基本信息:
- 专利标题： 熱伝導材料、熱伝導層付きデバイス、熱伝導材料形成用組成物、液晶性円盤状化合物
- 专利标题（英）：THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER, THERMALLY CONDUCTIVE MATERIAL FORMATION COMPOSITION, DISC-SHAPED LIQUID CRYSTAL COMPOUND
- 申请号：PCT/JP2018/026388 申请日：2018-07-12
- 公开(公告)号：WO2019013299A1 公开(公告)日：2019-01-17
- 发明人： 人見 誠一 , 高橋 慶太 , 新居 輝樹 , 吉田 有次
- 申请人： 富士フイルム株式会社
- 申请人地址： 〒1068620 東京都港区西麻布2丁目26番30号 Tokyo JP
- 专利权人： 富士フイルム株式会社
- 当前专利权人： 富士フイルム株式会社
- 当前专利权人地址： 〒1068620 東京都港区西麻布２丁目２６番３０号 Tokyo JP
- 代理机构： 渡辺 望稔
- 优先权： JP2017-138210 20170714; JP2017-252056 20171227
- 主分类号： C08G59/40
- IPC分类号： C08G59/40 ; C07C43/21 ; C07C43/23 ; C07C69/22 ; C07C69/773 ; C07C69/88 ; C07C69/92 ; C07C217/76 ; C07C261/02 ; C07C323/20 ; C07C323/36 ; C07C323/52 ; C07D271/06 ; C07D307/60 ; C07D413/14 ; C08K3/00 ; C08K3/28 ; C08K3/38 ; C08K5/00 ; C08L63/00 ; C09K5/14 ; H01L23/373 ; C09K19/38
The present invention provides a thermally conductive material that has excellent thermal conductivity. The present invention also provides: a device that is provided with a thermally conductive layer that includes the thermally conductive material; and a thermally conductive material formation composition that is used to form the thermally conductive material. The thermally conductive material includes a cured product of: a disc-shaped compound that has at least one reactive functional group selected from the group that consists of hydroxyl groups, carboxylic acid groups, carboxylic acid anhydride groups, amino groups, cyanate ester groups, and thiol groups; and a crosslinking compound that has a group that reacts with the reactive functional group.