基本信息:
- 专利标题： レーザ加工システムおよびレーザ加工方法
- 专利标题（英）：LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD
- 申请号：PCT/JP2022/004657 申请日：2022-02-07
- 公开(公告)号：WO2022176671A1 公开(公告)日：2022-08-25
- 发明人： 小久保 英之 , 茂知野 英子
- 申请人： 株式会社アマダ
- 申请人地址： 〒2591196 神奈川県伊勢原市石田２００番地 Kanagawa
- 专利权人： 株式会社アマダ
- 当前专利权人： 株式会社アマダ
- 当前专利权人地址： 〒2591196 神奈川県伊勢原市石田２００番地 Kanagawa
- 代理机构： 三好 秀和
- 优先权： JP2021-024571 2021-02-18
- 主分类号： B23K26/00
- IPC分类号： B23K26/00 ; B23K26/02 ; B23K26/04
A laser processing system 1 comprises a laser processing device 60 and a marking device 20 that carries out preprocessing for laser processing. When a pallet on which a metal sheet is placed is mounted, the marking device 20 detects a misalignment amount between a predetermined placement reference position on the pallet and the position of the metal sheet on the pallet, calculates a correction value for correcting a marking processing performed position on the basis of the misalignment amount, corrects the performed position on the basis of the correction value, and performs marking processing. The laser processing device 60 obtains information on the correction value from the marking device 20, corrects the performed position on the basis of the obtained correction value, and performs laser processing on the metal sheet on the pallet after the marking processing is performed.
IPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K26/00 | 用激光束加工，例如焊接，切割，打孔 |