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1. 发明申请

WO2023285234A1 POWER MODULE 审中-公开
公开(公告)号：WO2023285234A1
公开(公告)日：2023-01-19
申请号：PCT/EP2022/068732
申请日：2022-07-06
申请人： DANFOSS SILICON POWER GMBH
发明人： SCHUETZ, Tobias , ASAM, Johann , RÖSNER, Robert
IPC分类号： H01L25/07 , H02M7/00 , H01L23/00
摘要： A power module is described comprising: a plurality of DC terminals at a first end of the power module for receiving a DC input, wherein the plurality of DC terminals comprise one or more positive DC terminals and one or more negative DC terminals; an AC terminal for providing an AC output; a plurality of first switching elements, electrically connected in parallel, wherein the first switching elements are provided in one or more lines running from the first end of the power module to a second end of the power module, opposite the first end, wherein the first switching elements selectively connect the one or more positive DC terminals to the AC terminal; a plurality of second switching elements, electrically connected in parallel, wherein the second switching elements are provided in one or more lines running from the first end to the second end of the power module, wherein the second switching elements selectively connect the one or more negative DC terminals to the AC terminal; and a first current diverting structure connecting one of the DC terminals at the first end and a first DC terminal point at or near the second end, such that current received at the respective DC terminal is directed to respective switching elements at or near the second end of the power module.

2. 发明申请

WO2022229034A1 POWER MODULE WITH PARALLEL-SWITCHED SEMICONDUCTOR COMPONENTS 审中-公开
公开(公告)号：WO2022229034A1
公开(公告)日：2022-11-03
申请号：PCT/EP2022/060772
申请日：2022-04-22
申请人： DANFOSS SILICON POWER GMBH
发明人： SCHUETZ, Tobias , ROESNER, Robert , MANNMEUSEL, Guido , STRÖBEL-MAIER, Henning , DONG, Xiaoting , TATZIG, Lukas
IPC分类号： H01L25/07
摘要： Power semiconductor module (1) comprising two or more semiconductor components (3, 53, 55) which are electrically connected in parallel. The first power contacts (7) of each semiconductor component (3, 53, 55) are electrically connected to a first track (9). The second power contacts (11) of each semiconductor component (3, 53, 55) are electrically connected to a second track (13) by connecting means (15). The connecting means (15) comprises at least a first connecting element (17) connecting a first semiconductor component (53) of the two or more semiconductor components (3) to the second track (13) via a first contact area (19), and a second connecting element (21) connecting a second semiconductor component (55) of the two or more semiconductor components (3) with the second track (13) by a second contact area (23). The second connecting element (21) partially overlaps the first contact area (19) and/or first connecting element (17).

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