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1. 发明公开

EP1824960A2 SUBSTRATE PROCESSING APPARATUS USING A BATCH PROCESSING CHAMBER 审中-公开
标题翻译：与批处理腔片处理设备
公开(公告)号：EP1824960A2
公开(公告)日：2007-08-29
申请号：EP05825425.1
申请日：2005-11-22
申请人： Applied Materials, Inc.
发明人： THAKUR, Randhir, P.s. , GHANAYEM, Steve, G. , YUDOVSKY, Joseph , WEBB, Aaron , BRAILOVE, Adam, A. , MERRY, Nir , SHAH, Vinay, K. , HEGEDUS, Andreas, G.
IPC分类号： C12M3/00
CPC分类号： H01L21/67109 , C23C16/4412 , C23C16/45546 , C23C16/45593 , C23C16/4584 , C23C16/481 , C23C16/54 , H01L21/67017 , H01L21/67115 , H01L21/67167 , H01L21/6719 , H01L21/67207 , H01L21/67745 , H01L21/67757 , H01L21/67781
摘要： Aspects of the invention include a method and apparatus for processing a substrate using a multi-chamber processing system (e.g., a cluster tool) adapted to process substrates in one or more batch and/or single substrate processing chambers to increase the system throughput. In one embodiment, a system is configured to perform a substrate processing sequence that contains batch processing chambers only, or batch and single substrate processing chambers, to optimize throughput and minimize processing defects due to exposure to a contaminating environment. In one embodiment, a batch processing chamber is used to increase the system throughput by performing a process recipe step that is disproportionately long compared to other process recipe steps in the substrate processing sequence that are performed on the cluster tool. In another embodiment, two or more batch chambers are used to process multiple substrates using one or more of the disproportionately long processing steps in a processing sequence. Aspects of the invention also include an apparatus and method for delivering a precursor to a processing chamber so that a repeatable ALD or CVD deposition process can be performed.

2. 发明公开

EP2044618A2 BATCH PROCESSING PLATFORM FOR ALD AND CVD 审中-公开
标题翻译：批量处理平台，为ALD和CVD
公开(公告)号：EP2044618A2
公开(公告)日：2009-04-08
申请号：EP07812166.2
申请日：2007-06-15
申请人： Applied Materials, Inc.
发明人： WEBB, Aaron , BRAILOVE, Adam , YUDOVSKY, Joseph , MERRY, Nir , CONSTANT, Andrew , QUILES, Efrain , RICE, Michael, R. , ROSEN, Gary, J. , SHAH, Vinay
IPC分类号： H01L21/20 , C23C16/00
CPC分类号： C23C16/54 , C23C16/4583 , H01L21/67173 , H01L21/67742 , H01L21/67757 , H01L21/67769 , Y10S414/14
摘要： A batch processing platform used for ALD or CVD processing is configured for high throughput and minimal footprint. In one embodiment, the processing platform comprises an atmospheric transfer region, at least one batch processing chamber with a buffer chamber and staging platform, and a transfer robot disposed in the transfer region wherein the transfer robot has at least one substrate transfer arm that comprises multiple substrate handling blades. The platform may include two batch processing chambers configured with a service aisle disposed therebetween to provide necessary service access to the transfer robot and the deposition stations. In another embodiment, the processing platform comprises at least one batch processing chamber, a substrate transfer robot that is adapted to transfer substrates between a FOUP and a processing cassette, and a cassette transfer region containing a cassette handler robot. The cassette handler robot may be a linear actuator or a rotary table.

3. 发明公开

EP4268272A1 SEMICONDUCTOR PROCESSING TOOL PLATFORM CONFIGURATION WITH REDUCED FOOTPRINT 审中-实审
公开(公告)号：EP4268272A1
公开(公告)日：2023-11-01
申请号：EP21911923.7
申请日：2021-12-16
申请人： Applied Materials, Inc.
发明人： MERRY, Nir , CHU, Schubert S. , KOSHTI, Sushant S. , KUCHAR, Michael C. , MYO, Nyi Oo , LEE, Songjae
IPC分类号： H01L21/67 , H01L21/677

4. 发明申请

WO2020086490A1 SIDE STORAGE PODS, EQUIPMENT FRONT END MODULES, AND METHODS FOR OPERATING THE SAME 审中-公开
公开(公告)号：WO2020086490A1
公开(公告)日：2020-04-30
申请号：PCT/US2019/057286
申请日：2019-10-21
申请人： APPLIED MATERIALS, INC.
发明人： REUTER, Paul B. , HRUZEK, Dean C. , MERRY, Nir , MENK, John C. , BAUMGARTEN, Douglas B.
IPC分类号： H01L21/673 , H01L21/677 , H01L21/67
摘要： Electronic device processing assemblies including an equipment front end module (EFEM) with at least one side storage pod attached thereto are described. The side storage pod has a side storage container. In some embodiments, an exhaust conduit extends between the chamber and a pod plenum that can contain a chemical filter proximate thereto. A supplemental fan may draw purge gas from the pod plenum through the chemical filter and route the gas through a return duct to an upper plenum of the EFEM. Methods and side storage pods in accordance with these and other embodiments are also disclosed.

5. 发明申请

WO2020086485A1 SIDE STORAGE PODS, EQUIPMENT FRONT END MODULES, AND METHODS FOR OPERATING EQUIPMENT FRONT END MODULES 审中-公开
公开(公告)号：WO2020086485A1
公开(公告)日：2020-04-30
申请号：PCT/US2019/057276
申请日：2019-10-21
申请人： APPLIED MATERIALS, INC.
发明人： PANNESE, Patrick , NARASIMHAN, Murali , REUTER, Paul B. , MERRY, Nir
IPC分类号： H01L21/673 , H01L21/67
摘要： Electronic device processing assemblies including an EFEM with at least one side storage pod attached thereto. The side storage pod has a side storage pod container. A supply conduit extends between an upper plenum of the EFEM to the side storage pod container. A fan causes purge gas to simultaneously flow into the EFEM chamber and into the side storage pod container. The fan also causes recirculation of the purge gas from the EFEM chamber. Methods of operating EFEMs and EFEMs are also disclosed.

6. 发明申请

WO2015038610A1 HEATED SUBSTRATE SUPPORT WITH TEMPERATURE PROFILE CONTROL 审中-公开
标题翻译：加热基板支持与温度配置文件控制
公开(公告)号：WO2015038610A1
公开(公告)日：2015-03-19
申请号：PCT/US2014/054945
申请日：2014-09-10
申请人： APPLIED MATERIALS, INC.
发明人： MERRY, Nir , VOLFOVSKI, Leon
IPC分类号： H01L21/683 , H01L21/324
CPC分类号： H01L23/34 , H01L21/67103 , H01L21/67248 , H01L21/683 , H01L21/68792 , H01L2924/0002 , H05B3/283 , Y10T29/49083 , H01L2924/00
摘要： Methods and apparatus of substrate supports having temperature profile control are provided herein. In some embodiments, a substrate support includes: a plate having a substrate receiving surface and an opposite bottom surface; and a shaft having a first end comprising a shaft heater and a second end, wherein the first end is coupled to the bottom surface. Methods of making a substrate support having temperature profile control are also provided.
摘要翻译：本文提供了具有温度分布控制的基板支撑件的方法和装置。在一些实施例中，衬底支撑件包括：板，其具有衬底接收表面和相对的底表面; 以及轴，其具有包括轴加热器和第二端的第一端，其中所述第一端联接到所述底表面。还提供了制造具有温度分布控制的基板支撑件的方法。

7. 发明申请

WO2014163791A1 SEMICONDUCTOR DEVICE MANUFACTURING PLATFORM WITH SINGLE AND TWINNED PROCESSING CHAMBERS 审中-公开
标题翻译：半导体器件制造平台与单和双工艺加热器
公开(公告)号：WO2014163791A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/016476
申请日：2014-02-14
申请人： APPLIED MATERIALS, INC
发明人： MERRY, Nir , RICE, Michael, Robert , KOSHTI, Sushant, S. , HUDGENS, Jeffrey, C.
IPC分类号： H01L21/02
CPC分类号： H01L21/6719 , H01L21/67196
摘要： A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.
摘要翻译：用于半导体器件制造的传送室包括（1）限定被配置为保持真空度并允许在处理室之间传送衬底的区域的多个侧面，所述多个侧面限定传送室的第一部分和第二部分并且包括（a）耦合到两个孪生处理室的第一面; 和（b）耦合到单个处理室的第二侧; （2）位于传送室的第一部分中的第一衬底处理器; （3）位于所述传送室的第二部分中的第二衬底处理器; 和（4）切换位置，其配置为允许基板使用第一和第二基板处理器在传送室的第一部分和第二部分之间通过。还提供了方法方面。

8. 发明申请

WO2022061025A1 MICRO-ELECTROMECHANICAL DEVICE FOR USE IN A FLOW CONTROL APPARATUS 审中-公开
公开(公告)号：WO2022061025A1
公开(公告)日：2022-03-24
申请号：PCT/US2021/050730
申请日：2021-09-16
申请人： APPLIED MATERIALS, INC.
发明人： MERRY, Nir , XU, Ming
IPC分类号： G01F1/58 , G01F1/78 , G01F15/00 , G01F15/18 , G05D7/06 , C23C28/00 , C23C16/455
摘要： Disclosed herein are embodiments of a sensor device, systems incorporating the same, and methods of fabricating the same. In one embodiment, a sensor device comprises a free-standing sensing element, such as a micro-electromechanical system (MEMS) device. The sensor device further comprises a metallic band to facilitate mounting the MEMS device to a mounting plate. The sensor device further comprises a conformal coating on a least a portion of a sensor region of the sensor device.

9. 发明申请

WO2022061023A1 MASS FLOW CONTROL BASED ON MICRO-ELECTROMECHANICAL DEVICES 审中-公开
公开(公告)号：WO2022061023A1
公开(公告)日：2022-03-24
申请号：PCT/US2021/050728
申请日：2021-09-16
申请人： APPLIED MATERIALS, INC.
发明人： MERRY, Nir , WIRTH, Paul , XU, Ming , KOSHTI, Sushant , TAN, Raechel Chu-Hui
IPC分类号： G01F1/84 , G01F15/00 , G05D7/06
摘要： Disclosed herein are embodiments of a mass flow control apparatus, systems incorporating the same, and methods using the same. In one embodiment, a mass flow control apparatus comprises a flow modulating valve configured to modulate gas flow in a gas flow channel, a sensor device, such as a micro-electromechanical (MEMS) device, configured to generate a signal responsive to a condition of the gas flow, and a processing device operatively coupled to the flow modulating valve and the sensor device to control the flow modulating valve based on a signal received from the sensor device.

10. 发明申请

WO2010120805A3 MODIFICATION OF MAGNETIC PROPERTIES OF FILMS USING ION AND NEUTRAL BEAM IMPLANTATION 审中-公开
公开(公告)号：WO2010120805A3
公开(公告)日：2010-10-21
申请号：PCT/US2010/030924
申请日：2010-04-13
申请人： APPLIED MATERIALS, INC. , FOAD, Majeed, A. , MERRY, Nir
发明人： MERRY, Nir
IPC分类号： G11B5/84 , G11B5/82 , G11B5/73
摘要： Methods and apparatus for forming substrates having magnetically patterned surfaces is provided. A magnetic layer comprising one or more materials having magnetic properties is formed on the substrate. The magnetic layer is subjected to a patterning process in which selected portions of the surface of the magnetic layer are altered such that the altered portions have different magnetic properties from the non-altered portions without changing the topography of the substrate. A protective layer and a lubricant layer are deposited over the patterned magnetic layer. The patterning is accomplished through a number of alternative processes that expose substrates to energy of varying forms.

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