发明申请
US20230063907A1 SUBSTRATE CLEANING METHOD, PROCESSING CONTAINER CLEANING METHOD, AND SUBSTRATE PROCESSING DEVICE
有权
基本信息:
- 专利标题： SUBSTRATE CLEANING METHOD, PROCESSING CONTAINER CLEANING METHOD, AND SUBSTRATE PROCESSING DEVICE
- 申请号：US18048102 申请日：2022-10-20
- 公开(公告)号：US20230063907A1 公开(公告)日：2023-03-02
- 发明人： Kyoko IKEDA , Kazuya DOBASHI , Tsunenaga NAKASHIMA , Kenji SEKIGUCHI , Shuuichi NISHIKIDO , Masato NAKAJO , Takahiro YASUTAKE
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 优先权： JP2018-225669 20181130
- 主分类号： B08B5/02
- IPC分类号： B08B5/02
摘要：
A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.
公开/授权文献:
IPC结构图谱:
| B | 作业；运输 |
| --B08 | 清洁 |
| ----B08B | 一般清洁；一般污垢的防除 |
| ------B08B5/00 | 利用空气流动或气体流动的清洁方法 |
| --------B08B5/02 | .用喷气力来清洁，如吹清凹处 |