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    • 4. 发明授权
    • Transferring and resizing of epitaxial film arrays and method thereof
    • 外延膜阵列的转移和调整大小及其方法
    • US08546237B2
    • 2013-10-01
    • US12872609
    • 2010-08-31
    • Majid Riaziat
    • Majid Riaziat
    • H01L21/76
    • H01L21/7806H01L21/2007
    • A method of transferring an epitaxial film from an original substrate to a destination substrate comprises: growing an epitaxial film grown with a sacrificial layer on the original substrate; patterning the epitaxial film into a plurality of sections; attaching the plurality of sections to a stretchable film; removing the plurality of sections attached to the stretchable film from the original substrate; stretching the sections apart as needed; and attaching a permanent substrate to the plurality of sections; and trimming the sizes of the sections as needed for precise positioning prior to integrated circuit device fabrication.
    • 将外延膜从原始衬底转移到目标衬底的方法包括:在原始衬底上生长用牺牲层生长的外延膜; 将外延膜图案化成多个部分; 将所述多个部分附接到可拉伸膜; 从原始基板去除附接到可拉伸膜的多个部分; 根据需要拉伸部分; 以及将永久基板附接到所述多个部分; 并且在集成电路器件制造之前根据需要修整各部分的尺寸以进行精确定位。
    • 7. 发明申请
    • TRANSFERRING AND RESIZING OF EPITAXIAL FILM ARRAYS AND METHOD THEREOF
    • 外延薄膜阵列的转移和定位及其方法
    • US20120052663A1
    • 2012-03-01
    • US12872609
    • 2010-08-31
    • Majid Riaziat
    • Majid Riaziat
    • H01L21/20
    • H01L21/7806H01L21/2007
    • A method of transferring an epitaxial film from an original substrate to a destination substrate comprises: growing an epitaxial film grown with a sacrificial layer on the original substrate; patterning the epitaxial film into a plurality of sections; attaching the plurality of sections to a stretchable film; removing the plurality of sections attached to the stretchable film from the original substrate; stretching the sections apart as needed; and attaching a permanent substrate to the plurality of sections; and trimming the sizes of the sections as needed for precise positioning prior to integrated circuit device fabrication.
    • 将外延膜从原始衬底转移到目标衬底的方法包括:在原始衬底上生长用牺牲层生长的外延膜; 将外延膜图案化成多个部分; 将所述多个部分附接到可拉伸膜; 从原始基板去除附接到可拉伸膜的多个部分; 根据需要拉伸部分; 以及将永久基板附接到所述多个部分; 并且在集成电路器件制造之前根据需要修整各部分的尺寸以进行精确定位。