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1. 发明专利

DE60137007D1 未知
公开(公告)号：DE60137007D1
公开(公告)日：2009-01-29
申请号：DE60137007
申请日：2001-10-11
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , NOJI IKUTARO , NAMIKI KEISUKE , YASUDA HOZUMI , KOJIMA SHUNICHIRO , SAKURAI KUNIHIKO , TAKADA NOBUYUKI , NABEYA OSAMU , FUKUSHIMA MAKOTO , TAKAYANAGI HIDEKI
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B41/06 , H01L21/304
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body (2) for holding a substrate, an elastic pad brought into contact with the substrate, and a support member (6) for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member (8,9) has an elastic membrane brought into contact with the elastic pad. A first pressure chamber (24,25) is defined in the contact member, and a second pressure (22,23) chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source (120) for independently supplying a fluid into or creating a vacuum in the first pressure chamber (24,25) and the second pressure chamber (22,23).

2. 发明专利

DE69712658T2 未知
公开(公告)号：DE69712658T2
公开(公告)日：2003-01-30
申请号：DE69712658
申请日：1997-02-28
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , YAMAGUCHI KUNIAKI , KOJIMA SHUNICHIRO , NISHI TOYOMI
IPC分类号： B08B3/02 , B24B37/34 , B24B41/00 , H01L21/00 , B24B37/04
摘要： A polishing apparatus (70) is used for polishing a workpiece such as a semiconductor wafer (100) to a flat mirror finish. The polishing apparatus (70) comprises a turntable (73) having a polishing surface thereon, and a top ring (75) for holding a workpiece (100) to be polished and pressing the workpiece (100) against the polishing surface on the turntable (73). A pusher (10) is disposed in a position for transferring the workpiece (100) to and from the top ring (75), and has a workpiece support (11) which can be lifted to a position close to the top ring (75) for transferring the workpiece (100) to and from the top ring (75). When the workpiece support (11) receives a polished workpiece (100) and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units (31,32,33) that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece (100) and the lower surface of the top ring (75).

3. 发明专利

DE60024559D1 未知
公开(公告)号：DE60024559D1
公开(公告)日：2006-01-12
申请号：DE60024559
申请日：2000-08-30
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , YASUDA HOZUMI , SONE TADAKAZU , KOJIMA SHUNICHIRO , TSUJIMURA MANABU
IPC分类号： H01L21/304 , B24B37/30 , B24B37/32
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface (21), a top ring for holding a workpiece and pressing the workpiece against the polishing surface (21), a holding surface (3) of the top ring (2) for holding the workpiece, and a retainer ring (7) for retaining the workpiece within the holding surface of the top ring (2). The holding surface (3) is deformable by fluid having variable pressure, and the retainer ring (7) presses the polishing surface (21) under a variable pressing force.

4. 发明公开

EP0992322A4 POLISHING DEVICE 审中-公开
标题翻译： SCHLEIFVORRICHTUNG
公开(公告)号：EP0992322A4
公开(公告)日：2006-09-27
申请号：EP99912102
申请日：1999-04-05
申请人： EBARA CORP
发明人： KIMURA NORIO , MARUYAMA TORU , KOJIMA SHUNICHIRO , KATSUOKA SEIJI , OHWADA SHIN
IPC分类号： B24B37/00 , B24B37/005 , B24B37/32 , B24B49/16 , B24B55/02 , H01L21/304
CPC分类号： B24B37/32 , B24B49/16
摘要： A polishing device for polishing an object to be polished such as a semiconductor wafer to a flat and mirror finish, comprising a turn table on the upper surface of which an abrasive cloth is pasted and a top ring (1), wherein a semiconductor wafer interposed between the turn table and the top ring (1) is pressed with a specified strength and is polished to a flat and mirror finish, the polishing device further comprising a vertically movable pressing ring (3) disposed around the top ring (1) having a recess to receive a semiconductor wafer and a pressing means (22) for pressing the pressing ring (3) to the abrasive cloth with a variable force, the pressing ring (3) being supported on the top ring (1) via a bearing (37).
摘要翻译： 1。一种研磨装置，其将半导体晶片等被研磨物研磨成平坦且镜面精加工，其特征在于，在上表面粘贴有研磨布的转台和顶环（1）中，在转台和顶环（1）之间以规定的强度压制并且抛光成平坦且镜面抛光，所述抛光装置还包括围绕顶环（1）设置的可垂直移动的压环（3），所述压环用于容纳半导体晶片的凹槽以及用于以可变力将压环（3）压到砂布上的压紧装置（22），压环（3）通过轴承（37）支撑在顶环（1）上，）。

5. 发明公开

EP1404487A4 SUBSTRATE POLISHING MACHINE 审中-公开
标题翻译：机进行抛光SUBSTRATES
公开(公告)号：EP1404487A4
公开(公告)日：2008-07-09
申请号：EP02745895
申请日：2002-07-10
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , NOJI IKUTARO , NAMIKI KEISUKE , YASUDA HOZUMI , KOJIMA SHUNICHIRO , SAKURAI KUNIHIKO , TAKADA NOBUYUKI , NABEYA OSAMU , FUKUSHIMA MAKOTO , TAKAYANAGI HIDEKI
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B37/04
CPC分类号： B24B37/30 , B24B37/32
摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.

6. 发明专利

DE60024559T2 未知
公开(公告)号：DE60024559T2
公开(公告)日：2006-08-24
申请号：DE60024559
申请日：2000-08-30
申请人： EBARA CORP
发明人： KATSUOKA SEIJI , YASUDA HOZUMI , SONE TADAKAZU , KOJIMA SHUNICHIRO , TSUJIMURA MANABU
IPC分类号： H01L21/304 , B24B37/30 , B24B37/32
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface (21), a top ring for holding a workpiece and pressing the workpiece against the polishing surface (21), a holding surface (3) of the top ring (2) for holding the workpiece, and a retainer ring (7) for retaining the workpiece within the holding surface of the top ring (2). The holding surface (3) is deformable by fluid having variable pressure, and the retainer ring (7) presses the polishing surface (21) under a variable pressing force.

7. 发明专利

DE69712658D1 未知
公开(公告)号：DE69712658D1
公开(公告)日：2002-06-27
申请号：DE69712658
申请日：1997-02-28
申请人： EBARA CORP
发明人： TOGAWA TETSUJI , YAMAGUCHI KUNIAKI , KOJIMA SHUNICHIRO , NISHI TOYOMI
IPC分类号： B08B3/02 , B24B37/34 , B24B41/00 , H01L21/00 , B24B37/04
摘要： A polishing apparatus (70) is used for polishing a workpiece such as a semiconductor wafer (100) to a flat mirror finish. The polishing apparatus (70) comprises a turntable (73) having a polishing surface thereon, and a top ring (75) for holding a workpiece (100) to be polished and pressing the workpiece (100) against the polishing surface on the turntable (73). A pusher (10) is disposed in a position for transferring the workpiece (100) to and from the top ring (75), and has a workpiece support (11) which can be lifted to a position close to the top ring (75) for transferring the workpiece (100) to and from the top ring (75). When the workpiece support (11) receives a polished workpiece (100) and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units (31,32,33) that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece (100) and the lower surface of the top ring (75).

8. 发明专利

JP2010045408A Polishing method and equipment 审中-公开
标题翻译：抛光方法和设备
公开(公告)号：JP2010045408A
公开(公告)日：2010-02-25
申请号：JP2009266388
申请日：2009-11-24
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TOGAWA TETSUJI , NOMICHI IKUTARO , NAMIKI KEISUKE , YASUDA HOZUMI , KOJIMA SHUNICHIRO , SAKURAI KUNIHIKO , TAKADA NOBUYUKI , NABEYA OSAMU , FUKUSHIMA MAKOTO , TAKAYANAGI HIDEKI
IPC分类号： H01L21/304 , B24B37/04 , B24B37/30 , B24B37/32
摘要： PROBLEM TO BE SOLVED: To provide a polishing method capable of performing polishing corresponding to a film thickness distribution of a thin film on a front surface of a polishing object matter, and further capable of securing the uniformity of the thin film after polishing. SOLUTION: While covering a bottom face of a substrate holding apparatus with an elastic pad 4 for offering a plane to contact with and set up a substrate W, at least four pressure chambers are concentrically formed inside the elastic pad 4. At least the four pressure chambers include: a first pressure chamber in a position corresponding to the circular center of the substrate W; a second pressure chamber in a position corresponding to a circular ring outside the circular center of the substrate W; a third pressure chamber in a position corresponding to the circular ring outside the circular ring of the substrate W; and a fourth pressure chamber in a position corresponding to a peripheral portion of the substrate W. While holding the substrate W by means of the substrate holding apparatus, a retainer ring 3 is pressed against a polishing pad 101, and the substrate W is pressed against the polishing pad by independently supplying a pressurization fluid of controlled pressure to the first to fourth pressure chambers, and consequently the substrate W is polished. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够进行与研磨对象物的表面上的薄膜的膜厚分布对应的研磨的研磨方法，并且还能够确保研磨后的薄膜的均匀性。解决方案：使用弹性垫4覆盖基板保持装置的底面，以提供与衬底W接触和设置的平面，至少四个压力室同心地形成在弹性垫4的内部。至少四个压力室包括：与衬底W的圆形中心对应的位置的第一压力室; 第二压力室，位于与衬底W的圆心部外的圆环对应的位置; 位于与衬底W的圆环外的圆形环对应的位置的第三压力室; 以及与基板W的周边部分相对应的位置的第四压力室。在通过基板保持装置保持基板W的同时，将保持环3压在抛光垫101上，并且将基板W压靠抛光垫通过独立地向第一至第四压力室供应受控压力的加压流体，从而抛光衬底W. 版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010105842A Desulfurization system and fuel cell system 有权
标题翻译：脱硫系统和燃料电池系统
公开(公告)号：JP2010105842A
公开(公告)日：2010-05-13
申请号：JP2008278380
申请日：2008-10-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAWANISHI TAKU , KOSUGI NORIYUKI , OHATA SHIGEO , KOJIMA SHUNICHIRO , WATANABE MANABU , KAMEZAWA MASAYUKI
IPC分类号： C01B3/38 , H01M8/06
CPC分类号： Y02E60/50
摘要： PROBLEM TO BE SOLVED: To provide a desulfurization system and a fuel cell system decreasing influences of power consumption during desulfurization on an external power load.
SOLUTION: The desulfurization system 10 includes: a desulfurizer 11 having a heater 13 that receives electric power from a commercial power supply 99 to generate heat, heating kerosene k introduced therein by the heater 13 and desulfurizing to produce desulfurized kerosene k1; a desulfurized kerosene tank 15 reserving the desulfurized kerosene k1; and a controller 81 controlling the desulfurizer 11 to carry out desulfurization in a predetermined time zone when the power load of the commercial power supply 99 is small (for example, a time zone when a midnight charge is applied). The fuel cell system 1 includes the desulfurization system 10, a reformer 20 reforming the desulfurized kerosene k1 to generate a reformed gas g containing hydrogen as a principal component, and a fuel cell 30 receiving the reformed gas g and an oxidizing agent gas t to generate power.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供脱硫系统和燃料电池系统，减少脱硫期间的功率消耗对外部电力负载的影响。解决方案：脱硫系统10包括：脱硫器11，其具有从商用电源99接收电力以产生热量的加热器13，通过加热器13引入其中的加热煤油k和脱硫以产生脱硫煤油k1; 一个储存脱硫煤油k1的脱硫煤油罐15; 以及控制器81，当商用电源99的电力负荷小（例如，施加午夜充电的时间段）时，控制脱硫器11在预定时间段内进行脱硫。燃料电池系统1包括脱硫系统10，对脱硫煤油k1进行重整以生成以氢为主要成分的重整气体g的重整器20以及接收重整气体g和氧化剂气体t的燃料电池30，功率。版权所有（C）2010，JPO＆INPIT

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