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2. 发明申请

WO2010115296A1 功率LED散热基板、功率LED产品及其制造方法审中-公开
公开(公告)号：WO2010115296A1
公开(公告)日：2010-10-14
申请号：PCT/CN2009/000388
申请日：2009-04-10
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L25/075 , H01L25/13 , H01L23/367 , H01L33/00
CPC分类号： H01L33/486 , H01L23/3677 , H01L25/0753 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2924/01322 , H01L2924/181 , H01L2924/1815 , H01L2933/0075 , Y10T29/49124 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

3. 发明申请

WO2009070950A1 一种通过注胶成型透镜的功率LED及其制造方法审中-公开
公开(公告)号：WO2009070950A1
公开(公告)日：2009-06-11
申请号：PCT/CN2008/000590
申请日：2008-03-26
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L33/00 , H01L21/56 , B44C1/20 , B29C45/26
CPC分类号： B29C45/14655 , H01L33/483 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A power LED and a method of manufacture thereof. The method includes the following steps: arranging a glue injecting hole (306) and an air exhaust hole (307) on a substrate (305); providing a LED chip (308) on the substrate (305) and finishing electrical connection; then pressing a mold (301) which is applied to a molding lens (312) on the substrate (305); injecting a packaging colloid (311) to the glue injecting hole (306) from the bottom of the substrate (305); finishing the glue injection and the colloid being solidified; then detaching the mold (301); finishing the mold for packaging lens (312) of the LED chip.

4. 发明申请

WO2009049453A1 功率发光二极管封装结构审中-公开
公开(公告)号：WO2009049453A1
公开(公告)日：2009-04-23
申请号：PCT/CN2007/003740
申请日：2007-12-24
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L33/00 , H01L23/367 , F21V29/00
CPC分类号： H01L33/642 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： A power LED encapsulation structure, comprising a heat sink (1), a circuit board, a LED chip (3), inner leads (4) and an encapsulated colloid (8). The circuit board has a counter bore (10), the heat sink (1) is inserted in the counter bore (10), the LED chip (3) is placed on the heat sink (1), and the bottom of the heat sink (1) directly contacts with the outer. The electrodes of the LED chip (3) are connected to the interior metal electrodes (7) of the circuit board by the inner leads (4), and the encapsulated colloid (8) covers the inner leads (4) and the LED chip (3).

5. 发明申请

WO2009082865A1 应用于通用照明的LED面光源审中-公开
公开(公告)号：WO2009082865A1
公开(公告)日：2009-07-09
申请号：PCT/CN2008/000382
申请日：2008-02-22
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 王垚浩 , 李绪峰
发明人：余彬海 , 李军政 , 王垚浩 , 李绪峰
IPC分类号： H01L27/15 , H01L33/00 , H05B37/00 , H01L23/367
CPC分类号： F21K9/00 , F21Y2105/00 , F21Y2115/10 , H01L2224/48091 , H05K1/0204 , H01L2924/00014
摘要： A plane light source comprising LEDs is applied to universal illumination. The plane light source mainly contains heat sinks (113), a wiring board (101), LED chips (114), wirings (115) and resins (117) for assembly. Several electrodes (106) are set to electrically connect LED chips on the board, and a circuit layout (107) interconnects the LED chips. Holes (102), where the sinks are embedded, lie in the board. Plurality of holes in parallel forms some pattern. Such LED chips (114) are mounted on the heat sinks. All the LED chips (114) and wirings (115) are one-step encapsulated by the resins. The encapsulation acts as an optical lens.

6. 发明申请

WO2008138183A1 侧面发光型LED 审中-公开
公开(公告)号：WO2008138183A1
公开(公告)日：2008-11-20
申请号：PCT/CN2007/002949
申请日：2007-10-15
申请人：佛山市国星光电股份有限公司 , 余彬海 , 缪来虎 , 李军政 , 李友民 , 潘利兵
发明人：余彬海 , 缪来虎 , 李军政 , 李友民 , 潘利兵
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/167 , H01L33/62 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： A side emission type LED comprises a frame, a die (4), a binder, a bonding wire (5), and sealant (8). The side emission type LED uses a metal substrate (1) as the frame. The metal substrate (1) is divided into two electrodes insulated each other. Binder mounts the die (4) on one electrode of the metal substrate (1). Another electrode (6) of the metal substrate (1) is connected to electrode of the die (4) by the bonding wire (5). The sealant (8) encapsulates the die (4), the bonding wire (5), and the metal substrate (1).

7. 发明申请

WO2009082864A1 一种条形LED光源审中-公开
公开(公告)号：WO2009082864A1
公开(公告)日：2009-07-09
申请号：PCT/CN2008/000381
申请日：2008-02-22
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 王垚浩 , 李绪峰
发明人：余彬海 , 李军政 , 王垚浩 , 李绪峰
IPC分类号： H01L27/15 , H01L33/00
CPC分类号： H01L33/64 , H01L25/0753 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A LED light source with the shape of a bar comprises a heat sink (406), a substrate (401), a plurality of chips (409), a plurality of internal wires (410), and a colloid (411) for packaging. The heat sink (406) is provided on the substrate (401). The chips (409) are arranged on the heat sink (406). Circuit wires (405) for connecting with the electrodes of the chips (409) and coupling the chips (409) to each other are provided on the substrate (401). The substrate (401) with the shape of a bar is provided with a countersink, in which the heat sink (406) is inlaid. The countersink with the shape of a bar is formed with a simplex or combined structure. The colloid (411) for packaging formed by a single molding process packages the chips (409) and the internal wires (410). The surface of the colloid (411) for packaging has a lens structure.

8. 发明申请

WO2008138182A1 一种片式发光二极管审中-公开
公开(公告)号：WO2008138182A1
公开(公告)日：2008-11-20
申请号：PCT/CN2007/002948
申请日：2007-10-15
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力 , 潘利兵 , 李绪峰
发明人：余彬海 , 李军政 , 夏勋力 , 潘利兵 , 李绪峰
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A chip type light-emitting diode comprises a frame, a die (1), a binder, a bonding wire (2), and sealant (3). The chip type light-emitting diode uses a metal substrate (4) as the frame. The metal substrate (4) is divided into two electrodes insulated each other. Binder mounts the die on one electrode of the metal substrate. Another electrode (5) of the metal substrate is connected to a electrode of the die (1) by the bonding wire (2). The sealant (3) encapsulates the die (1), the bonding wire (2), and the metal substrate (4).

9. 发明申请

WO2009079892A1 一种LED引线框架及利用该引线框架制造LED的方法审中-公开
公开(公告)号：WO2009079892A1
公开(公告)日：2009-07-02
申请号：PCT/CN2008/000380
申请日：2008-02-22
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力 , 缪来虎
发明人：余彬海 , 李军政 , 夏勋力 , 缪来虎
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A LED lead frame is a plate frame structure. The plate frame comprises bulges extending inward from an outer frame and separated each other. The bulges act as a chip mounting portion (301), a connection portion of an inner lead (302), an outer electrode portion (303), and a body supporter (304). The outer frame forms a connection base (305). The connection portion of an inner lead (302) and the chip-mounting portion (301) are located in the front end of the outer electrode portion (303). The chip-mounting portion (301) has a reflecting cup (306). A manufacturing method of a LED comprises that the LED chip is encapsulated by injection moldingmethod; the outer pins of the LED are buckled; and the LED is detached from the connection base (305) to form an independent device.

10. 发明申请

WO2009052702A1 功率LED散热基板结构及由其制造的器件审中-公开
公开(公告)号：WO2009052702A1
公开(公告)日：2009-04-30
申请号：PCT/CN2008/001740
申请日：2008-10-15
申请人：佛山市国星光电股份有限公司 , 余彬海 , 李军政 , 夏勋力
发明人：余彬海 , 李军政 , 夏勋力
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： A structure of heat dissipation substrate for power LED and a device manufactured by it. The present invention overcomes the deficiencies of the complex structure, the difficulty of manufacturing process, the low productivity, the high cost and the unreliability of quality of the power LED product. The structure includes: the circuit board of integral construction which has counter bore and metal line, the counter bore has the structure of connected combination of two holes with different size. The small hole is a through hole and the large hole is a blind hole, the axis directions of the two holes are the same. The structure of the heat sink is an integral construction of trapezoidal column shape that is composed of an upper step and a lower step. The heat sink and the counter bore are correspondingly matched, and they are firmly fit with each other. A plurality of counter bores are setting on the circuit board, and the circuit board also includes a plurality of lines for positioning and cutting, and grooves and/or holes. An LED device manufactured by the structure of heat dissipating substrate, includes: heat sink, circuit board with the counter bore, LED IC, lead and encapsulation glue. The encapsulation glue covers the surface of the circuit board that has the IC and the lead, and retains the outer electrode, the encapsulation glue is both as an encapsulation layer for the IC and the lead, and as an integrated optical lens for the device.

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