example, the dresser 33 is configured to dress the polishing pad 9 so that multiple projections 9a formed on a surface of the polishing pad 9 have substantially the same height. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供当使用具有低机械强度的绝缘材料时能够防止布线缺陷的抛光装置和抛光方法。解决方案：抛光装置包括抛光垫9，晶片W抛光晶片W与晶片W可滑动地与抛光垫9接触的晶片保持器23和修整器33，该修整器33将抛光垫9装饰成增加抛光垫9和晶片W之间的实际接触面积。作为构造例，修整器33被构造成对抛光垫9进行打磨，使得形成在抛光垫9的表面上的多个突起9a具有基本上相同的高度。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2006275023A Flow control mechanism 审中-公开
标题翻译：流量控制机制
公开(公告)号：JP2006275023A
公开(公告)日：2006-10-12
申请号：JP2005099398
申请日：2005-03-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： HONGO AKIHISA , OSAWA SUSUMU , KINO YOSHINORI , HIYAMA HIROKUNI , MOCHIZUKI NOBUHIRO , SHINODA MASAO
IPC分类号： F04B43/02 , B01J19/00 , B81B3/00 , F04B43/04
摘要： PROBLEM TO BE SOLVED: To provide a flow control mechanism capable of preferably adjusting flow at which liquid can be quickly mixed even if a flow passage is wide to some extent.
SOLUTION: This flow control mechanism is provided with two flow passages 10A, 10B in which two liquids flow, two diaphragms 15A, 15B touching the two fluids respectively, and one or two diaphragm drives (16C or 16A, 16B) reciprocating the two diaphragms 15A, 15B. The two diaphragms 15A, 15B are constructed to synchronize and reciprocate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种流量控制机构，即使流路在某种程度上是宽的，也能够优选地调节液体可以快速混合的流动。解决方案：该流量控制机构设置有两个流体通道10A，10B，其中两个液体流动，分别接触两个流体的两个隔膜15A，15B和一个或两个隔膜驱动器（16C或16A，16B）两个隔膜15A，15B。两个隔膜15A，15B被构造成同步和往复运动。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006263903A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2006263903A
公开(公告)日：2006-10-05
申请号：JP2005247252
申请日：2005-08-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUDA AKIRA , MOCHIZUKI NOBUHIRO , HIROKAWA KAZUTO
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of polishing at good yielding even with roll-off, in a polishing device and a polishing method suitable for polishing a polished object such as a wafer with a semiconductor device formed in a flat and mirror-like finish. SOLUTION: This polishing device polishes a wafer W by relatively moving a polishing member 201 and the wafer W while applying a pressure between the polishing member (polishing pad) 201 and the wafer W held by a holding member (top ring) 52. The polishing device comprises a top ring 52 holding the wafer W, a pressure adjusting mechanism 206 for adjusting a supporting pressure supporting the polishing pad 201 by a supporting face of a retainer ring 203, and a control unit 208 controlling the pressure adjusting mechanism 206 in a manner that the supporting pressure becomes a desired pressure based on a roll-off volume of the wafer W. The top ring 52 comprises an air bag 202 pressing the wafer W to the polishing pad 201, the retainer ring 203 surrounding the wafer W, and the air bag 204 pressing the retainer ring 203. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种抛光装置，即使在滚压时也能够以良好的屈服进行抛光，在抛光装置中和抛光方法中，该抛光装置和抛光方法适用于抛光抛光物体，例如具有形成在半导体器件中的半导体器件的晶片平面和镜面般的完成。解决方案：该抛光装置通过在抛光构件（抛光垫）201和由保持构件（顶环）52保持的晶片W之间施加压力的同时相对移动抛光构件201和晶片W来抛光晶片W 抛光装置包括保持晶片W的顶环52，用于通过保持环203的支撑面调节支撑抛光垫201的支撑压力的压力调节机构206和控制压力调节机构206的控制单元208 以支撑压力成为基于晶片W的滚降体积的期望压力。顶环52包括将晶片W压向抛光垫201的气囊202，围绕晶片W的保持环203 ，以及按压保持环203的气囊204。（C）2007，JPO＆INPIT

6. 发明专利

JP2003004008A Water pressure cylinder 审中-公开
标题翻译：水压缸
公开(公告)号：JP2003004008A
公开(公告)日：2003-01-08
申请号：JP2001191269
申请日：2001-06-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MOCHIZUKI NOBUHIRO , FUKUZUMI YUKIHIRO , YAMASHINA TOMOSHIRO
IPC分类号： F15B15/14
摘要： PROBLEM TO BE SOLVED: To provide a low-cost water pressure cylinder capable of being lightweight, small-sized, free from corrosion problem and easy to form outer circumferential portion thereof.
SOLUTION: In a water pressure cylinder utilizing water as an operational fluid and comprising a cylinder tube 2 and a piston 3 slidable in the cylinder tube 2, the cylinder tube 2 is constituted by a plastic cylinder (cylinder tube 2a) and a metallic cylinder (cylinder 2b) fitted into the plastic cylinder.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种重量轻，小型化，无腐蚀问题，容易形成外周部的低成本水压缸。解决方案：在利用水作为工作流体的水压缸中，包括可在缸筒2中滑动的缸筒2和活塞3，缸筒2由塑料缸（缸筒2a）和金属缸圆筒2b）装入塑料圆筒。

7. 发明专利

JP2014172156A Property measuring device for polishing liquid 有权
标题翻译：用于抛光液体的物性测量装置
公开(公告)号：JP2014172156A
公开(公告)日：2014-09-22
申请号：JP2013049687
申请日：2013-03-12
申请人： Ebara Corp , 株式会社荏原製作所 , Kyushu Institute Of Technology , 国立大学法人九州工業大学
发明人： MATSUO NAONORI , MOCHIZUKI NOBUHIRO , SUZUKI YOSHITOMO , FUKAGAWA HIRONOBU , KIMURA KEIICHI , KHAJORNRUNGRUANG PANART
IPC分类号： B24B37/00 , B24B37/34 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a property measuring device for a polishing liquid capable of stably and directly measuring the property of the polishing liquid existing on an abrasive pad.SOLUTION: A property measuring device for a polishing liquid includes: a polishing liquid storage mechanism 6 for storing a polishing liquid by damming the polishing liquid on an abrasive pad 2; and a sensor 7 for measuring the property of the polishing liquid stored in the polishing liquid storage mechanism 6. The sensor 7 is capable of directly measuring pH or ORP (oxidation reduction potential) of the polishing liquid so as to be used for controlling polishing conditions, such as a condition of supplying the polishing liquid.
摘要翻译：要解决的问题：提供一种能够稳定且直接地测量存在于研磨垫上的抛光液的性质的抛光液性质测量装置。解决方案：一种用于抛光液的性质测量装置，包括：抛光液储存机构 6，用于通过将抛光液体阻挡在研磨垫2上来存储抛光液; 以及用于测量存储在抛光液体存储机构6中的抛光液的性质的传感器7.传感器7能够直接测量抛光液的pH或ORP（氧化还原电位），以用于控制抛光条件，例如提供抛光液的条件。

8. 发明专利

JP2008157932A Micro fluid device and temperature control system for micro fluid device 审中-公开
标题翻译：微流体装置的微流体装置和温度控制系统
公开(公告)号：JP2008157932A
公开(公告)日：2008-07-10
申请号：JP2007310416
申请日：2007-11-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ICHIKI KATSUNORI , MOCHIZUKI NOBUHIRO
IPC分类号： G01N35/08 , B01J19/00 , B81B1/00 , G01N35/00 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To enable a temperature of a micro fluid device to be controlled locally. SOLUTION: The micro fluid device has an aperture near a region whose temperature is controlled, whereby the temperature of the micro fluid device can be controlled locally. Furthermore, a method for controlling the temperature of the micro fluid device is provided, which comprises: a step of introducing a heat exchange fluid or inserting a heat exchange member into the aperture of the micro fluid device; and a step of performing a heat exchange with the micro fluid device through the heat exchange fluid or the heat exchange member. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了使微流体装置的温度受到局部控制。解决方案：微流体装置在温度受到控制的区域附近具有孔径，从而可以局部地控制微流体装置的温度。此外，提供了一种用于控制微流体装置的温度的方法，其包括：引入热交换流体或将热交换构件插入微流体装置的孔中的步骤; 以及通过热交换流体或热交换构件与微流体装置进行热交换的步骤。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007270689A Micro-pump device and fluid transfer method 审中-公开
标题翻译：微泵装置和流体传递方法
公开(公告)号：JP2007270689A
公开(公告)日：2007-10-18
申请号：JP2006095777
申请日：2006-03-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MOCHIZUKI NOBUHIRO , HIRATA KAZUYA , HIYAMA HIROKUNI , ICHIKI KATSUNORI , NOMI MOTOHIKO
IPC分类号： F04B43/12 , F04B13/00
摘要： PROBLEM TO BE SOLVED: To provide a micro-pump device for stably transferring a fluid at a very low flow-rate, continuously and quantitatively without causing pulsation. SOLUTION: The micro-pump device 1 includes a plurality of elastic tubes 10 in which fluid is circulated, a projection 26 for forming a plurality of airtight spaces in the inside of the elastic tubes 10 by pressing the elastic tubes 10, a direct-drive motor 16 for transferring the fluid by moving the projection 26 relative to the elastic tubes 10, a flow-rate sensor 36 for detecting a flow-rate of the fluid on the discharge side, a pressure sensor 38 for detecting pressure of the fluid on the discharge side, and a controller 44 for regulating the movement rate of the projection 26 by the direct drive motor 16 on the basis of output signals of the flow-rate sensor 36 and the pressure sensor 38. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于以非常低的流速，连续和定量地稳定地转移流体而不引起脉动的微型泵装置。解决方案：微泵装置1包括流体循环的多个弹性管10，用于通过按压弹性管10在弹性管10的内部形成多个气密空间的突起26，用于通过相对于弹性管10移动突起26来传送流体的直接驱动电动机16，用于检测排出侧的流体的流量的流量传感器36，用于检测喷射侧的压力的压力传感器38 排出侧的流体;以及控制器44，用于根据流量传感器36和压力传感器38的输出信号，通过直接驱动电动机16调节突起26的移动速度。（COPYRIGHT：（ C）2008，JPO＆INPIT

10. 发明专利

JP2006286715A Surface processing equipment 审中-公开
标题翻译：表面加工设备
公开(公告)号：JP2006286715A
公开(公告)日：2006-10-19
申请号：JP2005101350
申请日：2005-03-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SHIBATA AKIO , MOCHIZUKI NOBUHIRO
IPC分类号： H01L21/302 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To provide surface processing equipment which can perform processing such as etching while keeping a high anisotropy without giving damages by charge up to a work piece.
SOLUTION: The surface processing equipment comprises a processing gas activation chamber 14, processing gas supply system 24 for supplying a processing gas to the processing gas activation chamber 14, processing gas activation mechanism 34 for activating the processing gas supplied into the processing gas activation chamber 14, processing chamber 20 wherein the work piece is placed, reactive gas supply system 31 for supplying a reactive gas to the processing chamber 20, evacuation mechanism 11 for evacuating the processing chamber 20, and perforated panel 15 placed between the processing gas activation chamber 14 and the processing chamber 20. The perforated panel 15 has many through-pores 15a.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以进行诸如蚀刻之类的处理的表面处理设备，同时保持高各向异性，而不会对通过工件的充电造成损害。解决方案：表面处理设备包括处理气体活化室14，用于向处理气体活化室14供应处理气体的处理气体供应系统24，用于启动供应到处理气体中的处理气体的处理气体启动机构34 活化室14，其中放置工件的处理室20，用于向处理室20供应反应性气体的反应气体供应系统31，用于抽空处理室20的抽空机构11和放置在处理气体活化之间的穿孔板15 室14和处理室20.多孔板15具有许多通孔15a。版权所有（C）2007，JPO＆INPIT

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