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    • 1. 发明授权
    • Electrical connecting device, and semiconductor device testing method
    • 电气连接装置
    • US6033233A
    • 2000-03-07
    • US104332
    • 1998-06-25
    • Makoto HaseyamaMasaru Tateishi
    • Makoto HaseyamaMasaru Tateishi
    • G01R31/26G01R1/04G01R1/067H01B13/00H01L21/66H01R11/18H01R13/24H01R33/76H01R12/04
    • H01R13/2421G01R1/06716G01R1/06722H01R11/18G01R1/0466G01R1/0483H01L2924/00013
    • An electrical connecting device and related method of testing a semiconductor device which provides for testing of a semiconductor device under excellent and stable current transfer characteristics. Moreover, the electrical connecting device is easily produced under mass production conditions and can be made with a structure for testing of a semiconductor device where there are many pins arranged in a fine pitch on the semiconductor device. The electrical connector device includes a contactor which has a coil-shaped spring and a transformable conductive member extending in the compressing direction of the coil-shaped spring. When one end of the conductive member is in contact with a first electrode and the other end of the conductive members in contact with the second electrode, the contactor electrically connects between the first electrode and the second electrode via the conductive member and generates contact pressure against the electrodes when the coil-shaped spring is pressed. A guide plate is provided in the electrical connector device having a through hole for inserting and positioning the contactor therein. In a preferred embodiment, the semiconductor device to be tested has the first electrode for contact against one end of the conductive member of the contactor. The second electrode is a land pattern in a substrate of the electrical connecting device contacting the other end of the transformable conductive member, with the land pattern in turn being connected to testing equipment for testing of the semiconductor device.
    • 一种用于测试半导体器件的电连接器件和相关方法,该半导体器件提供在优异和稳定的电流传输特性下对半导体器件的测试。 此外,电连接装置在大规模生产条件下容易制造,并且可以用半导体器件的精细间距布置有许多引脚的半导体器件的测试结构来制造。 电连接器装置包括具有螺旋形弹簧的接触器和沿着线圈形弹簧的压缩方向延伸的可变形导电构件。 当导电构件的一端与第一电极接触并且导电构件的另一端与第二电极接触时,接触器经由导电构件电连接在第一电极和第二电极之间,并产生接触压力 当螺旋形弹簧被按压时的电极。 导电板设置在具有用于在其中插入和定位接触器的通孔的电连接器装置中。 在优选实施例中,待测试的半导体器件具有用于接触接触器的导电部件的一端的第一电极。 第二电极是与可变形导电构件的另一端接触的电连接装置的基板中的焊盘图案,其中焊盘图案又连接到用于半导体器件的测试的测试设备。
    • 4. 发明授权
    • S-shaped correction capacitor switching device for automatic tracking
monitor
    • 用于自动跟踪监视器的S形校正电容开关装置
    • US5155417A
    • 1992-10-13
    • US645606
    • 1991-01-25
    • Masaru Tateishi
    • Masaru Tateishi
    • H04N3/23G09G1/00G09G1/04G09G1/16H04N3/233H04N3/27
    • H04N3/2335
    • An S-shaped correction capacitor switching devices are applied to automatic tracking monitors. An automatic tracking monitor is a monitor display device which can cope with various horizontal frequencies to be capable of being connected to various types of personal computers. The control means judges the frequency of a horizontal synchronizing signal of a device being handled, and based on the result of the judgment it decides the combination of capacitors to be connected to a deflection coil. Furthermore, it adjusts the combination of capacitors corresponding to adjustment data, thereby the distortion on an image caused by the dispersion of capacitance values among individual capacitors can be prevented.
    • S型校正电容器开关器件应用于自动跟踪监视器。 自动跟踪监视器是可以处理各种水平频率以能够连接到各种类型的个人计算机的监视器显示装置。 控制装置判断正在处理的装置的水平同步信号的频率,并且基于判断结果决定要连接到偏转线圈的电容器的组合。 此外,它调整对应于调整数据的电容器的组合,从而可以防止由各个电容器之间的电容值的偏差引起的图像上的失真。
    • 6. 发明授权
    • Ship without transverse reinforcing members between the inner and outer
hull plating
    • 在船体内外层之间没有横向加固件
    • US4573422A
    • 1986-03-04
    • US628467
    • 1984-07-06
    • Seiichiro MurataMasaru TateishiKohji HayakawaTakeshi SakamotoShin TakeuchiKohsuke Mukasa
    • Seiichiro MurataMasaru TateishiKohji HayakawaTakeshi SakamotoShin TakeuchiKohsuke Mukasa
    • B63B3/62B63B3/20
    • B63B3/20
    • A transverseless ship has at least its side portions and bottom portion comprised of a double hull construction which comprises an inner hull plating and an outer hull plating connected together only by transverse bulkheads and a plurality of longitudinal connecting member fixed to the bulkheads. The bottom portion of the ship has a space defined by at least two optionally selected connecting longitudinal members and divided by two horizontal partitions into two upper chambers and a lower chamber. The upper chambers are adapted to pass different fluids therethrough, and the lower chamber is provided with docking brackets each conforming to the sectional shape thereof. With this structure, external forces acting on the ship are delivered from the connecting longitudinal members to the transverse bulkheads to prevent the inner and outer platings from buckling. The absence of reinforcing transverse members intersecting the connecting longitudinal members assures automatic welding operation with greatly improved efficiency. Since the space within the double hull is utilized to provide fluid channels, there is no need to provide additional fluid transport piping. The docking bracket provided under the fluid channel prevents the bottom portion from deforming when the ship is supported on blocks within a dock.
    • 至少其横向船体至少具有侧部,底部由双层船体构造构成,该双层船体结构包括内部船体电镀和外部船体电镀,外部船体电镀仅通过横向舱壁连接在一起,并且固定在舱壁上的多个纵向连接构件。 船的底部具有由至少两个可选择的连接纵向构件限定的空间,并由两个水平隔板分成两个上室和下室。 上部腔室适于使不同的流体通过其中,并且下部腔室设置有各自符合其截面形状的对接支架。 利用这种结构,作用在船上的外力从连接的纵向构件被输送到横向舱壁,以防止内部和外部电镀板屈曲。 没有与连接纵向构件相交的加强横向构件确保了自动焊接操作,并且效率大大提高。 由于双壳体内的空间用于提供流体通道,所以不需要提供附加的流体输送管道。 设置在流体通道下方的对接托架防止当船舶支撑在码头内的块上时底部部分变形。
    • 7. 发明授权
    • Semiconductor device testing method, using a spring-biased transformable conductive member electrode connection
    • 半导体器件测试方法,采用弹簧偏置的可变形导电部件电极连接
    • US06624645B2
    • 2003-09-23
    • US09480001
    • 2000-01-10
    • Makoto HaseyamaMasaru Tateishi
    • Makoto HaseyamaMasaru Tateishi
    • G01R3102
    • H01R13/2421G01R1/0466G01R1/0483G01R1/06716G01R1/06722H01L2924/00013H01R11/18H01L2224/29099
    • An electrical connecting device and related method of testing a semiconductor device which provides testing of a semiconductor device under excellent and stable current transfer characteristics. Moreover, the electrical connecting device is easily produced under mass production conditions and can be made with a structure for testing of a semiconductor device where there are many pins arranged in a fine pitch on the semiconductor device. The electrical connector device includes a contactor which has a coil-shaped spring and a transformable conductive member extending in the compressing direction of the coil-shaped spring. When one end of the conductive member is in contact with a first electrode and the other end of the conductive members in contact with the second electrode, the contactor electrically connects between the first electrode and the second electrode via the conductive member and generates contact pressure against the electrodes when the coil-shaped spring is pressed. A guide plate is provided in the electrical connector device having a through hole for inserting and positioning the contactor therein. In a preferred embodiment, the semiconductor device to be tested has the first electrode for contact against one end of the conductive member of the contactor. The second electrode is a land pattern in a substrate of the electrical connecting device contacting the other end of the transformable conductive member, with the land pattern in turn being connected to testing equipment for testing of the semiconductor device.
    • 一种测试半导体器件的电连接器件和相关方法,该半导体器件在优异和稳定的电流传输特性下提供对半导体器件的测试。 此外,电连接装置在大规模生产条件下容易制造,并且可以用半导体器件的精细间距布置有许多引脚的半导体器件的测试结构来制造。 电连接器装置包括具有螺旋形弹簧的接触器和沿着线圈形弹簧的压缩方向延伸的可变形导电构件。 当导电构件的一端与第一电极接触并且导电构件的另一端与第二电极接触时,接触器经由导电构件电连接在第一电极和第二电极之间,并产生接触压力 当螺旋形弹簧被按压时的电极。 导电板设置在具有用于在其中插入和定位接触器的通孔的电连接器装置中。 在优选实施例中,待测试的半导体器件具有用于接触接触器的导电部件的一端的第一电极。 第二电极是与可变形导电构件的另一端接触的电连接装置的基板中的焊盘图案,其中焊盘图案又连接到用于半导体器件的测试的测试设备。
    • 8. 发明授权
    • Ship without transverse reinforcing members between the inner and outer
hull plating
    • 在船体内外层之间没有横向加固件
    • US4674430A
    • 1987-06-23
    • US824524
    • 1986-01-31
    • Seiichiro MurataMasaru TateishiKohji HayakawaTakeshi SakamotoKohsuke Mukasa
    • Seiichiro MurataMasaru TateishiKohji HayakawaTakeshi SakamotoKohsuke Mukasa
    • B63B3/62B63B3/20B29C45/18
    • B63B3/20
    • A transverseless ship has at least its side portions and bottom portion comprised of a double hull construction which comprises an inner hull plating and an outer hull plating connected together only by transverse bulkheads and a plurality of connecting longitudinal members fixed to the bulkheads. The bottom portion of the ship has a space defined by at least two optionally selected connecting longitudinal members and divided by a partition into an upper chamber and a lower chamber. The upper chamber is adapted in its entirety to pass a fluid therethrough. With this structure, external forces acting on the ship are delivered from the connecting longitudinal members to the transverse bulkheads to prevent the inner and outer platings from buckling. The absence of reinforcing transverse members intersecting the connecting longitudinal members assures automatic welding operation with greatly improved efficiency. Since the space defined by the connecting longitudinal members is utilized as a fluid channel, there is no need to provide additional fluid transport piping.
    • 至少其横截面的船只至少具有由双层船体结构构成的底部部分,该双层船体结构包括内部船体电镀和外部船体电镀板,其仅通过横向舱壁连接在一起,并且多个连接纵向构件固定在舱壁上。 船的底部具有由至少两个可选择的连接纵向构件限定的空间,并且被隔板分隔成上室和下室。 上部腔室整体适应通过流体。 利用这种结构,作用在船上的外力从连接的纵向构件被输送到横向舱壁,以防止内部和外部电镀板屈曲。 没有与连接纵向构件相交的加强横向构件确保了自动焊接操作,并且效率大大提高。 由于由连接的纵向构件限定的空间用作流体通道,因此不需要提供另外的流体输送管道。