基本信息:
- 专利标题： ADDITIVE MANUFACTURING OF POLISHING PADS
- 申请号：US18124529 申请日：2023-03-21
- 公开(公告)号：US20230219190A1 公开(公告)日：2023-07-13
- 发明人： Uma Sridhar , Sivapackia Ganapathiappan , Ashwin Murugappan Chockalingam , Mayu Felicia Yamamura , Daniel Redfield , Rajeev Bajaj , Yingdong Luo , Nag B. Patibandla
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： B24B37/24
- IPC分类号： B24B37/24 ; B24B37/22 ; B33Y80/00 ; B33Y70/00
摘要：
Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
IPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B37/00 | 研磨机床或装置，即需要在相对软但仍为刚性的研具和被研磨表面之间加入粉末状磨料；及其附件 |
| --------B24B37/005 | .研磨机床或装置的控制装置 |
| ----------B24B37/12 | ..用于加工平面的研磨片 |
| ------------B24B37/24 | ...以垫的材料成分或特性为特征 |