基本信息:
- 专利标题: POWER MODULE
- 申请号:PCT/EP2022/068732 申请日:2022-07-06
- 公开(公告)号:WO2023285234A1 公开(公告)日:2023-01-19
- 发明人: SCHUETZ, Tobias , ASAM, Johann , RÖSNER, Robert
- 申请人: DANFOSS SILICON POWER GMBH
- 申请人地址: Husumer Strasse 251
- 专利权人: DANFOSS SILICON POWER GMBH
- 当前专利权人: DANFOSS SILICON POWER GMBH
- 当前专利权人地址: Husumer Strasse 251
- 代理机构: STEVENS, Brian
- 优先权: DE10 2021 117 924.6 2021-07-12
- 主分类号: H01L25/07
- IPC分类号: H01L25/07 ; H02M7/00 ; H01L23/00
摘要:
A power module is described comprising: a plurality of DC terminals at a first end of the power module for receiving a DC input, wherein the plurality of DC terminals comprise one or more positive DC terminals and one or more negative DC terminals; an AC terminal for providing an AC output; a plurality of first switching elements, electrically connected in parallel, wherein the first switching elements are provided in one or more lines running from the first end of the power module to a second end of the power module, opposite the first end, wherein the first switching elements selectively connect the one or more positive DC terminals to the AC terminal; a plurality of second switching elements, electrically connected in parallel, wherein the second switching elements are provided in one or more lines running from the first end to the second end of the power module, wherein the second switching elements selectively connect the one or more negative DC terminals to the AC terminal; and a first current diverting structure connecting one of the DC terminals at the first end and a first DC terminal point at or near the second end, such that current received at the respective DC terminal is directed to respective switching elements at or near the second end of the power module.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
--------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件,例如整流二极管的组装件 |
----------H01L25/04 | ..不具有单独容器的器件 |
------------H01L25/07 | ...包含在H01L29/00组类型的器件 |