专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130277225A1 Method to Produce Golden Bronze by Diffusion of Tin Into Copper Under Controlled Conditions 审中-公开
标题翻译：在受控条件下将锡扩散成铜的方法生产金青铜
公开(公告)号：US20130277225A1
公开(公告)日：2013-10-24
申请号：US13992924
申请日：2011-12-09
申请人： Toan Dinh Nguyen , Hieu Cong Truong
发明人： Toan Dinh Nguyen , Hieu Cong Truong
IPC分类号： C25D5/50 , C25D5/12
CPC分类号： C25D5/505 , C25D5/12 , C25D5/34
摘要： The present invention relates to the production of a bronze plated substrate having a golden appearance thanks to a multiple-layer plating method. The method notably comprises plating a substrate having at least one layer of copper with a tin layer which thickness represents 3.5% to 12% of the copper layer thickness. The method further comprises annealing the plated substrate in an annealing furnace comprising a plurality of heating zones, the last heating zone of the furnace having an annealing temperature ranging from 600° C. to 815° C. The annealing step of the method is performed under controlled operating parameters which comprise an annealing residence time, the annealing temperature and the relative thickness of the tin layer in view of the copper layer. The operating parameters are controlled in accordance to each other to ensure obtaining the gold-like appearance of the plated bronze.
摘要翻译：本发明涉及通过多层电镀法制造具有金色外观的青铜镀层基板。该方法特别包括将具有至少一层铜的衬底与厚度为铜层厚度的3.5％至12％的锡层电镀。该方法还包括在包括多个加热区的退火炉中对镀覆的基板进行退火，该炉的最后一个加热区的退火温度范围为600℃至815℃。该方法的退火步骤在考虑到铜层，包括退火停留时间，退火温度和锡层的相对厚度的受控操作参数。操作参数根据彼此控制，以确保获得镀金青铜的金色外观。

2. 发明申请

US20140120372A1 Plating Process to Increase Coin Blank Surface Hardness 审中-公开
标题翻译：电镀工艺增加硬币空白表面硬度
公开(公告)号：US20140120372A1
公开(公告)日：2014-05-01
申请号：US14126362
申请日：2012-06-12
申请人： Hieu Cong Truong , Toan Dinh Nguyen , Dennis Herman Weber
发明人： Hieu Cong Truong , Toan Dinh Nguyen , Dennis Herman Weber
IPC分类号： B32B15/01 , C22F1/08 , C21D9/00
CPC分类号： B32B15/015 , C21D9/0068 , C22F1/08 , C23C18/1696 , C23C18/1698 , C23C18/1817 , C25D5/36 , C25D5/50 , C25D7/005 , Y10T428/12937
摘要： A method is for plating metal or alloy blanks. The method includes heating the metal or alloy blanks at a recrystallization temperature sufficient to soften the steel for minting; plating the softened metal or alloy blanks with one or more layers of metal or alloy; and heating the plated blanks at a temperature sufficient to reduce plating stresses but below the recrystallization temperature of the outermost plating layer.
摘要翻译：一种用于电镀金属或合金坯料的方法。该方法包括在足以使钢软化的再结晶温度下加热金属或合金坯料以进行铸造; 用一层或多层金属或合金电镀软化的金属或合金坯料; 并在足以降低电镀应力但低于最外镀层的再结晶温度的温度下加热电镀坯料。

3. 发明授权

US6025616A Power distribution system for semiconductor die 失效
标题翻译：半导体芯片配电系统
公开(公告)号：US6025616A
公开(公告)日：2000-02-15
申请号：US882714
申请日：1997-06-25
申请人： Toan Dinh Nguyen , Michael T. Johnson
发明人： Toan Dinh Nguyen , Michael T. Johnson
IPC分类号： G11C5/14 , H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113
CPC分类号： G11C5/14 , H01L2224/4813 , H01L2924/01077 , H01L2924/14 , H01L2924/30107 , Y10S257/903
摘要： A power distribution system for a semiconductor die includes bonding pads located adjacent to and connected to power busses with connections between the bonding pads providing a parallel path for current. Connections may be provided by stitch bonds, by conductors within a substrate or by other means.
摘要翻译：用于半导体管芯的配电系统包括邻近并连接到电力总线的接合焊盘，其中接合焊盘之间的连接提供用于电流的并行路径。连接可以通过缝合连接，通过衬底内的导体或其他方式来提供。

4. 发明授权

US5998867A Radiation enhanced chip encapsulant 失效
标题翻译：辐射增强芯片封装
公开(公告)号：US5998867A
公开(公告)日：1999-12-07
申请号：US606125
申请日：1996-02-23
申请人： Ronald J. Jensen , Richard K. Spielberger , Toan Dinh Nguyen , William F. Jacobsen
发明人： Ronald J. Jensen , Richard K. Spielberger , Toan Dinh Nguyen , William F. Jacobsen
IPC分类号： H01L23/31 , H01L23/552 , H01L23/06 , H01B7/18 , H05K9/00
CPC分类号： H01L23/3135 , H01L23/552 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/3025
摘要： A shielding apparatus for an electronic component includes a first insulative encapsulant surrounding at least a portion of the component and a second encapsulant surrounding said first encapsulant and having conductive particles dispersed therein for absorbing ionizing radiation.
摘要翻译：一种用于电子部件的屏蔽装置包括围绕所述部件的至少一部分的第一绝缘密封剂和围绕所述第一密封剂的第二密封剂，并且其中分散有导电颗粒以吸收电离辐射。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式