基本信息:
- 专利标题： ELECTRIC DEVICE WITH TWO OR MORE CHIP COMPONENTS
- 申请号：PCT/EP2018/081804 申请日：2018-11-19
- 公开(公告)号：WO2019115171A1 公开(公告)日：2019-06-20
- 发明人： HO, Shook Foong (Jessica) , HOO, See Jin (Desmond)
- 申请人： RF360 EUROPE GMBH
- 申请人地址： Anzinger Str. 13 81671 München DE
- 专利权人： RF360 EUROPE GMBH
- 当前专利权人： RF360 EUROPE GMBH
- 当前专利权人地址： Anzinger Str. 13 81671 München DE
- 代理机构： EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH
- 优先权： DE10 20171212
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H03H9/05 ; H01L23/13 ; H01L25/16 ; H01L25/18
摘要：
An electric device comprises a substrate (SU) as a carrier and at least two chip components mounted thereto. In the top surface of the substrate a recess (RC) is formed. One or more chip component (BC) is mounted to the bottom surface of the recess referred to as buried chip component. One or more top chip component (TC) is mounted to the top surface of the substrate to cover at least to some extend the recess and the buried chip component. Device pads (PD) are arranged on the bottom surface of the substrate. Each of them is electrically interconnected with one or both of the chip components.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/065 | ...包含在H01L27/00组类型的器件 |