基本信息:
- 专利标题: 固体撮像装置及び電子機器
- 专利标题(英):SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- 申请号:PCT/JP2020/041007 申请日:2020-11-02
- 公开(公告)号:WO2021100446A1 公开(公告)日:2021-05-27
- 发明人: 兼田 有希央 , 富樫 秀晃 , 古閑 史彦 , 定榮 正大 , 村田 賢一 , 平田 晋太郎 , 河合 信宏
- 申请人: ソニーセミコンダクタソリューションズ株式会社
- 申请人地址: 〒2430014 神奈川県厚木市旭町四丁目14番1号 Kanagawa
- 专利权人: ソニーセミコンダクタソリューションズ株式会社
- 当前专利权人: ソニーセミコンダクタソリューションズ株式会社
- 当前专利权人地址: 〒2430014 神奈川県厚木市旭町四丁目14番1号 Kanagawa
- 代理机构: 渡邊 薫
- 优先权: JP2019-209714 2019-11-20
- 主分类号: H01L21/3205
- IPC分类号: H01L21/3205 ; H01L21/768 ; H01L23/522 ; H01L27/146 ; H01L27/30 ; H04N5/369 ; H04N5/3745
Provided is a solid-state imaging device in which the image quality of the solid-state imaging device can be further improved. Provided is a solid-state imaging device comprising a semiconductor substrate, a first photoelectric conversion unit that is provided above the semiconductor substrate and converts light into electric charge, and a second photoelectric conversion unit that is provided above the first photoelectric conversion unit and converts light into electric charge. The first photoelectric conversion unit and the second photoelectric conversion unit each include at least a first electrode, a second electrode, and a photoelectric conversion film disposed between the first electrode and the second electrode. The first photoelectric conversion unit is electrically connected, via at least a penetrating conductive part, to the first electrode of the second photoelectric conversion unit and a charge storage unit formed on the semiconductor substrate, and an insulating film section is disposed in at least a portion of the outer periphery of the conductive part. The insulating film section is constituted by at least one layer of insulating film, and the at least one layer of insulating film has a fixed charge of the same type as the charge stored in the charge storage unit.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料 |
--------------H01L21/26 | ....用波或粒子辐射轰击的 |
----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的,例如腐蚀、抛光、切割 |
------------------H01L21/3205 | ......非绝缘层的沉积,例如绝缘层上的导电层、电阻层(器件内部的通电装置入H01L23/52);这些层的后处理 |