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1. 发明申请

US20220390356A1 DEVICE AND METHOD FOR MEASURING A SUBSTRATE 有权
公开(公告)号：US20220390356A1
公开(公告)日：2022-12-08
申请号：US17774612
申请日：2019-11-28
申请人： EV Group E. Thallner GmbH
发明人： Jacek GASIOROWSKI , Markus WIMPLINGER
IPC分类号： G01N21/21 , G01N21/95 , G06F30/20
摘要： The invention relates to a method for measuring a multilayered substrate (1, 1′, 1″), particularly with at least one structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, particularly with a surface structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, characterized in that the method has at least the following steps, particularly the following procedure:
producing (110) the substrate (1, 1′, 1″) with a plurality of layers (2, 3, 4, 5, 6, 6′, 6″), particularly with a structure (7, 7′, 7″, 7′″, 7IV, 7V), particularly with a structure (7, 7′, 7″, 7″′, 7IV, 7V) on a surface (6o, 6′o, 6″o) of an uppermost layer (6, 6′, 6″), wherein the dimensions of the layers and in particular the structures are known,
measuring (120) the substrate (1, 1′, 1″), and in particular the structure (7, 7′, 7″, 7′″, 71IV, 7V)) using at least one measuring technology,
creating (130) a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″),
comparing (140) the measurement results with simulation results from the simulation of the substrate (1, 1′, 1″),
optimizing the simulation (130) and renewed creation (130) of a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″), in the event that there is a deviation of the measurement results from the simulation results, or calculating (150) parameters of further substrates, in the event that the measurement results correspond to the simulation results.

2. 发明申请

US20180145048A1 METHOD FOR APPLYING A BONDING LAYER 审中-公开
公开(公告)号：US20180145048A1
公开(公告)日：2018-05-24
申请号：US15875335
申请日：2018-01-19
申请人： EV GROUP E. THALLNER GMBH
发明人： Markus WIMPLINGER
IPC分类号： H01L23/00 , B81C3/00
CPC分类号： H01L24/83 , B81C3/001 , B81C2203/036 , H01L24/29 , H01L24/32 , H01L2224/29082 , H01L2224/291 , H01L2224/29105 , H01L2224/29111 , H01L2224/29116 , H01L2224/29117 , H01L2224/29118 , H01L2224/29123 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29184 , H01L2224/32145 , H01L2224/32507 , H01L2224/8302 , H01L2224/83022 , H01L2224/8381 , H01L2224/83894 , H01L2924/01003 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01034 , H01L2924/01037 , H01L2924/01038 , H01L2924/0105 , H01L2924/01052 , H01L2924/01055 , H01L2924/01056 , H01L2924/01322 , H01L2924/10251 , H01L2924/10252 , H01L2924/10253 , H01L2924/1026 , H01L2924/10271 , H01L2924/10272 , H01L2924/10323 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/10336 , H01L2924/10346 , H01L2924/1037 , H01L2924/10371 , H01L2924/10372 , H01L2924/10373 , H01L2924/10375 , H01L2924/10376 , H01L2924/10377 , H01L2924/10821 , H01L2924/10823 , H01L2924/10831 , H01L2924/00 , H01L2924/00014 , H01L2924/01032 , H01L2924/01013 , H01L2924/01031 , H01L2924/0103
摘要： A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

3. 发明申请

US20160225625A1 APPARATUS AND METHOD FOR BONDING SUBSTRATES 有权
标题翻译：用于粘接基板的装置和方法
公开(公告)号：US20160225625A1
公开(公告)日：2016-08-04
申请号：US15021725
申请日：2013-09-25
申请人： EV GROUP E. THALLNER GMBH
发明人： Markus WIMPLINGER , Viorel DRAGOI , Christoph FLOTGEN
IPC分类号： H01L21/18 , H01L21/263
CPC分类号： H01L21/187 , H01L21/263 , H01L21/67092
摘要： A device and method for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate with the following features: a workspace that can be closed, gas-tight, against the environment and can be supplied with a vacuum, the workspace comprises: a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.
摘要翻译：一种用于在第一基板的接合侧和第二基板的接合侧之间产生导电直接接合的装置和方法，具有以下特征：可以关闭，气密地抵抗环境并且可以供应的工作空间工作空间包括：a）至少一个等离子体室，用于修改至少一个接合侧面和至少一个用于粘合接合侧面的接合室，和/或b）至少一个组合接合/等离子体室，用于修改粘合侧中的至少一个并且用于粘合粘合侧。

4. 发明申请

US20180130658A1 APPARATUS AND METHOD FOR BONDING SUBSTRATES 审中-公开
公开(公告)号：US20180130658A1
公开(公告)日：2018-05-10
申请号：US15862678
申请日：2018-01-05
申请人： EV GROUP E. THALLNER GMBH
发明人： Markus WIMPLINGER , Viorel DRAGOI , Christoph FLOTGEN
IPC分类号： H01L21/18 , H01L21/263
CPC分类号： H01L21/187 , H01L21/263 , H01L21/67092
摘要： A device and method is described for producing an electrically conductive direct bond between a bonding side of a first substrate and a bonding side of a second substrate. A workspace is included that can be closed, gas-tight, against the environment and can be supplied with a vacuum. The workspace includes a) at least one plasma chamber for modifying at least one of the bonding sides and at least one bonding chamber for bonding the bonding sides, and/or b) at least one combined bonding/plasma chamber for modifying at least one of the bonding sides and for bonding the bonding sides.

5. 发明申请

US20160190092A1 METHOD FOR APPLYING A BONDING LAYER 有权
标题翻译：应用粘结层的方法
公开(公告)号：US20160190092A1
公开(公告)日：2016-06-30
申请号：US14909157
申请日：2013-09-13
申请人： EV GROUP E. THALLNER GMBH
发明人： Markus WIMPLINGER
IPC分类号： H01L23/00 , B81C3/00
CPC分类号： H01L24/83 , B81C3/001 , B81C2203/036 , H01L24/29 , H01L24/32 , H01L2224/29082 , H01L2224/291 , H01L2224/29105 , H01L2224/29111 , H01L2224/29116 , H01L2224/29117 , H01L2224/29118 , H01L2224/29123 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29184 , H01L2224/32145 , H01L2224/32507 , H01L2224/8302 , H01L2224/83022 , H01L2224/8381 , H01L2224/83894 , H01L2924/01003 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01034 , H01L2924/01037 , H01L2924/01038 , H01L2924/0105 , H01L2924/01052 , H01L2924/01055 , H01L2924/01056 , H01L2924/01322 , H01L2924/10251 , H01L2924/10252 , H01L2924/10253 , H01L2924/1026 , H01L2924/10271 , H01L2924/10272 , H01L2924/10323 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/10336 , H01L2924/10346 , H01L2924/1037 , H01L2924/10371 , H01L2924/10372 , H01L2924/10373 , H01L2924/10375 , H01L2924/10376 , H01L2924/10377 , H01L2924/10821 , H01L2924/10823 , H01L2924/10831 , H01L2924/00 , H01L2924/00014 , H01L2924/01032 , H01L2924/01013 , H01L2924/01031 , H01L2924/0103
摘要： A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.
摘要翻译：一种通过以下方法将基底层和保护层构成的接合层施加于基板上的方法：将可氧化碱性材料作为基底层施加到基板的粘接侧，至少部分覆盖具有至少部分可溶解在作为保护层的基础材料中的保护材料的基础层。此外，本发明涉及相应的基板。

6. 发明公开

US20230150180A1 DEVICE AND METHOD FOR INJECTION MOLDING 审中-公开
公开(公告)号：US20230150180A1
公开(公告)日：2023-05-18
申请号：US17910660
申请日：2020-04-01
申请人： EV Group E. Thallner GmbH
发明人： Gerald MITTENDORFER , Markus WIMPLINGER , Friedrich Paul LINDNER
IPC分类号： B29C45/76 , B29C45/14 , B29C45/26
CPC分类号： B29C45/768 , B29C45/14 , B29C45/26 , B29C2945/76163 , B29C2945/76294 , B29C2945/76357 , B29C2945/76568 , B29C2945/76772 , B29C2945/76836
摘要： A method and device for injection moulding, in particular for micro-injection moulding, at least comprising a mould with a first mould half and a second mould half, wherein the first mould half and the second mould half define an injection moulding space in the closed state of the mould, and an insert arranged in the injection moulding space.

7. 发明申请

US20210240075A1 STAMP AND METHOD FOR EMBOSSING 有权
公开(公告)号：US20210240075A1
公开(公告)日：2021-08-05
申请号：US17051312
申请日：2018-05-04
申请人： EV Group E. Thallner GmbH
发明人： Markus WIMPLINGER , Gerald MITTENDORFER
IPC分类号： G03F7/00 , G03F7/20 , B29C59/02
摘要： A stamp comprised of a soft stamp and a carrier fixed to the soft stamp.

8. 发明申请

US20170162538A1 METHOD FOR APPLYING A BONDING LAYER 审中-公开
公开(公告)号：US20170162538A1
公开(公告)日：2017-06-08
申请号：US15441741
申请日：2017-02-24
申请人： EV GROUP E. THALLNER GMBH
发明人： Markus WIMPLINGER
IPC分类号： H01L23/00 , B81C3/00
CPC分类号： H01L24/83 , B81C3/001 , B81C2203/036 , H01L24/29 , H01L24/32 , H01L2224/29082 , H01L2224/291 , H01L2224/29105 , H01L2224/29111 , H01L2224/29116 , H01L2224/29117 , H01L2224/29118 , H01L2224/29123 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29184 , H01L2224/32145 , H01L2224/32507 , H01L2224/8302 , H01L2224/83022 , H01L2224/8381 , H01L2224/83894 , H01L2924/01003 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01034 , H01L2924/01037 , H01L2924/01038 , H01L2924/0105 , H01L2924/01052 , H01L2924/01055 , H01L2924/01056 , H01L2924/01322 , H01L2924/10251 , H01L2924/10252 , H01L2924/10253 , H01L2924/1026 , H01L2924/10271 , H01L2924/10272 , H01L2924/10323 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/10336 , H01L2924/10346 , H01L2924/1037 , H01L2924/10371 , H01L2924/10372 , H01L2924/10373 , H01L2924/10375 , H01L2924/10376 , H01L2924/10377 , H01L2924/10821 , H01L2924/10823 , H01L2924/10831 , H01L2924/00 , H01L2924/00014 , H01L2924/01032 , H01L2924/01013 , H01L2924/01031 , H01L2924/0103
摘要： A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

9. 发明申请

US20150228521A1 ACCOMMODATING DEVICE FOR RETAINING WAFERS 审中-公开
标题翻译：保留波形的保存设备
公开(公告)号：US20150228521A1
公开(公告)日：2015-08-13
申请号：US14693074
申请日：2015-04-22
申请人： EV GROUP E. THALLNER GMBH
发明人： Markus WIMPLINGER , Thomas WAGENLEITNER , Alexander FILBERT
IPC分类号： H01L21/68 , H01L21/67
CPC分类号： H01L21/68 , H01L21/67092 , H01L21/67288 , H01L21/683 , H01L22/12
摘要： A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
摘要翻译：一种用于接收和安装由安装表面组成的晶片的接收装置，用于将晶片安装在安装表面上的安装装置和用于主动地，局部可控地补偿晶片局部和/或全局失真的补偿装置。

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