基本信息:
- 专利标题: GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY
- 专利标题(中):上下球栅阵列的重力补偿板
- 申请号:PCT/IB2017/001325 申请日:2017-09-15
- 公开(公告)号:WO2018055451A1 公开(公告)日:2018-03-29
- 发明人: CHAN, Alex , BROWN, Paul James , DAMICO, Robert
- 申请人: ALCATEL LUCENT
- 申请人地址: 148/152 Route de la Reine 92100 Boulogne-Billancourt FR
- 专利权人: ALCATEL LUCENT
- 当前专利权人: ALCATEL LUCENT
- 当前专利权人地址: 148/152 Route de la Reine 92100 Boulogne-Billancourt FR
- 代理机构: BERTHIER, Karine
- 优先权: US62/397,140 20160920; US15/659,258 20170725
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; H05K13/04 ; H05K3/30
摘要:
An apparatus configured to temporarily support a Ball Grid Array (BGA) component (120) against a printed circuit board (PCB) (310) during a manufacturing reflow operation, the apparatus including a support plate (205) sized to fit over the BGA and having one or more mounting holes external to the periphery of the Ball Grid Array component, a retaining member (330) for each mounting hole, passing through said mounting hole, a resilient biasing member (335) for each retaining member, wherein the resilient biasing member urges the support plate against the BGA component from below the BGA component such that the BGA component is urged against the PCB.
摘要(中):
配置成在制造回流操作期间将球栅阵列(BGA)部件(120)临时支撑在印刷电路板(PCB)(310)上的装置,所述装置包括支撑板(205) ),其尺寸适合于BGA并且在球栅阵列部件的外围具有一个或多个安装孔,用于每个安装孔的保持构件(330),穿过所述安装孔,弹性偏置构件(335),用于 每个保持构件,其中所述弹性偏置构件将所述支撑板从所述BGA部件的下方推压抵靠所述BGA部件,使得所述BGA部件抵靠所述PCB。 p>
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上,而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
----------H05K3/32 | ..电元件或导线与印刷电路的电连接 |
------------H05K3/34 | ...通过焊接的 |