
基本信息:
- 专利标题: SEMICONDUCTOR APPARATUS AND METHOD OF COLLECTING RESIDUES
- 申请号:US17395435 申请日:2021-08-05
- 公开(公告)号:US20230038785A1 公开(公告)日:2023-02-09
- 发明人: Ping-Cheng Lin , Pin-Yi Hsin , Ching Shun Lee , Bo-Han Huang , Cheng-Tsung Tu
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L21/673
- IPC分类号: H01L21/673 ; H01L21/67 ; H01L21/677
摘要:
A semiconductor apparatus and a method for collecting residues of curable material are provided. The semiconductor apparatus includes a chamber containing a wafer cassette, and a collecting module disposed in the chamber for collecting residues of curable material in the chamber. The collecting module includes a flow-directing structure disposed below a ceiling of the chamber, a baffle structure disposed below the flow-directing structure, and a tray disposed on the wafer cassette. The flow-directing structure includes a first hollow region, the baffle structure includes a second hollow region, and the tray is moved together with the wafer cassette to pass through the second hollow region of the baffle structure and is positioned to cover the first hollow region of the flow-directing structure.
公开/授权文献:
- US12217989B2 Semiconductor apparatus and method of collecting residues 公开/授权日:2025-02-04