基本信息:
- 专利标题: 信号调制电路、方法及相关产品
- 专利标题(英):SIGNAL MODULATION CIRCUIT, METHOD AND RELATED PRODUCT
- 申请号:PCT/CN2021/103855 申请日:2021-06-30
- 公开(公告)号:WO2022002171A1 公开(公告)日:2022-01-06
- 发明人: 帅松林 , 张健 , 蔡华 , 王光健
- 申请人: 华为技术有限公司
- 申请人地址: 中国广东省深圳市龙岗区坂田华为总部办公楼, Guangdong 518129
- 专利权人: 华为技术有限公司
- 当前专利权人: 华为技术有限公司
- 当前专利权人地址: 中国广东省深圳市龙岗区坂田华为总部办公楼, Guangdong 518129
- 代理机构: 广州三环专利商标代理有限公司
- 优先权: CN202010615453.0 2020-06-30
- 主分类号: H04L27/00
- IPC分类号: H04L27/00 ; H04L27/20 ; H04L27/36
Provided in embodiments of the present application are a signal modulation circuit, method and related product. The circuit comprises: a first modulation unit, which is for receiving a first original carrier signal and a first modulation signal, and performing first modulation on the first original carrier signal according to the first modulation signal, so as to obtain a first carrier signal and/or a second carrier signal; and a second modulation unit, which is used for performing second modulation on the first carrier signal or the second carrier signal according to the first modulation signal, so as to obtain a first modulated signal, or performing third modulation on the first carrier signal or the second carrier signal according to the first modulation signal, so as to obtain a second modulated signal. By using the embodiments of the present application, the direct modulation of a millimeter wave can be achieved, and the architecture of a transmitter can be greatly simplified, power consumption of the transmitter is reduced, and chip implementation is facilitated.