基本信息:
- 专利标题： PROCESS KIT FOR A SUBSTRATE SUPPORT
- 申请号：US17861324 申请日：2022-07-11
- 公开(公告)号：US20220344134A1 公开(公告)日：2022-10-27
- 发明人： Muhannad MUSTAFA , Muhammad M. RASHEED , Yu LEI , Avgerinos V. GELATOS , Vikash BANTHIA , Victor H. CALDERON , Shi Wei TOH , Yung-Hsin LEE , Anindita SEN
- 申请人： Muhannad MUSTAFA , Muhammad M. RASHEED , Yu LEI , Avgerinos V. GELATOS , Vikash BANTHIA , Victor H. CALDERON , Shi Wei TOH , Yung-Hsin LEE , Anindita SEN
- 申请人地址： US CA Santa Clara; US CA San Jose; US CA Belmont; US CA Scotts Valley; US CA Los Altos; US CA Sunnyvale; US CA Sunnyvale; US CA San Jose; US CA San Jose
- 专利权人： Muhannad MUSTAFA,Muhammad M. RASHEED,Yu LEI,Avgerinos V. GELATOS,Vikash BANTHIA,Victor H. CALDERON,Shi Wei TOH,Yung-Hsin LEE,Anindita SEN
- 当前专利权人： Muhannad MUSTAFA,Muhammad M. RASHEED,Yu LEI,Avgerinos V. GELATOS,Vikash BANTHIA,Victor H. CALDERON,Shi Wei TOH,Yung-Hsin LEE,Anindita SEN
- 当前专利权人地址： US CA Santa Clara; US CA San Jose; US CA Belmont; US CA Scotts Valley; US CA Los Altos; US CA Sunnyvale; US CA Sunnyvale; US CA San Jose; US CA San Jose
- 主分类号： H01J37/32
- IPC分类号： H01J37/32
摘要：
Methods and apparatus for processing substrates are provided herein. In some embodiments, a process kit for a substrate support includes: an upper edge ring made of quartz and having an upper surface and a lower surface, wherein the upper surface is substantially planar and the lower surface includes a stepped lower surface to define a radially outermost portion and a radially innermost portion of the upper edge ring.