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1. 发明授权

US4184189A Capacitive pressure sensor and method of making it 失效
标题翻译：电容式压力传感器及其制作方法
公开(公告)号：US4184189A
公开(公告)日：1980-01-15
申请号：US933318
申请日：1978-08-14
申请人： Earl K. Davis , Kent W. Hansen , Scot W. Taylor , Robert M. Wentworth
发明人： Earl K. Davis , Kent W. Hansen , Scot W. Taylor , Robert M. Wentworth
IPC分类号： G01L9/12 , C03C8/24 , C03C27/06 , G01L9/00 , C03B23/20
CPC分类号： G01L9/0075 , C03C27/06 , C03C8/245 , Y10T29/43
摘要： An inexpensive glass capacitive pressure sensor. Conductive capacitor electrodes are disposed on two flat glass plates, one serving as a diaphragm, the other as a substrate. The electrodes are positioned in a spaced apart, substantially parallel relationship to form the plates of a parallel plate capacitor. The glass plates are sealed together with a sealing glass mixture to bound a volume between the conductors. The volume is at a reference pressure, preferably a substantial vacuum. Differences between the pressure to be measured and this reference pressure cause a flexing of the glass diaphragm which is detected by measuring the capacitance between the two electrodes. A suitable sealing glass mixture which provides a hermetic seal between the glass plates is comprised of, in weight percent, 8-10 SiO.sub.2, 1-2 Al.sub.2 O.sub.3, 55-60 PbO, 7-9 PbF.sub.2, 7-10 ZnO, 4-6 CdO, and 10-15 B.sub.2 O.sub.3. The sealing glass mixture must be vacuum fined to permit hermetic sealing within a vacuum.
摘要翻译：廉价的玻璃电容式压力传感器。导电电容器电极设置在两个平板玻璃板上，一个用作隔膜，另一个用作基板。电极以间隔开的基本平行的关系定位，以形成平行板电容器的板。玻璃板与密封玻璃混合物一起密封在一起以结合导体之间的体积。体积处于参考压力，优选实质上真空。要测量的压力与该参考压力之间的差异导致通过测量两个电极之间的电容而检测的玻璃隔膜的弯曲。在玻璃板之间提供气密密封的合适的密封玻璃混合物以重量百分数包含8-10SiO 2，1-2 Al 2 O 3，55-60PbO，7-9 PbF 2，7-10 ZnO，4-6 CdO和10-15B2O3。密封玻璃混合物必须真空处理，以在真空中进行气密封装。

2. 发明授权

US4349635A Lower temperature glass and hermetic seal means and method 失效
标题翻译：低温玻璃和气密密封装置和方法
公开(公告)号：US4349635A
公开(公告)日：1982-09-14
申请号：US315102
申请日：1981-10-26
申请人： Earl K. Davis , Rafael Landron , Scot W. Taylor
发明人： Earl K. Davis , Rafael Landron , Scot W. Taylor
IPC分类号： H05K5/06 , C03C8/04 , C03C8/14 , C03C8/24 , C03C27/02 , H01L23/10 , C03C7/02 , C03C3/08
CPC分类号： H01L23/10 , C03C8/04 , C03C8/24 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701
摘要： An improved lead-free glass or glass plus alumina ceramic sealing material for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:______________________________________ Composition Range Element Pb-free Glass (Glass plus alumina) ______________________________________ SiO.sub.2 40-50 34-50 Al.sub.2 O.sub.3 2-12 2-25 K.sub.2 O 2-6 2-6 Na.sub.2 O 5-9 4-9 Li.sub.2 O 2-6 2-6 CaO 0-4 0-4 ZnO 5-12 4-12 BaO 1-5 1-5 TiO.sub.2 2-6 2-6 B.sub.2 O.sub.3 13-21 11-21 ______________________________________
摘要翻译：描述了一种用于在半导体器件封装中制造压缩玻璃密封电引线的改进的无铅玻璃或玻璃加氧化铝陶瓷密封材料，其中改进的密封材料基本上由以下重量百分比的成分范围组成： - 组成范围 - 元素Pb （玻璃加氧化铝）-SiO2 40-50 34-50 -Al2O3 2-12 2-25-K2O 2-6 2-6 -Na2O 5-9 4-9 -Li2O 2-6 2-6 -CaO 0-4 0-4 -ZnO 5-12 4-12 -BaO 1-5 1-5 -TiO2 2-6 2-6 -B2O3 13-21 11-21 -

3. 发明授权

US4417913A Lower temperature glass and hermetic seal means and method 失效
标题翻译：低温玻璃和气密密封装置和方法
公开(公告)号：US4417913A
公开(公告)日：1983-11-29
申请号：US382057
申请日：1982-05-26
申请人： Earl K. Davis , Rafael Landron , Scot W. Taylor
发明人： Earl K. Davis , Rafael Landron , Scot W. Taylor
IPC分类号： C03C8/04 , C03C8/24 , H01L23/10 , C03C29/00 , C03C7/02
CPC分类号： H01L23/10 , C03C8/04 , C03C8/24 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701
摘要： An improved lead-free glass or glass plus alumina ceramic sealing material composition for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:______________________________________ Pb-Free Glass Element Composition Range Glass Plus Alumina ______________________________________ SiO.sub.2 40-50 34-50 Al.sub.2 O.sub.3 2-12 2-25 K.sub.2 O 2-6 2-6 Na.sub.2 O 5-9 4-9 Li.sub.2 O 2-6 2-6 CaO 0-4 0-4 ZnO 5-12 4-12 BaO 1-5 1-5 TiO.sub.2 2-6 2-6 B.sub.2 O.sub.3 13-21 11-21 ______________________________________
摘要翻译：描述了用于在半导体器件封装中制造压缩玻璃密封电引线的改进的无铅玻璃或玻璃加氧化铝陶瓷密封材料组合物，其中改进的密封材料基本上由以下重量百分比的成分范围组成： - 无铅玻璃 - 元素组成范围玻璃加氧化铝-SiO2 40-50 34-50 -Al2O3 2-12 2-25 -K2O 2-6 2-6 -Na2O 5-9 4-9 -Li2O 2-6 2-6 -CaO 0 -4 0-4 -ZnO 5-12 4-12 -BaO 1-5 1-5 -TiO2 2-6 2-6 -B2O3 13-21 11-21 -

4. 发明授权

US3964920A Solder glass composition and method of using same for encapsulating devices 失效
标题翻译：焊料玻璃组合物及其使用方法用于封装装置
公开(公告)号：US3964920A
公开(公告)日：1976-06-22
申请号：US409843
申请日：1973-10-26
申请人： Earl K. Davis , Kent W. Hansen , Duane C. Silvis
发明人： Earl K. Davis , Kent W. Hansen , Duane C. Silvis
IPC分类号： C03C3/14 , C03C3/074 , C03C4/00 , C03C8/24 , C03C14/00 , C04B37/00 , H01L23/10 , H01L23/29 , H01L23/495 , C03C3/04 , C03C3/10
CPC分类号： C03C4/00 , C03C14/004 , C03C3/0745 , C03C8/245 , C04B35/645 , C04B37/005 , H01L23/10 , H01L23/291 , H01L23/49541 , C03C2214/04 , C04B2235/6567 , C04B2237/068 , C04B2237/10 , C04B2237/343 , C04B2237/64 , C04B2237/708 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01079 , H01L2924/09701
摘要： A method for sealing two ceramic pieces, a lead frame and a semiconductor chip together involving the application of pressure to a layer of sealing glass composition which remains vitreous throughout the sealing process is disclosed. The sealing glass composition comprises a mixture of sealing glass and zirconium silicate in the volume percentage amounts of 50-62 percent of glass and 50-38 percent of zirconium silicate. The glass components comprise, as a percentage weight of the glass alone, SiO.sub.2 about 0-2 percent, PbO about 65-72 percent, ZnO about 5-10 percent, PbF.sub.2 about 2-10 percent, CdO about 1-5 percent, TiO.sub.2 about 0.5-3 percent and B.sub.2 O.sub.3 about 10-14 percent.
摘要翻译：公开了一种将两个陶瓷件，引线框架和半导体芯片一起密封在一起的方法，其中包括在整个密封过程中保持玻璃状的密封玻璃组合物施加压力。密封玻璃组合物包括密封玻璃和硅酸锆的混合物，其体积百分数为玻璃的50-62％和硅酸锆的50-38％。玻璃组分以单独的玻璃的百分比重量包含SiO 2约0-2％，PbO约65-72％，ZnO约5-10％，PbF 2约2-10％，CdO约1-5％，TiO 2 约0.5-3％，B2O3约10-14％。

5. 发明授权

US4131478A Sealing glass compositions and method 失效
标题翻译：密封玻璃的组成和方法
公开(公告)号：US4131478A
公开(公告)日：1978-12-26
申请号：US828017
申请日：1977-08-26
申请人： Earl K. Davis , Kent W. Hansen
发明人： Earl K. Davis , Kent W. Hansen
IPC分类号： C03C8/24 , C03C3/10
CPC分类号： C03C8/245
摘要： A solder glass/ceramic composition and method for sealing television picture tube components wherein the composition remains vitreous throughout the sealing process. The composition comprises a mixture of 9-15 weight percent aluminum oxide and 91-85 weight percent solder glass. The solder glass components comprise, in weight percent of the glass alone, SiO.sub.2 about 2-4 percent, PbO about 64-66 percent, PbF.sub.2 about 5-10 percent, ZnO about 6-9 percent, CdO about 4-6 percent, and B.sub.2 O.sub.3 about 12-14 percent.
摘要翻译：焊接玻璃/陶瓷组合物和密封电视显像管组件的方法，其中组合物在整个密封过程中保持玻璃状。该组合物包含9-15重量％的氧化铝和91-85重量％的焊料玻璃的混合物。焊料玻璃组分以单独的玻璃的重量百分比计包含SiO 2约2-4％，PbO约64-66％，PbF 2约5-10％，ZnO约6-9％，CdO约4-6％，以及 B2O3约12-14％。

6. 发明授权

US4592794A Glass bonding method 失效
标题翻译：玻璃粘合法
公开(公告)号：US4592794A
公开(公告)日：1986-06-03
申请号：US696219
申请日：1985-01-29
申请人： Earl K. Davis , James E. Drye , David J. Reed
发明人： Earl K. Davis , James E. Drye , David J. Reed
IPC分类号： C03C8/24 , C04B37/02 , H01L21/58 , H01L23/10 , H01L23/15 , B32B31/06 , B32B31/20
CPC分类号： H01L24/83 , C03C8/24 , C03C8/245 , C04B37/025 , H01L23/10 , H01L23/15 , H01L24/28 , H01L24/32 , C04B2237/10 , C04B2237/343 , C04B2237/402 , C04B2237/708 , C04B2237/84 , C04B2237/86 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2224/8389 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15173 , H01L2924/15787 , H01L2924/19043 , H01L2924/3011
摘要： An improved semiconductor die bonding structure and method for electrical devices is described which utilizes a ductile foil between the semiconductor die and the base of the device package. The die is sealed to the foil with a die bonding material formed from a titania free base glass to which has been added 23.6 to 36.4 weight percent lead titanate powder to give a glass plus ceramic mixture consisting essentially of (by weight percent) 2.5-10.7% GeO.sub.2, 0-2.3% SiO.sub.2, 58.6-78.5% PbO, 0-5.3% PbF.sub.2, 7-13% B.sub.2 O.sub.3, 2.5-6.9% Al.sub.2 O.sub.3, 0-5.3% ZnO, 0.4-2.3% V.sub.2 O.sub.5, 0-5.3% CdO, and 6.2-9.6% TiO.sub.2. The ductile foil is bonded to the ceramic package base directly without intermediate layers or alternatively by means of an improved foil bonding glass material consisting essentially of (by weight percent) 10-15% SiO.sub.2, 45-55% PbO, 8-12% ZnO, 2-5% Al.sub.2 O.sub.3, and 25-30% B.sub.2 O.sub.3.
摘要翻译：描述了一种用于电气设备的改进的半导体管芯接合结构和方法，其利用半导体管芯和器件封装的基极之间的延性箔。模具通过由二氧化钛游离基础玻璃形成的管芯接合材料密封到其上，向其中加入23.6至36.4重量％的钛酸铅粉末，得到基本上由（重量百分比）2.5-10.7组成的玻璃加陶瓷混合物％GeO 2，0-2.3％SiO 2，58.6-78.5％PbO，0-5.3％PbF 2，7-13％B 2 O 3，2.5-6.9％Al 2 O 3，0-5.3％ZnO，0.4-2.3％V 2 O 5，0-5.3％CdO ，和6.2-9.6％的TiO2。延展性箔片直接连接到陶瓷封装基材上，无中间层，或者通过改进的箔结合玻璃材料，基本上由（重量百分比）10-15％的SiO2，45-55％的PbO，8-12％的ZnO ，2-5％Al2O3和25-30％B2O3。

7. 发明授权

US4800421A Glass bonding means and method 失效
标题翻译：玻璃粘合手段和方法
公开(公告)号：US4800421A
公开(公告)日：1989-01-24
申请号：US822571
申请日：1986-01-27
申请人： Earl K. Davis , James E. Drye , David J. Reed
发明人： Earl K. Davis , James E. Drye , David J. Reed
IPC分类号： C03C8/24 , C04B37/02 , H01L21/58 , H01L23/10 , H01L23/15 , H01L39/02
CPC分类号： H01L24/32 , C03C8/24 , C03C8/245 , C04B37/025 , H01L23/10 , H01L23/15 , H01L24/83 , C04B2237/10 , C04B2237/343 , C04B2237/402 , C04B2237/708 , C04B2237/84 , C04B2237/86 , H01L2224/2919 , H01L2224/32225 , H01L2224/8319 , H01L2224/8385 , H01L2224/8389 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/19043 , H01L2924/3011
摘要： An improved semiconductor die bonding structure and method for electrical devices is described which utilizes a ductile foil between the semiconductor die and the base of the device package. The die is sealed to the foil with a die bonding material formed from a titania free base glass to which has been added 23.6 to 36.4 weight percent lead titanate powder to give a glass plus ceramic mixture consisting essentially of (by weight percent) 2.5-10.7% GeO.sub.2, 0-2.3% SiO.sub.2, 58.6-78.5% PbO, 0-5.3% PbF.sub.2, 7-13% B.sub.2 O.sub.3, 2.5-6.9% Al.sub.2 O.sub.3, 0-5.3% ZnO, 0.4-2.3% V.sub.2 O.sub.5, 0-5.3% CdO, and 6.2-9.6% TiO.sub.2. The ductile foil is bonded to the ceramic package base directly without intermediate layers or alternatively by means of an improved foil bonding glass material consisting essentially of (by weight percent) 10-15% SiO.sub.2, 45-55% PbO, 8-12% ZnO, 2-5% Al.sub.2 O.sub.3, and 25-30% B.sub.2 O.sub.3.
摘要翻译：描述了一种用于电气设备的改进的半导体管芯接合结构和方法，其利用半导体管芯和器件封装的基极之间的延性箔。模具通过由二氧化钛游离基础玻璃形成的管芯接合材料密封到其上，向其中加入23.6至36.4重量％的钛酸铅粉末，得到基本上由（重量百分比）2.5-10.7组成的玻璃加陶瓷混合物％GeO 2，0-2.3％SiO 2，58.6-78.5％PbO，0-5.3％PbF 2，7-13％B 2 O 3，2.5-6.9％Al 2 O 3，0-5.3％ZnO，0.4-2.3％V 2 O 5，0-5.3％CdO ，和6.2-9.6％的TiO2。延展性箔片直接连接到陶瓷封装基材上，无中间层，或者通过改进的箔结合玻璃材料，基本上由（重量百分比）10-15％的SiO2，45-55％的PbO，8-12％的ZnO ，2-5％Al2O3和25-30％B2O3。

8. 发明授权

US4309507A Glass and hermetic seal 失效
标题翻译：玻璃和气密密封
公开(公告)号：US4309507A
公开(公告)日：1982-01-05
申请号：US237001
申请日：1981-02-23
申请人： Earl K. Davis , Robert W. Hey
发明人： Earl K. Davis , Robert W. Hey
IPC分类号： C03C3/091 , C03C8/24 , C03C3/04 , C03C3/08
CPC分类号： C03C3/091 , C03C8/24 , Y10T403/217
摘要： An improved sealing glass composition for making compression glass electrical feedthroughs in semiconductor device packages is described wherein the improved sealing glass consists essentially of (by weight percent) 63-68% SiO.sub.2, 3-6% Al.sub.2 O.sub.3, 8-9% K.sub.2 O, 5-6% Na.sub.2 O, 0.5-1.5% Li.sub.2 O, 2-4% BaO, 5-7% SrO, 2-4% CaO, 0.5-1.5% MgO, 0.5-1.5% TiO.sub.2, and 0.5-1.5% B.sub.2 O.sub.3.
摘要翻译：描述了一种用于制造半导体器件封装中的压缩玻璃电馈通的改进的密封玻璃组合物，其中改进的密封玻璃基本上由（重量百分比）的63-68％SiO 2，3-6％Al 2 O 3，8-9％K 2 O， 6％Na2O，0.5-1.5％Li2O，2-4％BaO，5-7％SrO，2-4％CaO，0.5-1.5％MgO，0.5-1.5％TiO2和0.5-1.5％B2O3。

9. 发明授权

US4146655A Method for encapsulating a semiconductor diode 失效
标题翻译：封装半导体二极管的方法
公开(公告)号：US4146655A
公开(公告)日：1979-03-27
申请号：US919027
申请日：1978-06-26
申请人： Earl K. Davis , Richard L. Greeson
发明人： Earl K. Davis , Richard L. Greeson
IPC分类号： C03C3/072 , C03C8/24 , H01B3/08 , H01L21/56 , H01L23/29 , C03C3/10 , H01L23/30
CPC分类号： H01L21/56 , C03C3/072 , C03C8/245 , H01B3/087 , H01L23/291 , H01L2924/0002
摘要： An improved method for encapsulating a semiconductor diode wherein a semiconductor chip and a pair of leads are surrounded by an insulating glass. The improvement comprising the providing of an alkaline free low temperature encapsulating glass for semiconductors consisting essentially of 11-15 weight percent silica, 7-11 weight percent alumina, 63-68 weight percent lead oxide, 4-10 weight percent lead fluoride and 5-10 weight percent borate.

10. 发明授权

US4515898A Glass bonding means and method 失效
标题翻译：玻璃粘合手段和方法
公开(公告)号：US4515898A
公开(公告)日：1985-05-07
申请号：US614573
申请日：1984-05-25
申请人： Earl K. Davis , James E. Drye , David J. Reed
发明人： Earl K. Davis , James E. Drye , David J. Reed
IPC分类号： C03C8/24 , C04B37/02 , H01L21/58 , H01L23/10 , H01L23/15 , C03C3/10 , C03C3/12
CPC分类号： H01L24/83 , C03C8/24 , C03C8/245 , C04B37/025 , H01L23/10 , H01L23/15 , H01L24/28 , H01L24/32 , C04B2237/10 , C04B2237/343 , C04B2237/402 , C04B2237/708 , C04B2237/84 , C04B2237/86 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2224/8389 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/19043 , H01L2924/3011
摘要： An improved semiconductor die bonding structure and method for electrical devices is described which utilizes a ductile foil between the semiconductor die and the base of the device package. The die is sealed to the foil with a die bonding material formed from a titania free base glass to which has been added 23.6 to 36.4 weight percent lead titanate powder to give a glass plus ceramic mixture consisting essentially of (by weight percent) 2.5-10.7% GeO.sub.2, 0-2.3% SiO.sub.2, 58.6-78.5% PbO, 0-5.3% PbF.sub.2, 7-13% B.sub.2 O.sub.3, 2.5-6.9% Al.sub.2 O.sub.3, 0-5.3% ZnO, 0.4-2.3% V.sub.2 O.sub.5, 0-5.3% CdO, and 6.2-9.6% TiO.sub.2. The ductile foil is bonded to the ceramic package base directly without intermediate layers or alternatively by means of an improved foil bonding glass material consisting essentially of (by weight percent) 10-15% SiO.sub.2, 45-55% PbO, 8-12% ZnO, 2-5% Al.sub.2 O.sub.3, and 25-30% B.sub.2 O.sub.3.
摘要翻译：描述了一种用于电气设备的改进的半导体管芯接合结构和方法，其利用半导体管芯和器件封装的基极之间的延性箔。模具通过由二氧化钛游离基础玻璃形成的管芯接合材料密封到其上，向其中加入23.6至36.4重量％的钛酸铅粉末，得到基本上由（重量百分比）2.5-10.7组成的玻璃加陶瓷混合物％GeO 2，0-2.3％SiO 2，58.6-78.5％PbO，0-5.3％PbF 2，7-13％B 2 O 3，2.5-6.9％Al 2 O 3，0-5.3％ZnO，0.4-2.3％V 2 O 5，0-5.3％CdO ，和6.2-9.6％的TiO2。延展性箔片直接连接到陶瓷封装基材上，无中间层，或者通过改进的箔结合玻璃材料，基本上由（重量百分比）10-15％的SiO2，45-55％的PbO，8-12％的ZnO ，2-5％Al2O3和25-30％B2O3。

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