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1. 发明申请

US20120103662A1 Printed circuit board and manufacturing method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120103662A1
公开(公告)日：2012-05-03
申请号：US13064331
申请日：2011-03-18
申请人： Chang Bo Lee , Cheol Ho Choi , Yoong Oh
发明人： Chang Bo Lee , Cheol Ho Choi , Yoong Oh
IPC分类号： H05K1/02 , B05D5/00 , H05K3/10 , H05K3/22
CPC分类号： H05K3/3452 , H05K3/3436 , H05K2203/0278 , H05K2203/1476 , Y10T29/49155 , Y10T156/10
摘要： Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof.
摘要翻译：这里公开了一种印刷电路板，其包括形成在其上形成有电路图案的基板的一个表面上的第一低粘度阻焊层和堆叠在第一阻焊层上的第二高粘度阻焊层，由此有利于控制阻焊剂（SR）的应用厚度的偏差，同时对基板具有优异的粘附性及其制造方法。

2. 发明申请

US20060272299A1 Cyclone dust collecting apparatus 审中-公开
标题翻译：旋风除尘装置
公开(公告)号：US20060272299A1
公开(公告)日：2006-12-07
申请号：US11317619
申请日：2005-12-23
申请人： Cheol-ho Choi
发明人： Cheol-ho Choi
IPC分类号： B01D50/00
CPC分类号： A47L9/1608 , A47L9/122 , A47L9/165 , A47L9/1658 , A47L9/1683
摘要： A cyclone dust collecting apparatus according to an embodiment of the present invention, comprises a housing centrifugally separating and collecting dust from drawn-in air and discharging cleaned air, a housing cover connected to an upper part of the housing, a discharge cover openably connected to a lower part of the housing, and a filter assembly. The housing includes an air inlet, a cyclone unit centrifugally separating dust from external air drawn in through the air inlet, an inflow guide pipe having a substantially curved shape and guiding the whole air drawn in through the air inlet to the cyclone unit, a dust collection unit formed at one side of the cyclone unit to collect the separated dust, and an air outlet where the dust-separated air is discharged.
摘要翻译：根据本发明的一个实施例的旋风除尘装置包括：壳体，其从抽吸空气中离心分离和收集灰尘并排出净化空气;壳体盖，连接到壳体的上部;排出盖，可开启地连接到壳体的下部和过滤器组件。壳体包括空气入口，将通过空气入口吸入的外部空气离心分离的旋风单元，具有基本弯曲形状的流入导管，并将通过空气入口吸入的整个空气引导到旋风单元，灰尘收集单元形成在旋风单元的一侧以收集分离的灰尘，以及排出空气的空气出口。

3. 发明授权

US07053541B2 Rail in flat type cathode ray tube 失效
公开(公告)号：US07053541B2
公开(公告)日：2006-05-30
申请号：US10289422
申请日：2002-11-07
申请人： Bum-Sik Seo , Cheol-Ho Choi
发明人： Bum-Sik Seo , Cheol-Ho Choi
IPC分类号： H01J29/07 , H01J29/81
CPC分类号： H01J29/073 , H01J2229/0716
摘要： A rail of a flat type cathode ray tube is disclosed, wherein the flat type cathode ray tube comprises a panel having a deposited fluorescent surface therein and of which interior and exterior surfaces are substantially flat, a funnel connected to the panel; a shadow mask arranged with the inner surface of the panel with a predetermined gap, and a rail fixed to the panel and combined with the shadow mask. In the flat type cathode ray tube, if a height of the rail is L, the rail maintains a predetermined gap of 0.1L˜0.3L with the panel and is fixed by a frit glass.

4. 发明申请

US20100291488A1 Manufacturing method for multilayer core board 审中-公开
标题翻译：多层芯板的制造方法
公开(公告)号：US20100291488A1
公开(公告)日：2010-11-18
申请号：US12805371
申请日：2010-07-27
申请人： Soon-Oh Jung , Cheol-Ho Choi , Chang-Hyun Nam , Hong-Won Kim , Seung-Chul Kim
发明人： Soon-Oh Jung , Cheol-Ho Choi , Chang-Hyun Nam , Hong-Won Kim , Seung-Chul Kim
IPC分类号： H05K13/00 , B05D5/12 , G03F7/20
CPC分类号： H05K3/108 , H05K3/181 , H05K3/4661 , H05K2201/0344 , Y10T29/49124 , Y10T428/31678
摘要： A method for manufacturing a cone board including: preparing a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins; and forming a first nickel layer on at least one surface of the core insulation layer by electroless plating
摘要翻译：一种锥形板的制造方法，包括：制备包含一种或多种选自环氧树脂和双马来酰亚胺三嗪树脂的树脂的芯绝缘层; 以及通过无电镀在所述芯绝缘层的至少一个表面上形成第一镍层

5. 发明申请

US20100052152A1 Semiconductor package transformer 失效
标题翻译：半导体封装变压器
公开(公告)号：US20100052152A1
公开(公告)日：2010-03-04
申请号：US12461869
申请日：2009-08-26
申请人： Cheol Ho Choi
发明人： Cheol Ho Choi
IPC分类号： H01L23/482 , H01L23/538
CPC分类号： H01L23/49811 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case.
摘要翻译：本发明涉及一种半导体封装变压器。提供了一种半导体封装变压器，其包括：在其前表面上形成插入有安装在基板上的芯片的半导体封装的开口的窗口，并且在其上表面上形成露出部分; 以及形成在壳体的底面上的多个孔。

6. 发明授权

US06797781B2 Blends of fluoropolymer and plasticized polyvinyl chloride 有权
标题翻译：含氟聚合物和增塑聚氯乙烯的共混物
公开(公告)号：US06797781B2
公开(公告)日：2004-09-28
申请号：US10133525
申请日：2002-04-26
申请人： Biing-Lin Lee , James L. White , Cheol-Ho Choi , Maryellen Cobb , Raman Patel
发明人： Biing-Lin Lee , James L. White , Cheol-Ho Choi , Maryellen Cobb , Raman Patel
IPC分类号： C08L2706
CPC分类号： C08L23/0846 , C08L23/04 , C08L23/0815 , C08L27/06 , C08L27/12 , C08L51/003 , C08L51/06 , C08L2205/02 , C08L2205/03 , C08L2666/06 , C08L2666/02
摘要： A melt-mixed blend of plasticized PVC, fluoropolymers, and a compatibilizer having acrylate functionality exhibits good mechanical and dielectric properties and is useful for wiring and cable applications.
摘要翻译：具有丙烯酸酯官能团的增塑PVC，含氟聚合物和增容剂的熔融混合共混物具有良好的机械和介电性能，并且可用于布线和电缆应用。

7. 发明授权

US09060458B2 Method for manufacturing multi-layer printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US09060458B2
公开(公告)日：2015-06-16
申请号：US13137352
申请日：2011-08-08
申请人： Yoong Oh , Cheol Ho Choi
发明人： Yoong Oh , Cheol Ho Choi
IPC分类号： H05K3/02 , H05K3/10 , H05K3/00 , H05K1/00 , H05K1/03 , H05K3/46
CPC分类号： H05K3/4652 , H05K2203/0733 , H05K2203/1189 , Y10T29/49155
摘要： A method for manufacturing a multi-layer printed circuit board includes: forming first bumps on one surface of a first copper layer at a predetermined interval; providing, on the first copper layer, an insulating layer through which the first bumps are penetrating; stacking a second copper layer on a top of the insulating layer; forming circuits by patterning the first copper layer and the second copper layer; laminating insulating films on top and bottom surfaces of the insulating layer on which the circuits have been formed; forming second bumps on one surface of a third copper layer and of a fourth copper layer at a predetermined interval; and stacking the third copper layer and fourth copper layer, provided with the second bumps, on the top and bottom surfaces of the insulating films.
摘要翻译：制造多层印刷电路板的方法包括：以预定间隔在第一铜层的一个表面上形成第一凸块; 在所述第一铜层上提供绝缘层，所述第一凸块穿过所述绝缘层; 在绝缘层的顶部堆叠第二铜层; 通过图案化第一铜层和第二铜层来形成电路; 在其上形成有电路的绝缘层的顶表面和底表面上层压绝缘膜; 在第三铜层和第四铜层的一个表面上以预定间隔形成第二凸起; 并且在绝缘膜的顶表面和底表面上堆叠设置有第二凸起的第三铜层和第四铜层。

8. 发明授权

US08489222B2 Machine and method for grinding spacer grid of nuclear fuel assembly 有权
标题翻译：用于研磨核燃料组件的间隔栅格的机器和方法
公开(公告)号：US08489222B2
公开(公告)日：2013-07-16
申请号：US12857530
申请日：2010-08-16
申请人： Chang Kug Kim , Deuk Yeon Kim , Jung Hwan Hong , Hang Rae Kim , Cheol Ho Choi
发明人： Chang Kug Kim , Deuk Yeon Kim , Jung Hwan Hong , Hang Rae Kim , Cheol Ho Choi
IPC分类号： G06F19/00
CPC分类号： B24B51/00 , B24B1/00 , B24B27/0076 , B24B49/02 , B25J11/0065 , G21C3/3424
摘要： A machine and a method for grinding a spacer grid of a nuclear fuel assembly. The machine includes a spacer grid holding unit, a first rectangular coordinates robot for grinding an outer surface of the spacer grid, a second rectangular coordinates robot for grinding a corner of the spacer grid, and a control unit. The spacer grid holding unit includes a holding jig onto which the spacer grid is seated and held, and a rotary index table which is coupled to the holding jig to rotate the holding jig. The first and second rectangular coordinates robots are provided at predetermined positions adjacent to the spacer grid holding unit. The control unit controls the spacer grid holding unit, the first and second rectangular coordinates robots and all programs required to conduct the operation for grinding the spacer grid.
摘要翻译：一种用于研磨核燃料组件的间隔栅格的机器和方法。该机器包括间隔栅格保持单元，用于研磨间隔栅格的外表面的第一直角坐标机器人，用于研磨间隔栅格的角部的第二直角坐标机器人和控制单元。间隔栅格保持单元包括保持夹具，间隔栅格被放置在其上并保持在该保持夹具上;旋转分度台，其连接到保持夹具以旋转保持夹具。第一和第二直角坐标机器人设置在与间隔栅格保持单元相邻的预定位置处。控制单元控制间隔栅格保持单元，第一和第二直角坐标机器人以及进行用于研磨间隔栅格的操作所需的所有程序。

9. 发明申请

US20120266463A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20120266463A1
公开(公告)日：2012-10-25
申请号：US13252815
申请日：2011-10-04
申请人： Chang Bo LEE , Cheol Ho CHOI , Jin Ho KIM , Jee Soo MOK
发明人： Chang Bo LEE , Cheol Ho CHOI , Jin Ho KIM , Jee Soo MOK
IPC分类号： H05K3/10
CPC分类号： H05K3/242 , H01L2924/0002 , H05K3/3436 , H05K3/3452 , H05K3/4007 , H05K2201/099 , H05K2201/10674 , H05K2203/0577 , H05K2203/107 , Y10T29/49155 , H01L2924/00
摘要： Disclosed herein is a method for manufacturing a printed circuit board, including: forming a complex solder resist layer including a solder resist having an open part for forming a metal post and a cover film contacting the solder resist on a base substrate having an outer-layer circuit including a plating lead line; forming a metal post on the open part for forming the metal post by performing electroplating; removing the plating lead line; and exposing the metal post by removing the cover film.
摘要翻译：本文公开了一种制造印刷电路板的方法，包括：形成复合阻焊层，其包括具有用于形成金属柱的开口部分的阻焊剂和在具有外层的基底基板上与阻焊剂接触的覆盖膜电路包括电镀引线; 通过进行电镀在开口部上形成金属柱，形成金属柱; 去除电镀引线; 并通过去除覆盖膜来暴露金属柱。

10. 发明授权

US08143715B2 Semiconductor package transformer 失效
标题翻译：半导体封装变压器
公开(公告)号：US08143715B2
公开(公告)日：2012-03-27
申请号：US12461869
申请日：2009-08-26
申请人： Cheol Ho Choi
发明人： Cheol Ho Choi
IPC分类号： H01L23/482 , H01L23/538
CPC分类号： H01L23/49811 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case.
摘要翻译：本发明涉及一种半导体封装变压器。提供了一种半导体封装变压器，其包括：在其前表面上形成插入有安装在基板上的芯片的半导体封装的开口的窗口，并且在其上表面上形成露出部分; 以及形成在壳体的底面上的多个孔。

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