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    • 1. 发明申请
    • Nonvolatile semiconductor memory device and method for fabricating the same
    • 非易失性半导体存储器件及其制造方法
    • US20060039175A1
    • 2006-02-23
    • US11195652
    • 2005-08-03
    • Yoshinori Odake
    • Yoshinori Odake
    • G11C11/22
    • H01L27/115H01L27/11519H01L27/11526H01L27/11536
    • A first conductive film for forming a plurality of word lines is formed in a memory cell array formation region of a semiconductor substrate for a nonvolatile semiconductor memory device, and a second conductive film is formed in a semiconductor device formation region of the semiconductor substrate. Next, openings are formed in the first conductive film by a first dry etching process such that the word lines in the memory cell array formation region are located apart from one another. Thereafter, sidewall insulating films for the word lines are formed in the openings. Next, parts of the sidewall insulating films located adjacent to the ends of the word lines are removed by wet etching. Next, a part of the first conductive film located around a word line formation region is removed by a second dry etching process. The openings are formed in the first conductive film such that a part of the first conductive film remaining after the formation of the openings is continuous with the second conductive film, which is formed on an active region of the semiconductor substrate located outside the memory cell array formation region so as to be electrically connected to the active region.
    • 用于形成多个字线的第一导电膜形成在用于非易失性半导体存储器件的半导体衬底的存储单元阵列形成区域中,并且在半导体衬底的半导体器件形成区域中形成第二导电膜。 接下来,通过第一干蚀刻工艺在第一导电膜中形成开口,使得存储单元阵列形成区域中的字线彼此分开。 此后,在开口中形成用于字线的侧壁绝缘膜。 接下来,通过湿法蚀刻去除位于与字线的端部相邻的侧壁绝缘膜的部分。 接下来,通过第二干蚀刻工艺去除位于字线形成区域周围的第一导电膜的一部分。 开口形成在第一导电膜中,使得在形成开口后残留的第一导电膜的一部分与形成在位于存储单元阵列外部的半导体衬底的有源区上的第二导电膜连续 形成区域以电连接到有源区域。
    • 8. 发明授权
    • Semiconductor device and method for producing the same
    • 半导体装置及其制造方法
    • US6165825A
    • 2000-12-26
    • US47353
    • 1998-03-25
    • Yoshinori Odake
    • Yoshinori Odake
    • H01L29/78H01L21/762H01L21/8238H01L27/08H01L27/092
    • H01L21/76216H01L21/823878
    • LOCOS layers for defining NMOSFET and PMOSFET forming regions Rn and Rp are formed, and then a protective oxide layer is formed. A first resist layer, opened above the region Rn, is then formed on the protective oxide layer. By using the first resist layer as a mask, ion implantation is performed twice to form a threshold control layer and a P- layer functioning as a punch-through stopper or the like. By using the first resist layer as a mask, the substrate is etched to remove a portion of the protective oxide layer. Then, the first resist layer is removed. These processes are also performed on the region Rp. Then, a gate oxide layer is formed. Thus, it is possible to prevent a foreign impurity, introduced during the ion implantation, from diffusing the surrounding regions when the resist layers are removed. As a result, the properties of the gate oxide layer can be improved.
    • 形成用于定义NMOSFET和PMOSFET形成区域Rn和Rp的LOCOS层,然后形成保护性氧化物层。 然后在保护性氧化物层上形成在区域Rn上方开放的第一抗蚀剂层。 通过使用第一抗蚀剂层作为掩模,进行两次离子注入以形成阈值控制层和用作穿通塞子等的P-层。 通过使用第一抗蚀剂层作为掩模,蚀刻衬底以除去保护氧化物层的一部分。 然后,去除第一抗蚀剂层。 这些处理也在区域Rp上执行。 然后,形成栅氧化层。 因此,当去除抗蚀剂层时,可以防止在离子注入期间引入的异物杂质扩散周围区域。 结果,可以提高栅极氧化物层的性质。
    • 9. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US5500379A
    • 1996-03-19
    • US265104
    • 1994-06-24
    • Yoshinori OdakeTeruhito OhnishiMinoru Fujii
    • Yoshinori OdakeTeruhito OhnishiMinoru Fujii
    • H01L21/8238H01L21/265
    • H01L21/823807Y10S148/082
    • In a CMOS semiconductor device, low-dose ion implant of p-type impurity and n-type impurity is successively conducted to both n-MOSFET and p-MOSFET after formation of gate electrodes. Thereafter, when source/drain regions are formed at each MOSFET, p.sup.- regions function as local punch through stoppers in the n-MOSFET and n.sup.- regions function as the local punch through stoppers in the p-MOSFET. At this time, respective doses of n-type and p-type impurities are adjusted so that lowerings of threshold values of the channel regions are almost equal to each other. Thus, short channel effect is prevented, while reducing the step of forming two resist masks. With side walls, the CMOS semiconductor device with less short channel effect and high durability to hot carrier is manufactured without increase in the step of forming the resist masks.
    • 在CMOS半导体器件中,p型杂质和n型杂质的低剂量离子注入在形成栅电极之后依次传导到n-MOSFET和p-MOSFET两者。 此后,当在每个MOSFET处形成源极/漏极区域时,p-区域用作n-MOSFET中的阻挡器的局部冲击,并且n-区域用作p-MOSFET中的局部冲击穿过止动器。 此时,调整各种剂量的n型和p型杂质,使得沟道区的阈值的降低几乎相等。 因此,防止短沟道效应,同时减少形成两个抗蚀剂掩模的步骤。 利用侧壁,在不增加形成抗蚀剂掩模的步骤的情况下,制造具有较短沟道效应和对热载体的高耐久性的CMOS半导体器件。