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1. 发明专利

TW201741488A 銅之成膜裝置、銅之成膜方法、銅配線形成方法、銅配線审中-公开
简体标题：铜之成膜设备、铜之成膜方法、铜配线形成方法、铜配线
公开(公告)号：TW201741488A
公开(公告)日：2017-12-01
申请号：TW106105561
申请日：2017-02-20
申请人：國立大學法人茨城大學 , IBARAKI UNIVERSITY
发明人：山內智 , YAMAUCHI, SATOSHI
IPC分类号： C23C16/448 , C23C16/46 , C23C16/14 , C23C16/52 , H01L21/3205
CPC分类号： C23C14/04 , C23C14/14 , H01L21/28 , H01L21/285 , H01L21/3205 , H01L21/768 , H01L23/532
摘要：價廉地得到採用銅配線之半導體裝置。在成膜腔室10之下側於與基板100相面對之部位，設置有坩堝(CuI蒸氣產生構件)30。在坩堝30上安裝有原料加熱器(CuI蒸氣產生構件)31及熱電偶32，能夠測定坩堝30之溫度，進行其控制。在此處，在坩堝30內，填充有作為銅成膜之原料之粒子。該粒子由CuI構成。通過在真空中加熱坩堝30，從而生成CuI蒸氣，基板100暴露於該CuI蒸氣。通過使基板100之溫度Tsub為300℃左右，能夠在絕緣體之上未有何堆積，而僅在導電性之金屬材料之上堆積Cu。
简体摘要：价廉地得到采用铜配线之半导体设备。在成膜腔室10之下侧于与基板100相面对之部位，设置有坩埚(CuI蒸气产生构件)30。在坩埚30上安装有原料加热器(CuI蒸气产生构件)31及热电偶32，能够测定坩埚30之温度，进行其控制。在此处，在坩埚30内，填充有作为铜成膜之原料之粒子。该粒子由CuI构成。通过在真空中加热坩埚30，从而生成CuI蒸气，基板100暴露于该CuI蒸气。通过使基板100之温度Tsub为300℃左右，能够在绝缘体之上未有何堆积，而仅在导电性之金属材料之上堆积Cu。

2. 发明公开

EP4437836A1 CULTURE SOIL FOR PLANT, CULTIVATION SET INCLUDING CULTURE SOIL, CULTIVATION METHOD USING CULTURE SOIL, AND SEEDLING OF PLANT WITH CULTURE SOIL 审中-公开
公开(公告)号：EP4437836A1
公开(公告)日：2024-10-02
申请号：EP22898542.0
申请日：2022-11-21
申请人： Ibaraki University
发明人： NARISAWA, Kazuhiko , WIWIEK, Harsonowati
IPC分类号： A01G7/00 , A01G22/05 , A01G24/10 , A01G24/20
CPC分类号： A01G7/00 , A01G22/05 , A01G24/20 , A01G24/10
摘要： A culture soil for plants includes a fungus of genus Cladophialophora, and one kind of soil of strongly acidic organic cultivation soil, strongly acidic conventional cultivation soil, or weakly acidic to neutral organic cultivation soil. Alternatively, a culture soil for plants contains fungi, which are Exophiala sp. SK47 or a mutant isolate thereof, and strongly acidic organic cultivation soil or strongly acidic conventional cultivation soil; a method of cultivating plant using the culture soil; and a seedling of a plant with culture soil are also provided.

3. 发明公开

EP2738805A1 Aluminium bonding wire, connection structure, semiconductor device and manufacturing method of same 审中-公开
标题翻译： Aluminiumbonddraht，Anschlussstruktur，Halbleitervorrichtung und Herstellungsverfahrendafür
公开(公告)号：EP2738805A1
公开(公告)日：2014-06-04
申请号：EP13193402.8
申请日：2013-11-19
申请人： Nippon Piston Ring Co., Ltd. , Ibaraki University
发明人： Fujii, Yoshitaka , Yamamoto, Atsushi , Takeguchi, Shunsuke , Ishikawa, Yoshiki , Onuki, Jin
IPC分类号： H01L23/49 , H01L21/60 , C22C21/00 , H01L23/00 , C22C21/02 , C22C21/06
CPC分类号： C22C21/06 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/484 , H01L2224/48472 , H01L2224/4851 , H01L2224/48724 , H01L2224/85207 , H01L2224/85948 , H01L2924/00014 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/3512 , H01L2924/01012 , H01L2924/01014 , H01L2924/01029 , H01L2924/01028 , H01L2924/013 , H01L2924/2076 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/00 , H01L2924/00013 , H01L2224/43
摘要： The generation and propagation of cracks in a connection to a connected member is prevented. A semiconductor device is provided with a connection structure 15 between a bonding wire 17 consisting of an aluminum alloy which contains at least magnesium and silicon and in which a total of contents of the magnesium and the silicon is not less than 0.03 wt% but not more than 0.3 wt% and a silicon chip 16 to which this bonding wire 17 is connected. An aluminum-silicon film 16a is formed on the surface of the silicon chip 16. This connection structure 15 has a compound 18 containing magnesium and silicon in a matrix layer 17a constituting the bonding wire 17, in a fine grain layer 17b of the aluminum alloy formed between the matrix layer 17a and the aluminum-silicon film 16a, and at an interface between the matrix layer 17a and the fine grain layer 17b.
摘要翻译：防止与连接构件的连接中的裂纹的产生和传播。半导体器件在由包含至少镁和硅的铝合金构成的接合线17之间设置有连接结构15，其中镁和硅的总含量不小于0.03重量％但不大于大于0.3重量％的硅芯片16和与其接合的硅芯片16。在硅芯片16的表面上形成铝硅膜16a。该连接结构15在铝合金的细晶粒层17b中具有在构成接合线17的基体层17a中含有镁和硅的化合物18 形成在基体层17a和铝硅膜16a之间，并且在基体层17a和细晶粒层17b之间的界面处。

4. 发明公开

EP2468779A1 TRANSPARENT FLUORINE-CONTAINING POLYMER 审中-公开
标题翻译：透明质酸酯聚合物
公开(公告)号：EP2468779A1
公开(公告)日：2012-06-27
申请号：EP10809939.1
申请日：2010-08-16
申请人： Ibaraki University , Nissan Chemical Industries, Ltd.
发明人： KUBOTA Toshio , NAGASAWA Takehiro , HIROOKA Akira
IPC分类号： C08F216/12 , C08F220/10
CPC分类号： C08F220/18 , C08F216/125 , Y10T428/24802 , C08F220/12
摘要： Disclosed is a fluorine-containing polymer obtained by polymerizing a 1,6-diene-type ether compound represented by formula [1] and, for example, a (meth)acrylic acid compound represented by formula [2]. The fluorine-containing polymer shows high transparency, has a high glass transition point, and is soluble in a solvent and therefore has moldability. In the case where a (meth)acrylic unit has a reactive substituent, by utilizing the crosslinking reaction thereof, a thin film having high solvent resistance can be produced.

In formulae [1] and [2], R 1 and R 2 each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, which may be substituted, R 3 represents a hydrogen atom, a fluorine atom, or a methyl group, and R 4 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, which may be substituted, or an aromatic group having 5 to 10 ring members, which may be substituted.
摘要翻译：公开了通过使由式[1]表示的1,6-二烯型醚化合物和例如式[2]所示的（甲基）丙烯酸化合物聚合而获得的含氟聚合物。含氟聚合物显示高透明度，玻璃化转变温度高，易溶于溶剂，因此具有成型性。在（甲基）丙烯酸单元具有反应性取代基的情况下，通过利用其交联反应，可以制造耐溶剂性高的薄膜。在式[1]和[2]中，R 1和R 2各自独立地表示氢原子或可以被取代的碳原子数1〜12的烷基，R 3表示氢原子，氟原子或甲基，R 4表示氢原子，可以被取代的碳原子数1〜12的烷基或可以被取代的环状成员5〜10的芳香族基。

5. 发明公开

EP2816667A1 ARTIFICIAL DIELECTRIC LENS 有权
标题翻译：人工介质透镜
公开(公告)号：EP2816667A1
公开(公告)日：2014-12-24
申请号：EP12868744.9
申请日：2012-12-26
申请人： Ibaraki University
发明人： SUZUKI Takehito
IPC分类号： H01Q15/04
CPC分类号： G02B1/002 , G02B13/14 , H01Q15/04 , H01Q15/10
摘要： To realize arrangement in place easily and to obtain a desired refractive index.
A z-axis is defined as an optical axis and axes perpendicular to the z-axis are defined as an x-axis and a y-axis. Multiple metal plate pieces 10 each have multiple groove portions formed in the direction of the x-axis. An outer shape of the metal plate pieces 10 are such that the respective cross sections of the metal plate pieces 10 are parallel to x-z planes at given intervals of a lens along the y-axis from a lower edge to a center and from the center to an upper edge. A metal dielectric lens 1 is formed by laminating the metal plate pieces 10 such that the metal plate pieces 10 are arranged parallel to the x-z planes at the given intervals. As a result, a refractive index responsive to the number of the groove portions, and the width and the depth of the groove portion can be obtained. And, a resultant structure causes visible light to pass therethrough.

6. 发明公开

EP1992294A4 BIOLOGICAL TISSUE BONDING DEVICE AND BIOLOGICAL TISSUE BONDING MEDICAL INSTRUMENT 审中-公开
标题翻译：连接装置：用于生物组织生物组织医疗连接机器
公开(公告)号：EP1992294A4
公开(公告)日：2014-08-06
申请号：EP07737635
申请日：2007-03-01
申请人： NAT UNIV CORP TOKYO MED & DENT , NAT UNIVERSITY CORP IBARAKI UNIVERSITY , NAT UNIV CORP SHIMANE UNIV
发明人： KISHIDA AKIO , MASUZAWA TORU , HIGAMI TETSUYA
IPC分类号： A61B17/00 , A61B17/11 , A61B18/00
CPC分类号： A61B17/320092 , A61B17/00491 , A61B2017/00504 , A61B2017/00969

7. 发明公开

EP4224170A1 LEUKOCYTE TRAPPING APPARATUS 审中-实审
公开(公告)号：EP4224170A1
公开(公告)日：2023-08-09
申请号：EP21875143.6
申请日：2021-09-10
申请人： NOK Corporation , NATIONAL UNIVERSITY CORPORATION IBARAKI UNIVERSITY
发明人： NAKAMURA, Asako , TAKAHASHI, Kenta , KOMORI, Takayuki
IPC分类号： G01N37/00 , C12M1/26 , G01N1/04 , G01N33/48
摘要： The present invention addresses the problem of providing a leukocyte trapping apparatus which does not require a large-size device such as a centrifuge separator and in which the amount of blood to be needed can be reduced to an amount as small as about 1 ul. The problem is solved by a leukocyte trapping apparatus (1) for trapping leukocytes by passing a blood-containing solution therethrough, the leukocyte trapping apparatus (1) being configured such that: a chip (10) has a flat part (12) and many protruding parts (14) arranged on the flat part (12), in which the blood-containing solution that enters through an inlet port (3) is allowed to pass through the surface of the flat part (12) and also allowed to pass through spaces between a protruding part (14) and another protruding part (14) adjacent to the aforementioned protruding part (14) in the chip (10) and is discharged through a discharge port (5); the protruding parts (14) are arranged so as to form layers on the flat part (12), in which each of the layers contains a plurality of the protruding parts (14), and the blood-containing solution that has passed through a layer located on the inlet port (3) side passes through another layer that is adjacent to the aforementioned layer on the discharge port (5) side; a trapping part and a bypass part are formed between a protruding part (14) and another adjacent protruding part (14) in each of the layers; and the trapping part is arranged on the discharge port (5) side of the bypass part in a specific layer as a portion of another layer adjacent to the specific layer.

8. 发明公开

EP3859791A1 SEMICONDUCTOR MATERIAL, INFRARED LIGHT RECEIVING ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MATERIAL 审中-公开
公开(公告)号：EP3859791A1
公开(公告)日：2021-08-04
申请号：EP19883358.4
申请日：2019-05-23
申请人： Ibaraki University , JX Nippon Mining & Metals Corporation
发明人： UDONO, Haruhiko , ASAHI, Toshiaki
IPC分类号： H01L31/0264
摘要： Provided is a semiconductor material having improved oxidation resistance. The semiconductor material has a single crystal represented by the following composition formula:

Composition formula: Mg 2 Sn·Zn a

in which, a is a Zn content of from 0.05 to 1 at% relative to Mg 2 Sn.

9. 发明公开

EP2530710A3 Bonding wire, connection structure, semiconductor device and manufacturing method of same 审中-公开
标题翻译：接合线连接结构，半导体装置及其制造方法
公开(公告)号：EP2530710A3
公开(公告)日：2013-10-16
申请号：EP12169576.1
申请日：2012-05-25
申请人： Nippon Piston Ring Co., Ltd. , Ibaraki University
发明人： FUJII, Yoshitaka , ONUKI, Jin
IPC分类号： H01L23/49 , H01L21/60 , C22C21/00
CPC分类号： H01L24/45 , H01L24/05 , H01L24/43 , H01L24/48 , H01L24/85 , H01L25/072 , H01L2224/04042 , H01L2224/05624 , H01L2224/43848 , H01L2224/45012 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48458 , H01L2224/48472 , H01L2224/4851 , H01L2224/48724 , H01L2224/85099 , H01L2224/85205 , H01L2224/85948 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/014 , H01L2924/10253 , H01L2924/1203 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/20105 , H01L2924/20106 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2924/20107 , H01L2924/01026 , H01L2924/01025 , H01L2924/00 , H01L2924/013 , H01L2924/01024 , H01L2924/00013 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/2075 , H01L2924/20754 , H01L2924/01006
摘要： The generation and propagation of cracks in a connection to a connected member is prevented. A semiconductor device 10 is provided with a connection structure 15 between a bonding wire 17 consisting of an aluminum alloy which contains at least magnesium and silicon and in which a total of contents of the magnesium and the silicon is not less than 0.03 wt% but not more than 1.0 wt% and a silicon chip 16 to which this bonding wire 17 is connected. An aluminum-silicon film 16a is formed on the surface of the silicon chip 16. This connection structure 15 has a compound 18 containingmagnesium and silicon in a matrix layer 17a constituting the bonding wire 17, in a fine grain layer 17b of the aluminum alloy formed between the matrix layer 17a and the aluminum-silicon film 16a, and at an interface between the matrix layer 17a and the fine grain layer 17b.

10. 发明公开

EP1992294A1 BIOLOGICAL TISSUE BONDING DEVICE AND BIOLOGICAL TISSUE BONDING MEDICAL INSTRUMENT 审中-公开
标题翻译：连接装置：用于生物组织生物组织医疗连接机器
公开(公告)号：EP1992294A1
公开(公告)日：2008-11-19
申请号：EP07737635.8
申请日：2007-03-01
申请人： National University Corporation Tokyo Medical and Dental University , NATIONAL UNIVERSITY CORPORATION IBARAKI UNIVERSITY , National University Corporation Shimane University
发明人： KISHIDA, Akio c/o National University Corporation , MASUZAWA, Toru National University Corporation Ibaraki University , HIGAMI, Tetsuya
IPC分类号： A61B17/00
CPC分类号： A61B17/320092 , A61B17/00491 , A61B2017/00504 , A61B2017/00969
摘要： A device 1a for bonding adherends T1 and T2, as a device for bonding biological tissue to biological tissue or a biological tissue bonding material, comprises: a clamping part 2a for clamping the adherends T1 and T2 between members 21a and 22a; a pressing part 3a for pressing the member 22a towards the member 21a; a pressure control part 4a for controlling the pressure by the pressing part 3a; a heating element 5a built into the member 21a; a heating control part 6a for controlling the heating by the heating element 5a; a vibration generating part 7a for generating microvibration; and a vibration control part 8a for controlling the microvibration generated by the vibration generating part 7a.
摘要翻译：用于粘合粘附体T1和T2的装置1a中，作为用于生物组织粘合到生物组织或生物组织粘合材料的装置，包括：一个夹紧部2a用于夹紧部件21a，22a之间的粘物T1和T2; 为压向构件21a上的部件22a的按压部3a; 一压力控制部4a用于控制由所述按压部3a中的压力; 内置在部件21A的加热元件5A; 用于控制由所述加热元件5a上的加热的加热控制部6; 用于产生微振动的振动产生部7a; 和振动控制用于控制由振动产生部7a产生的微振动部8。

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