发明申请
WO2011145920A1 SEMICONDUCTOR CHIP AND SUBSTRATE TRANSFER/PROCESSING TUNNEL -ARRANGEMENT EXTENDING IN A LINEAR DIRECTION
审中-公开
基本信息:
- 专利标题： SEMICONDUCTOR CHIP AND SUBSTRATE TRANSFER/PROCESSING TUNNEL -ARRANGEMENT EXTENDING IN A LINEAR DIRECTION
- 专利标题（中）：半导体芯片和基板传输/加工隧道扩展线性方向
- 申请号：PCT/NL2010/000083 申请日：2010-05-18
- 公开(公告)号：WO2011145920A1 公开(公告)日：2011-11-24
- 发明人： BOK, Edward
- 申请人： BOK, Edward
- 申请人地址： Birdielaan 64 NL-8241 BC Lelystad NL
- 专利权人： BOK, Edward
- 当前专利权人： BOK, Edward
- 当前专利权人地址： Birdielaan 64 NL-8241 BC Lelystad NL
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; H01L21/00
摘要：
The invention is related to a semiconductor chip, at-least also accomplished in a semiconductor installation, containing at-least also a long, relatively narrow semiconductor substrate transfer/processing tunnel-arrangement, wherein during its operation at-least also the taking place of successive semiconductor processings of the successive, typically uninterruptedly displacing semiconductor substrate-sections there through and whereby in a device behind its exit by means of dividing these successive semiconductor substrate-sections the accomplishing thereof.
摘要（中）：
本发明涉及一种半导体芯片，至少在半导体设备中也是实现的，该半导体芯片至少还包含长而相对较窄的半导体衬底传送/处理隧道布置，其中在其运行期间至少也取代 连续的，通常不间断地移位的半导体衬底部分的连续的半导体处理通过这些相继的半导体衬底部分实现，在其出口之后的器件中通过不间断地移位。