基本信息:
- 专利标题： SPUTTERING ARRANGEMENT FOR SPUTTERING A MATERIAL ON A SUBSTRATE SURFACE
- 专利标题（中）：用于在基材表面上溅射材料的溅射装置
- 申请号：PCT/EP2014/056709 申请日：2014-04-03
- 公开(公告)号：WO2015149857A1 公开(公告)日：2015-10-08
- 发明人： DIETER, Torsten
- 申请人： APPLIED MATERIALS, INC. , DIETER, Torsten
- 申请人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 专利权人： APPLIED MATERIALS, INC.,DIETER, Torsten
- 当前专利权人： APPLIED MATERIALS, INC.,DIETER, Torsten
- 当前专利权人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 代理机构： ZIMMERMANN & PARTNER
- 主分类号： C23C14/22
- IPC分类号： C23C14/22 ; C23C14/54 ; C23C14/56 ; H01J37/34
摘要：
A sputtering arrangement for sputtering a material on a substrate surface is provided. The sputtering arrangement includes at least one sputtering cathode having a first end portion and a second end portion, wherein the sputtering cathode extends along a first axis, at least one substrate support configured to support the substrate and arranged opposite the at least one sputtering cathode, wherein the substrate support extends along a second axis, and wherein the second axis forms a first angle with the first axis, and at least one actuation device connectable to the at least one sputtering cathode, particularly to the first end portion and/or the second end portion. The at least one actuation device is configured to change the first angle, particularly during a sputtering process.
摘要（中）：
提供了用于在衬底表面上溅射材料的溅射装置。 溅射装置包括至少一个具有第一端部和第二端部的溅射阴极，其中溅射阴极沿着第一轴线延伸，至少一个衬底支撑件构造成支撑衬底并且布置成与至少一个溅射阴极相对， 其中所述衬底支撑件沿着第二轴线延伸，并且其中所述第二轴线与所述第一轴线形成第一角度;以及至少一个致动装置，其可连接到所述至少一个溅射阴极，特别是与所述第一端部部分和/ 端部。 所述至少一个致动装置被配置为改变第一角度，特别是在溅射过程期间。