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1. 发明授权

US08622754B2 Flexible power connector 有权
标题翻译：柔性电源连接器
公开(公告)号：US08622754B2
公开(公告)日：2014-01-07
申请号：US13194953
申请日：2011-07-31
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre , Brian Lynn Rowden
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre , Brian Lynn Rowden
IPC分类号： H01R12/00
CPC分类号： H01R43/20 , H01R13/5812 , H01R35/02
摘要： A flexible power connector is presented. An embodiment of a flexible power connector includes a stacked structure having one or more insulating strips alternatingly arranged with a plurality of conducting strips, wherein the one or more insulating strips are interposed between the plurality of conducting strips to insulate each conducting strip from the other conducting strip in the stacked structure, and wherein the plurality of conducting strips is disposed parallel and proximate to each other to reduce electrical losses in the stacked structure
摘要翻译：介绍了一种灵活的电源连接器。柔性电源连接器的实施例包括具有交替地布置有多个导电条的一个或多个绝缘条的堆叠结构，其中所述一个或多个绝缘条插入在所述多个导电条之间，以将每个导电条与另一导电并且其中所述多个导电条彼此平行并且彼此靠近设置，以减少所述堆叠结构中的电损耗

2. 发明授权

US08487416B2 Coaxial power module 有权
标题翻译：同轴电源模块
公开(公告)号：US08487416B2
公开(公告)日：2013-07-16
申请号：US13247216
申请日：2011-09-28
申请人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
发明人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
IPC分类号： H01L23/552 , H01L23/34 , H01L23/04 , H01L23/12 , H05K7/20 , H05K9/00
CPC分类号： H01L23/552 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.
摘要翻译：电源模块包括至少一个半导体管芯保持结构。每个模具保持结构具有基本上圆柱形的外部轮廓和中心轴线。每个管芯保持结构设置在共同的圆柱形EMI屏蔽内。多个半导体器件被安装到每个管芯保持结构，以相对于管芯保持结构的中心轴线形成大致对称的管芯安装图案。

3. 发明授权

US08466007B2 Power semiconductor module and fabrication method 有权
标题翻译：功率半导体模块及其制造方法
公开(公告)号：US08466007B2
公开(公告)日：2013-06-18
申请号：US13236748
申请日：2011-09-20
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre , Stephen Daley Arthur , Ernest Wayne Balch , Kevin Matthew Durocher , Paul Alan McConnelee , Raymond Albert Fillion
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre , Stephen Daley Arthur , Ernest Wayne Balch , Kevin Matthew Durocher , Paul Alan McConnelee , Raymond Albert Fillion
IPC分类号： H01L21/50
CPC分类号： H01L25/50 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2224/04105 , H01L2224/2413 , H01L2224/24137 , H01L2224/2518 , H01L2224/2919 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/92144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/1532 , H01L2924/18162 , H01L2924/00 , H01L2924/01014
摘要： A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.
摘要翻译：功率半导体模块包括：互连层，其包括在电介质层上图案化的电导体，所述电导体包括具有足以承载电力电流的厚度的功率耦合部分和具有比功率耦合的厚度更薄的厚度的控制耦合部分一部分; 以及物理耦合到所述互连层并且电耦合到所述电导体的功率耦合部分的半导体功率器件。

4. 发明授权

US07760005B2 Power electronic module including desaturation detection diode 失效
标题翻译：电力电子模块包括去饱和二极管
公开(公告)号：US07760005B2
公开(公告)日：2010-07-20
申请号：US11693004
申请日：2007-03-29
申请人： Michael Andrew de Rooij , Eladio Clemente Delgado , Stephen Daley Arthur
发明人： Michael Andrew de Rooij , Eladio Clemente Delgado , Stephen Daley Arthur
IPC分类号： H03K17/04
CPC分类号： H03K17/60 , H03K17/0414 , H03K17/18 , H03K17/567 , H03K17/732 , H03K17/74
摘要： A power electronic module includes: a switch module including a desaturation detection diode and a power semiconductor switch, and wherein the desaturation detection diode is coupled to a switching connection of the power semiconductor switch; and a driver module coupled to the switch module, wherein the driver module is configured for obtaining a voltage signal across the desaturation detection diode and the power semiconductor switch and configured for turning off the power semiconductor switch upon the voltage signal exceeding a threshold. In one example, the driver module is discrete from the switch module. In another example, the switch module and driver modules are configured to respectively provide and receive a voltage signal of less than or equal to seventy volts.
摘要翻译：电力电子模块包括：开关模块，包括去饱和检测二极管和功率半导体开关，并且其中所述去饱和检测二极管耦合到所述功率半导体开关的开关连接; 以及耦合到所述开关模块的驱动器模块，其中所述驱动器模块被配置为用于获得跨越所述去饱和检测二极管和所述功率半导体开关的电压信号，并且被配置为在所述电压信号超过阈值时关闭所述功率半导体开关。在一个示例中，驱动器模块与开关模块是离散的。在另一示例中，开关模块和驱动器模块被配置为分别提供和接收小于或等于七十伏的电压信号。

5. 发明授权

US07652476B2 Integrated capacitor shield for balun in MRI receivers 有权
标题翻译： MRI接收器中的平衡 - 不平衡转换器集成电容屏蔽
公开(公告)号：US07652476B2
公开(公告)日：2010-01-26
申请号：US11609282
申请日：2006-12-11
申请人： Michael A. de Rooij , Eladio Clemente Delgado
发明人： Michael A. de Rooij , Eladio Clemente Delgado
IPC分类号： G01V3/00 , G01R33/36 , H03H7/42
CPC分类号： G01R33/3685 , G01R33/3621 , G01R33/422 , H03F1/56 , H03F3/191 , H03F2200/213 , H03F2200/222 , H03F2200/294 , H03F2200/451 , Y10T29/49117
摘要： A balun is included in a magnetic resonance imaging system. The balun conditions electromagnetic signals received from at least one RF receiver coil. The balun includes a balun shield having an integrated capacitor therein. The balun blocks unwanted feedback from effecting performance of any components contained within the balun shield.
摘要翻译：平衡 - 不平衡转换器包括在磁共振成像系统中。平衡 - 不平衡变换器响应从至少一个RF接收器线圈接收的电磁信号。平衡 - 不平衡变压器包括其中具有集成电容器的平衡 - 不平衡变压器屏蔽。平衡 - 不平衡变压器阻止不必要的反馈影响包含在平衡 - 不平衡变压器屏蔽内的任何组件的性

6. 发明申请

US20080308141A1 PHOTOVOLTAIC POWER CONVERTER SYSTEM WITH A CONTROLLER CONFIGURED TO ACTIVELY COMPENSATE LOAD HARMONICS 有权
标题翻译：具有配置为有效补偿负载谐波的控制器的光伏电力转换器系统
公开(公告)号：US20080308141A1
公开(公告)日：2008-12-18
申请号：US10734293
申请日：2003-12-15
申请人： Michael Andrew de Rooij , Robert Louis Steigerwald , Eladio Clemente Delgado
发明人： Michael Andrew de Rooij , Robert Louis Steigerwald , Eladio Clemente Delgado
IPC分类号： H01L25/00
CPC分类号： H02J3/01 , H02J3/383 , Y02B10/14 , Y02E10/563 , Y02E40/40
摘要： Photovoltaic power converter system including a controller configured to reduce load harmonics is provided. The system comprises a photovoltaic array and an inverter electrically coupled to the array to generate an output current for energizing a load connected to the inverter and to a mains grid supply voltage. The system further comprises a controller including a first circuit coupled to receive a load current to measure a harmonic current in the load current. The controller includes a second circuit to generate a fundamental reference drawn by the load. The controller further includes a third circuit for combining the measured harmonic current and the fundamental reference to generate a command output signal for generating the output current for energizing the load connected to the inverter. The photovoltaic system may be configured to compensate harmonic currents that may be drawn by the load.
摘要翻译：提供了包括被配置为减少负载谐波的控制器的光伏功率转换器系统。该系统包括光电阵列和电耦合到阵列的反相器，以产生输出电流，用于激励连接到逆变器的负载和电网电源电压。该系统还包括控制器，其包括耦合以接收负载电流以测量负载电流中的谐波电流的第一电路。控制器包括产生由负载绘制的基准参考的第二电路。该控制器还包括一个第三电路，用于组合测量的谐波电流和基准参考，以产生用于产生输出电流的指令输出信号，以激励连接到逆变器的负载。光伏系统可以被配置为补偿可能由负载引起的谐波电流。

7. 发明授权

US06935792B2 Optoelectronic package and fabrication method 有权
标题翻译：光电封装及制造方法
公开(公告)号：US06935792B2
公开(公告)日：2005-08-30
申请号：US10065460
申请日：2002-10-21
申请人： Richard Joseph Saia , Thomas Bert Gorczyca , Christopher James Kapusta , Ernest Wayne Balch , Glenn Scott Claydon , Samhita Dasgupta , Eladio Clemente Delgado
发明人： Richard Joseph Saia , Thomas Bert Gorczyca , Christopher James Kapusta , Ernest Wayne Balch , Glenn Scott Claydon , Samhita Dasgupta , Eladio Clemente Delgado
IPC分类号： G02B6/12 , G02B6/122 , G02B6/138 , G02B6/42 , G02B6/00
CPC分类号： G02B6/122 , G02B6/12002 , G02B6/12004 , G02B6/1221 , G02B6/138 , G02B6/42 , H01L2224/04105 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/15153 , H01L2924/15192
摘要： An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
摘要翻译：通过一种方法制造光电子封装，该方法包括：将光学器件定位在衬底主动侧的窗口内，顶部衬底表面上方和下方; 用光学聚合物材料填充窗户; 光学聚合物材料和基底的平坦化表面; 在光学聚合物材料和基底上形成波导材料以形成光学互连路径; 并且形成反射镜以将来自光学装置的光反射到互连路径; 以及形成通孔以暴露所述光学器件的接合焊盘。

8. 发明授权

US08547230B1 Unobtrusive proprioceptive monitor for shipping containers and vehicles 有权
标题翻译：不引人注意的本体感应监视器用于运输集装箱和车辆
公开(公告)号：US08547230B1
公开(公告)日：2013-10-01
申请号：US11779154
申请日：2007-07-17
申请人： David R. Darling , Percy N. Funchess, III , Timothy Johnson , Eladio Clemente Delgado
发明人： David R. Darling , Percy N. Funchess, III , Timothy Johnson , Eladio Clemente Delgado
IPC分类号： G08B1/08 , G08B13/14
CPC分类号： G06Q10/0833
摘要： An identification system and method comprising attaching an identification tag to an inside surface of a shipping container port cover and communicating data from the tag via electromagnetic radiation.
摘要翻译：一种识别系统和方法，包括将识别标签附接到运输容器端口盖的内表面，并经由电磁辐射从标签传送数据。

9. 发明申请

US20120242453A1 ENERGY MANAGEMENT IN RFID SYSTEMS WITH LONG TERM ACTIVE SENSING 审中-公开
标题翻译：具有长期有源感测的RFID系统的能源管理
公开(公告)号：US20120242453A1
公开(公告)日：2012-09-27
申请号：US11616174
申请日：2006-12-26
申请人： Eladio Clemente Delgado , Timothy Lee Johnson , Richard Joseph Gawrelski
发明人： Eladio Clemente Delgado , Timothy Lee Johnson , Richard Joseph Gawrelski
IPC分类号： G06K7/01
CPC分类号： G06K19/0705 , G06K19/0712 , G06K19/0717
摘要： The inventive RFID Environmental Monitoring System (RFID_EMS) includes an RFID-based Environmental Monitor and Energy Management Logic for reducing energy consumption in active RFID tags used for long-term active sensing of storage and transit conditions of shipping containers. The RFID-based Environmental Monitor consists of an active RFID tag containing an RF transponder, microcontroller, sensors and associated interface circuitry. The Energy Management Logic provides hardware and software which work together, and consists of executable software or microcontroller logic that monitors and regulates energy use by an RFID tag and associated sensors, and may control the state of specialized peripheral circuits on the tag. By reading the RFID_EMS tag, the invention enables the determination of the condition of precision equipment prior to use, including equipment that requires high readiness after long periods of transit and/or storage.
摘要翻译：本发明的RFID环境监测系统（RFID_EMS）包括基于RFID的环境监测和能量管理逻辑，用于减少用于长期积极检测运输集装箱的运输条件的有源RFID标签中的能量消耗。基于RFID的环境监测器包括一个包含射频应答器，微控制器，传感器和相关接口电路的有源RFID标签。能源管理逻辑提供了一起工作的硬件和软件，并且由可执行软件或微控制器逻辑组成，可以监控和调节RFID标签和相关传感器的能源使用情况，并且可以控制标签上的专用外围电路的状态。通过阅读RFID_EMS标签，本发明能够在使用之前确定精密设备的状况，包括在长时间的运输和/或存储之后需要高准备度的设备。

10. 发明授权

US07518236B2 Power circuit package and fabrication method 有权
标题翻译：电源电路封装及制作方法
公开(公告)号：US07518236B2
公开(公告)日：2009-04-14
申请号：US11259992
申请日：2005-10-26
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre
IPC分类号： H01L23/34
CPC分类号： H01L23/057 , H01L23/24 , H01L23/49811 , H01L23/49822 , H01L24/24 , H01L25/072 , H01L25/162 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/92144 , H01L2924/01079 , H01L2924/12044 , H01L2924/1305 , H01L2924/15747 , H01L2924/15787 , H01L2924/3011 , H05K1/141 , H05K1/145 , H05K1/147 , H01L2924/00
摘要： A power circuit package includes a base including a substrate, a plurality of interconnect circuit layers over the substrate with each including a substrate insulating layer patterned with substrate electrical interconnects, and via connections extending from a top surface of the substrate to at least one of the substrate electrical interconnects; and a power semiconductor module including power semiconductor devices each including device pads on a top surface of the respective power semiconductor device and backside contacts on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure, the membrane structure including a membrane insulating layer and membrane electrical interconnects over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts are coupled to selected substrate electrical interconnects or via connections.
摘要翻译：功率电路封装包括基底，其包括基底，在基底上的多个互连电路层，每个包括用衬底电互连图案化的衬底绝缘层，以及经由从衬底的顶表面延伸到至少一个基板电气互连; 以及功率半导体模块，其包括功率半导体器件，每个功率半导体器件在各个功率半导体器件的顶表面上包括器件焊盘，并且在各个功率半导体器件的底表面上具有背面触点，所述功率半导体器件耦合到膜结构，所述膜包括膜绝缘层和膜电绝缘层上的薄膜电互连并且选择性地延伸到器件焊盘的结构，其中背面触点耦合到所选择的衬底电互连或经由连接。

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