基本信息:
- 专利标题: GRAPHITIC LINERS FOR INTEGRATED CIRCUIT DEVICES
- 申请号:PCT/US2016/068512 申请日:2016-12-23
- 公开(公告)号:WO2018118082A1 公开(公告)日:2018-06-28
- 发明人: SINGH, Kanwaljit , CHAWLA, Jasmeet S. , TORRES, Jessica M. , CAUDILLO, Roman , LIN, Kevin L. , MAESTRE CARO, Aranzazu
- 申请人: INTEL CORPORATION
- 申请人地址: 2200 Mission College Boulevard Santa Clara, California 95054-1549 US
- 专利权人: INTEL CORPORATION
- 当前专利权人: INTEL CORPORATION
- 当前专利权人地址: 2200 Mission College Boulevard Santa Clara, California 95054-1549 US
- 代理机构: ZAGER, Laura A.
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L29/16 ; H01L21/02
摘要:
Disclosed herein are graphitic liners for integrated circuit (IC) devices, as well as related devices and methods. For example, disclosed herein are liners that include graphene having a quality gradient, multi-layer liners (e.g., including metal and graphene layers), and liners that line the sidewalls of a via while leaving a bottom of the via open for direct contact with a lower conductive structure.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
------------H01L21/768 | ...利用互连在器件中的分离元件间传输电流 |